BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210813T140000Z
DTEND:20210813T150000Z
DTSTAMP:20260510T073845
CREATED:20210825T225518Z
LAST-MODIFIED:20210825T225518Z
UID:20226-1628845200-1628848800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-3/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T180000Z
DTEND:20210811T190000Z
DTSTAMP:20260510T073845
CREATED:20210715T223535Z
LAST-MODIFIED:20210715T223535Z
UID:20225-1628686800-1628690400@hdpusergroup.org
SUMMARY:Glass Type Comparison project meeting of Aug 11\, 2021
DESCRIPTION:Glass Type Comparison project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T170000Z
DTEND:20210811T180000Z
DTSTAMP:20260510T073845
CREATED:20210730T200740Z
LAST-MODIFIED:20210730T200740Z
UID:20289-1628683200-1628686800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021
DESCRIPTION:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T160000Z
DTEND:20210811T170000Z
DTSTAMP:20260510T073845
CREATED:20210810T194812Z
LAST-MODIFIED:20210810T194812Z
UID:20292-1628679600-1628683200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-aug-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210810T190000Z
DTEND:20210810T200000Z
DTSTAMP:20260510T073845
CREATED:20210804T211602Z
LAST-MODIFIED:20210804T211602Z
UID:20306-1628604000-1628607600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:More work on defining the project 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-5/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210810T180000Z
DTEND:20210810T190000Z
DTSTAMP:20260510T073845
CREATED:20210629T184855Z
LAST-MODIFIED:20210629T184855Z
UID:20146-1628600400-1628604000@hdpusergroup.org
SUMMARY:Board thickness II
DESCRIPTION:Any results from Omar adding other variables to his models? 
URL:https://hdpusergroup.org/event/board-thickness-ii-21/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210809T160000Z
DTEND:20210809T170000Z
DTSTAMP:20260510T073845
CREATED:20210803T125351Z
LAST-MODIFIED:20210803T125351Z
UID:20301-1628506800-1628510400@hdpusergroup.org
SUMMARY:Backdrill Under BGA
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-9/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210806T150000Z
DTEND:20210806T160000Z
DTSTAMP:20260510T073845
CREATED:20210730T134811Z
LAST-MODIFIED:20210730T134811Z
UID:20281-1628244000-1628247600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Review
DESCRIPTION:Regular Project call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-review-3/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210806T000000Z
DTEND:20210806T010000Z
DTSTAMP:20260510T073845
CREATED:20210722T151743Z
LAST-MODIFIED:20210722T151743Z
UID:20255-1628190000-1628193600@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive - project call
DESCRIPTION:Project call to review TC results 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-16/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210805T150000Z
DTEND:20210805T160000Z
DTSTAMP:20260510T073845
CREATED:20210712T154720Z
LAST-MODIFIED:20210712T154720Z
UID:20200-1628157600-1628161200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-22/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210805T140000Z
DTEND:20210805T150000Z
DTSTAMP:20260510T073845
CREATED:20210722T154206Z
LAST-MODIFIED:20210722T154206Z
UID:20256-1628154000-1628157600@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-6/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210803T183000Z
DTEND:20210803T193000Z
DTSTAMP:20260510T073845
CREATED:20210803T150110Z
LAST-MODIFIED:20210803T150110Z
UID:20302-1627997400-1628001000@hdpusergroup.org
SUMMARY:Call with Brian Amos
DESCRIPTION:Call to discuss  \n\nMailing lists\nMeetings\nI would like to add Jack Frankosky from Chemours\, jack.frankosky@chemours.com\nLog in details\nAccess to projects\n
URL:https://hdpusergroup.org/event/call-with-brian-amos/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210803T170000Z
DTEND:20210803T180000Z
DTSTAMP:20260510T073845
CREATED:20210730T134306Z
LAST-MODIFIED:20210730T134306Z
UID:20280-1627992000-1627995600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Project Call
DESCRIPTION:Regular project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-project-call-6/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210730T150000Z
DTEND:20210730T160000Z
DTSTAMP:20260510T073845
CREATED:20210717T123956Z
LAST-MODIFIED:20210717T123956Z
UID:20242-1627639200-1627642800@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-25/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T200000Z
DTEND:20210729T210000Z
DTSTAMP:20260510T073845
CREATED:20210714T114349Z
LAST-MODIFIED:20210714T114349Z
UID:20205-1627570800-1627574400@hdpusergroup.org
SUMMARY:Photo solder II
DESCRIPTION:Further defining the project 
URL:https://hdpusergroup.org/event/photo-solder-ii/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T180000Z
DTEND:20210729T190000Z
DTSTAMP:20260510T073845
CREATED:20210715T205022Z
LAST-MODIFIED:20210715T205022Z
UID:20211-1627563600-1627567200@hdpusergroup.org
SUMMARY:Cu Peel Strength July 29\, 2021 project meeting
DESCRIPTION:Cu Peel Strength July 29\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-29-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T160000Z
DTEND:20210729T170000Z
DTSTAMP:20260510T073845
CREATED:20210715T221453Z
LAST-MODIFIED:20210715T221453Z
UID:20222-1627556400-1627560000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss July 29\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment vs Loss July 29\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-29-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210729T150000Z
DTEND:20210729T160000Z
DTSTAMP:20260510T073845
CREATED:20210701T154946Z
LAST-MODIFIED:20210701T154946Z
UID:20155-1627552800-1627556400@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-7/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T170000Z
DTEND:20210728T180000Z
DTSTAMP:20260510T073845
CREATED:20210719T204925Z
LAST-MODIFIED:20210719T204925Z
UID:20249-1627473600-1627477200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste July 28\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste July 28\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-july-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T160000Z
DTEND:20210728T170000Z
DTSTAMP:20260510T073845
CREATED:20210719T205927Z
LAST-MODIFIED:20210719T205927Z
UID:20251-1627470000-1627473600@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment July 28\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Assessment July 28\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-july-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T140000Z
DTEND:20210728T150000Z
DTSTAMP:20260510T073845
CREATED:20210624T183630Z
LAST-MODIFIED:20210624T183630Z
UID:20123-1627462800-1627466400@hdpusergroup.org
SUMMARY:ECM 2 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-7/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T130000Z
DTEND:20210728T140000Z
DTSTAMP:20260510T073845
CREATED:20210714T131653Z
LAST-MODIFIED:20210714T131653Z
UID:20206-1627459200-1627462800@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Update on backdrill samples being prepared. 
URL:https://hdpusergroup.org/event/disc2a-31/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T190000Z
DTEND:20210727T200000Z
DTSTAMP:20260510T073845
CREATED:20210726T122813Z
LAST-MODIFIED:20210726T122813Z
UID:20264-1627394400-1627398000@hdpusergroup.org
SUMMARY:PCB Feature Mon
DESCRIPTION:Update from Paul 
URL:https://hdpusergroup.org/event/pcb-feature-mon/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T160000Z
DTEND:20210727T170000Z
DTSTAMP:20260510T073845
CREATED:20210720T124447Z
LAST-MODIFIED:20210720T124447Z
UID:20253-1627383600-1627387200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-11/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T150000Z
DTEND:20210727T160000Z
DTSTAMP:20260510T073845
CREATED:20210622T151424Z
LAST-MODIFIED:20210622T151424Z
UID:20115-1627380000-1627383600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/better-caf-eq-11/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210723T150000Z
DTEND:20210723T160000Z
DTSTAMP:20260510T073845
CREATED:20210719T153952Z
LAST-MODIFIED:20210719T153952Z
UID:20248-1627034400-1627038000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Review
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-review-2/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210722T150000Z
DTEND:20210722T160000Z
DTSTAMP:20260510T073845
CREATED:20210701T154618Z
LAST-MODIFIED:20210701T154618Z
UID:20154-1626948000-1626951600@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-5/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210722T000000Z
DTEND:20210722T010000Z
DTSTAMP:20260510T073845
CREATED:20210707T201608Z
LAST-MODIFIED:20210707T201608Z
UID:20190-1626894000-1626897600@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Review latest data 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-15/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210720T190000Z
DTEND:20210720T200000Z
DTSTAMP:20260510T073845
CREATED:20210713T191020Z
LAST-MODIFIED:20210713T191020Z
UID:20204-1626789600-1626793200@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/pcb-feature-min-11/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210720T170000Z
DTEND:20210720T180000Z
DTSTAMP:20260510T073845
CREATED:20210705T194742Z
LAST-MODIFIED:20210705T194742Z
UID:20151-1626782400-1626786000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval Project Review Call
DESCRIPTION:Rescheduled Project Review Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-project-review-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR