BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210709T150000Z
DTEND:20210709T160000Z
DTSTAMP:20260510T180433
CREATED:20210630T225641Z
LAST-MODIFIED:20210630T225641Z
UID:20152-1625824800-1625828400@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project
DESCRIPTION:Project status review. 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210702T160000Z
DTEND:20210702T170000Z
DTSTAMP:20260510T180433
CREATED:20210618T170041Z
LAST-MODIFIED:20210618T170041Z
UID:20100-1625223600-1625227200@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-23/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210702T150000Z
DTEND:20210702T160000Z
DTSTAMP:20260510T180433
CREATED:20210618T170446Z
LAST-MODIFIED:20210618T170446Z
UID:20098-1625220000-1625223600@hdpusergroup.org
SUMMARY:Tech. Direction telecom
DESCRIPTION:Tech. Direction telecom 
URL:https://hdpusergroup.org/event/tech-direction-telecom/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T180000Z
DTEND:20210701T190000Z
DTSTAMP:20260510T180433
CREATED:20210621T164952Z
LAST-MODIFIED:20210621T164952Z
UID:20105-1625144400-1625148000@hdpusergroup.org
SUMMARY:Cu Peel Strength July 1\, 2021 project meeting
DESCRIPTION:Cu Peel Strength July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T160000Z
DTEND:20210701T170000Z
DTSTAMP:20260510T180433
CREATED:20210621T164614Z
LAST-MODIFIED:20210621T164614Z
UID:20104-1625137200-1625140800@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T150000Z
DTEND:20210701T160000Z
DTSTAMP:20260510T180433
CREATED:20210617T155605Z
LAST-MODIFIED:20210617T155605Z
UID:20091-1625133600-1625137200@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-4/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T000000Z
DTEND:20210701T010000Z
DTSTAMP:20260510T180433
CREATED:20210615T143136Z
LAST-MODIFIED:20210615T143136Z
UID:20078-1625079600-1625083200@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Review latest test results 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-14/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210630T170000Z
DTEND:20210630T180000Z
DTSTAMP:20260510T180433
CREATED:20210524T192101Z
LAST-MODIFIED:20210524T192101Z
UID:19962-1625054400-1625058000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of June 30\, 2021
DESCRIPTION: Low Ag Alloy Solder paste BGA leg project meeting of June 30\, 2021
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-june-30-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210630T160000Z
DTEND:20210630T170000Z
DTSTAMP:20260510T180433
CREATED:20210621T170522Z
LAST-MODIFIED:20210621T170522Z
UID:20107-1625050800-1625054400@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Evaluation June 30\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Evaluation June 30\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-evaluation-june-30-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210630T150000Z
DTEND:20210630T160000Z
DTSTAMP:20260510T180433
CREATED:20210609T160101Z
LAST-MODIFIED:20210609T160101Z
UID:20054-1625047200-1625050800@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-6/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210629T200000Z
DTEND:20210629T210000Z
DTSTAMP:20260510T180433
CREATED:20210615T205504Z
LAST-MODIFIED:20210615T205504Z
UID:20080-1624978800-1624982400@hdpusergroup.org
SUMMARY:PCB Feature Miniaturization
DESCRIPTION:Going to Implementation 
URL:https://hdpusergroup.org/event/pcb-feature-miniaturization-5/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210629T180000Z
DTEND:20210629T190000Z
DTSTAMP:20260510T180433
CREATED:20210609T172611Z
LAST-MODIFIED:20210609T172611Z
UID:20065-1624971600-1624975200@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:News from Omar and Richard. 
URL:https://hdpusergroup.org/event/board-thickness-ii-20/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210629T010000Z
DTEND:20210629T020000Z
DTSTAMP:20260510T180433
CREATED:20210621T035743Z
LAST-MODIFIED:20210621T035743Z
UID:19734-1624910400-1624914000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-6/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210628T150000Z
DTEND:20210628T160000Z
DTSTAMP:20260510T180433
CREATED:20210616T142712Z
LAST-MODIFIED:20210616T142712Z
UID:20087-1624874400-1624878000@hdpusergroup.org
SUMMARY:Reliability and Power Cycles
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-5/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210625T150000Z
DTEND:20210625T160000Z
DTSTAMP:20260510T180433
CREATED:20210617T163731Z
LAST-MODIFIED:20210617T163731Z
UID:20096-1624615200-1624618800@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Review
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-review/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210625T150000Z
DTEND:20210625T160000Z
DTSTAMP:20260510T180433
CREATED:20210617T163211Z
LAST-MODIFIED:20210617T163211Z
UID:20095-1624615200-1624618800@hdpusergroup.org
SUMMARY:Ultr-Low Dk Glass
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/ultr-low-dk-glass/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210625T140000Z
DTEND:20210625T150000Z
DTSTAMP:20260510T180433
CREATED:20210625T134341Z
LAST-MODIFIED:20210625T134341Z
UID:20023-1624611600-1624615200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST
DESCRIPTION:Effects of Plating Thickness on CTF at IST 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210624T200000Z
DTEND:20210624T210000Z
DTSTAMP:20260510T180433
CREATED:20210622T152019Z
LAST-MODIFIED:20210622T152019Z
UID:20116-1624546800-1624550400@hdpusergroup.org
SUMMARY:Photosoldering II
DESCRIPTION:Continuing our discussion 
URL:https://hdpusergroup.org/event/photosoldering-ii/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210624T200000Z
DTEND:20210624T210000Z
DTSTAMP:20260510T180433
CREATED:20210611T122541Z
LAST-MODIFIED:20210611T122541Z
UID:20067-1624546800-1624550400@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Move from Idea to Definition? 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-3/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210624T180000Z
DTEND:20210624T190000Z
DTSTAMP:20260510T180433
CREATED:20210608T194631Z
LAST-MODIFIED:20210608T194631Z
UID:20048-1624539600-1624543200@hdpusergroup.org
SUMMARY:ECM 2 project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-6/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210624T140000Z
DTEND:20210624T150000Z
DTSTAMP:20260510T180433
CREATED:20210506T150936Z
LAST-MODIFIED:20210506T150936Z
UID:19788-1624525200-1624528800@hdpusergroup.org
SUMMARY:PFH Technology Phase 2 Project Call
DESCRIPTION:PFH Technology Phase 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-phase-2-project-call-4/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210623T140000Z
DTEND:20210623T150000Z
DTSTAMP:20260510T180433
CREATED:20210824T222503Z
LAST-MODIFIED:20210824T222503Z
UID:19809-1624438800-1624442400@hdpusergroup.org
SUMMARY:Key High-Density Design Considerations for High-Reliability 5G Radio Access Network (RAN) Webinar
DESCRIPTION:  \nThe advent of 5G promises gigabit per second mobile network access using large deployments of small cells and traditional towers. The use of millimeter wave spectrum bands and massive MIMO introduce new product packaging challenges. As operators seek to optimize performance versus total cost of ownership by deploying virtualized radio access networks (RAN)\, including the adoption of OpenRAN\, a close examination of product design considerations is warranted. \nThis webinar addresses the challenges posed by the 5G network evolution and key printed circuit assembly design considerations for high-density\, high-reliability radio units. The topics include: \n·         RAN deployment and support challenges. \n·         Product design considerations. \nSpeakers:\n·         OEM Perspective: Charlie Martin\, RAN Product Management\, Dell Technologies \n·         Host: Madan Jagernauth\, Marketing Director\, High Density Packaging User Group \nSchedule:\n·         Date:                                     June 23\, 2021 \n·         Time:                                     10:00 am EDT\, 9:00 am CDT\, 7:00 am PDT \n·         Duration:                             1 hour
URL:https://hdpusergroup.org/event/key-high-density-design-considerations-for-high-reliability-5g-radio-access-network-ran-webinar/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210622T170000Z
DTEND:20210622T180000Z
DTSTAMP:20260510T180433
CREATED:20210617T160624Z
LAST-MODIFIED:20210617T160624Z
UID:20094-1624363200-1624366800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval Project Review
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-project-review/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210622T160000Z
DTEND:20210622T170000Z
DTSTAMP:20260510T180433
CREATED:20210608T152423Z
LAST-MODIFIED:20210608T152423Z
UID:20040-1624359600-1624363200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer copper balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-9/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210622T150000Z
DTEND:20210622T160000Z
DTSTAMP:20260510T180433
CREATED:20210519T052221Z
LAST-MODIFIED:20210519T052221Z
UID:19856-1624356000-1624359600@hdpusergroup.org
SUMMARY:Better CAF EQ
DESCRIPTION:Project progress 
URL:https://hdpusergroup.org/event/better-caf-eq-10/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210619T130000Z
DTEND:20210619T140000Z
DTSTAMP:20260510T180433
CREATED:20210615T042306Z
LAST-MODIFIED:20210615T042306Z
UID:20077-1624089600-1624093200@hdpusergroup.org
SUMMARY:Caffeine test
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/caffeine-test/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210618T160000Z
DTEND:20210618T170000Z
DTSTAMP:20260510T180433
CREATED:20210605T134059Z
LAST-MODIFIED:20210605T134059Z
UID:20024-1624014000-1624017600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-22/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210618T150000Z
DTEND:20210618T160000Z
DTSTAMP:20260510T180433
CREATED:20210609T180652Z
LAST-MODIFIED:20210609T180652Z
UID:20025-1624010400-1624014000@hdpusergroup.org
SUMMARY:Technology Direction telecom
DESCRIPTION:Technology Direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210617T150000Z
DTEND:20210617T160000Z
DTSTAMP:20260510T180433
CREATED:20210602T174029Z
LAST-MODIFIED:20210602T174029Z
UID:20017-1623924000-1623927600@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-3/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T180000Z
DTEND:20210616T190000Z
DTSTAMP:20260510T180433
CREATED:20210609T165509Z
LAST-MODIFIED:20210609T165509Z
UID:20055-1623848400-1623852000@hdpusergroup.org
SUMMARY:Glass Type Composition June 16\, 2021 meeting
DESCRIPTION:Glass Type Composition June 16\, 2021 meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-june-16-2021-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR