BEGIN:VCALENDAR VERSION:2.0 PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://hdpusergroup.org X-WR-CALDESC:Events for HDP User Group REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20210314T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20211107T070000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART:20210519T150000Z DTEND:20210519T160000Z DTSTAMP:20260511T094606 CREATED:20210504T123115Z LAST-MODIFIED:20210504T123115Z UID:19780-1621418400-1621422000@hdpusergroup.org SUMMARY:Backdrill Under BGA telecom DESCRIPTION:Backdrill Under BGA telecom URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-20/ CATEGORIES:Backdrill Under BGA ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210519T140000Z DTEND:20210519T150000Z DTSTAMP:20260511T094606 CREATED:20210519T040959Z LAST-MODIFIED:20210519T040959Z UID:19826-1621414800-1621418400@hdpusergroup.org SUMMARY:Review “Solder Joint Reliability with Surface Finishes” Project DESCRIPTION:Review “Solder Joint Reliability with Surface Finishes” Project \n\n\nMeeting Information\n\n\n\nMeeting link:\nhttps://hdpug.webex.com/hdpug/j.php?MTID=mb10110a7d838fc9ba4ae166c5d1eaed9\nMeeting number:\n182 291 9388\nPassword:\npass123\n URL:https://hdpusergroup.org/event/review-solder-joint-reliability-with-surface-finishes-project/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210518T190000Z DTEND:20210518T200000Z DTSTAMP:20260511T094606 CREATED:20210519T040653Z LAST-MODIFIED:20210519T040653Z UID:19879-1621346400-1621350000@hdpusergroup.org SUMMARY:Photonic Soldering DESCRIPTION:Quarterly presentations URL:https://hdpusergroup.org/event/photonic-soldering-31/ CATEGORIES:Photonic Soldering ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210518T160000Z DTEND:20210518T170000Z DTSTAMP:20260511T094606 CREATED:20210512T140429Z LAST-MODIFIED:20210512T140429Z UID:19813-1621335600-1621339200@hdpusergroup.org SUMMARY:Automotive Strategy Mtg DESCRIPTION:Meeting to get in sink URL:https://hdpusergroup.org/event/automotive-strategy-mtg/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210518T160000Z DTEND:20210518T170000Z DTSTAMP:20260511T094606 CREATED:20210510T163222Z LAST-MODIFIED:20210510T163222Z UID:19798-1621335600-1621339200@hdpusergroup.org SUMMARY:Reliability and Power Cycles telecom DESCRIPTION:Reliability and Power Cycles telecom URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-18/ CATEGORIES:Reliability and Power Cycles ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210518T150000Z DTEND:20210518T160000Z DTSTAMP:20260511T094606 CREATED:20210421T142154Z LAST-MODIFIED:20210421T142154Z UID:19686-1621332000-1621335600@hdpusergroup.org SUMMARY:CAF Eq DESCRIPTION:Project update \nQuarterly report URL:https://hdpusergroup.org/event/caf-eq-2/ CATEGORIES:Better CAF Acceleration Equation ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210517T150000Z DTEND:20210517T160000Z DTSTAMP:20260511T094606 CREATED:20210415T152456Z LAST-MODIFIED:20210415T152456Z UID:19630-1621245600-1621249200@hdpusergroup.org SUMMARY:ECM2 Project call DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/ecm2-project-call-26/ CATEGORIES:Electro-Chemical Migration 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210514T150000Z DTEND:20210514T160000Z DTSTAMP:20260511T094606 CREATED:20210427T122621Z LAST-MODIFIED:20210427T122621Z UID:19718-1620986400-1620990000@hdpusergroup.org SUMMARY:Ultra Low Dk glass Telecom DESCRIPTION:Ultra Low Dk glass Telecom URL:https://hdpusergroup.org/event/ultra-low-dk-glass-telecom-8/ CATEGORIES:Glass Weave ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210512T170000Z DTEND:20210512T180000Z DTSTAMP:20260511T094606 CREATED:20210428T165741Z LAST-MODIFIED:20210428T165741Z UID:19745-1620820800-1620824400@hdpusergroup.org SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads/ CATEGORIES:Single Surface Finish for Soldered & Compression ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210511T170000Z DTEND:20210511T180000Z DTSTAMP:20260511T094606 CREATED:20210429T162335Z LAST-MODIFIED:20210429T162335Z UID:19777-1620734400-1620738000@hdpusergroup.org SUMMARY:Harsh Use Alloy Eval2 Project Call DESCRIPTION:Project Review Call \n  \nMeeting Logistics: \nMeeting link:https://hdpug.webex.com/hdpug/j.php?MTID=m07eae7a2772790e0d14ef8067dcac71d Meeting number:182 265 0602Password:qmH8bFR3zs5 URL:https://hdpusergroup.org/event/harsh-use-alloy-eval2-project-call/ CATEGORIES:Harsh Use Alloy Evaluation 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210511T170000Z DTEND:20210511T180000Z DTSTAMP:20260511T094606 CREATED:20210420T174045Z LAST-MODIFIED:20210420T174045Z UID:19683-1620734400-1620738000@hdpusergroup.org SUMMARY:DISC2A DESCRIPTION:Hua's new results URL:https://hdpusergroup.org/event/disc2a-26/ CATEGORIES:Digital Speckle Correlation (DSC) 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210510T150000Z DTEND:20210510T160000Z DTSTAMP:20260511T094606 CREATED:20210427T121420Z LAST-MODIFIED:20210427T121420Z UID:19717-1620640800-1620644400@hdpusergroup.org SUMMARY:Reliability and Power Cycles telecom DESCRIPTION:Reliability and Power Cycles telecom URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-17/ CATEGORIES:Reliability and Power Cycles ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210507T140000Z DTEND:20210507T150000Z DTSTAMP:20260511T094606 CREATED:20210423T083819Z LAST-MODIFIED:20210423T083819Z UID:19689-1620378000-1620381600@hdpusergroup.org SUMMARY:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting DESCRIPTION:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cycles-to-failure-at-ist-project-meeting/ CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210506T180000Z DTEND:20210506T190000Z DTSTAMP:20260511T094606 CREATED:20210426T191508Z LAST-MODIFIED:20210426T191508Z UID:19707-1620306000-1620309600@hdpusergroup.org SUMMARY:HDP Cu Peel Strength P2 project May 6\, 2021 meeting DESCRIPTION:HDP Cu Peel Strength P2 project May 6\, 2021 meeting URL:https://hdpusergroup.org/event/hdp-cu-peel-strength-p2-project-may-6-2021-meeting/ LOCATION:WebEx CATEGORIES:Cu Peel Strength 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210506T140000Z DTEND:20210506T150000Z DTSTAMP:20260511T094606 CREATED:20210204T142536Z LAST-MODIFIED:20210204T142536Z UID:19200-1620291600-1620295200@hdpusergroup.org SUMMARY:PFH Technology 2 Project Call DESCRIPTION:PFH Technology 2 Project Call URL:https://hdpusergroup.org/event/pfh-technology-2-project-call/ CATEGORIES:PFH Technology 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210505T200000Z DTEND:20210505T210000Z DTSTAMP:20260511T094606 CREATED:20210428T201927Z LAST-MODIFIED:20210428T201927Z UID:19749-1620226800-1620230400@hdpusergroup.org SUMMARY:Photonic Soldering DESCRIPTION:Final Report \nScope of new project URL:https://hdpusergroup.org/event/photonic-soldering-30/ CATEGORIES:Photonic Soldering ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210505T160000Z DTEND:20210505T170000Z DTSTAMP:20260511T094606 CREATED:20210426T224244Z LAST-MODIFIED:20210426T224244Z UID:19714-1620212400-1620216000@hdpusergroup.org SUMMARY:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting DESCRIPTION:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting URL:https://hdpusergroup.org/event/thermal-analysis-methodology-evaluation-may-5-2021-project-meeting/ LOCATION:WebEx CATEGORIES:Thermal Analysis Methodolgy Assessment ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210505T150000Z DTEND:20210505T160000Z DTSTAMP:20260511T094606 CREATED:20210414T153753Z LAST-MODIFIED:20210414T153753Z UID:19626-1620208800-1620212400@hdpusergroup.org SUMMARY:Materials #6 meeting DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/materials-6-meeting-3/ CATEGORIES:Lead Free PWB Materials Reliability Phase 6 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210504T200000Z DTEND:20210504T210000Z DTSTAMP:20260511T094606 CREATED:20210428T210649Z LAST-MODIFIED:20210428T210649Z UID:19750-1620140400-1620144000@hdpusergroup.org SUMMARY:PCB Feature Min. DESCRIPTION:Somacis \nInfo Kevin needs \n  URL:https://hdpusergroup.org/event/pcb-feature-min-7/ CATEGORIES:PCB Feature Miniaturization ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20210504T190000Z DTEND:20210504T200000Z DTSTAMP:20260511T094606 CREATED:20210419T204337Z LAST-MODIFIED:20210419T204337Z UID:19671-1620136800-1620140400@hdpusergroup.org SUMMARY:Board Thickness II DESCRIPTION:Dr Lu's progress \n