BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20251028T140000Z
DTEND:20251028T150000Z
DTSTAMP:20260413T123744
CREATED:20251016T142847Z
LAST-MODIFIED:20251016T142847Z
UID:37777-1761642000-1761645600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Finalize Meeting Member Presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-52/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251027T150000Z
DTEND:20251027T160000Z
DTSTAMP:20260413T123744
CREATED:20251013T160537Z
LAST-MODIFIED:20251013T160537Z
UID:37636-1761559200-1761562800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Report review and discussion planned — all interested are welcome 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-73/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251027T140000Z
DTEND:20251027T150000Z
DTSTAMP:20260413T123744
CREATED:20251002T150657Z
LAST-MODIFIED:20251002T150657Z
UID:37567-1761555600-1761559200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing Project
DESCRIPTION:Evaluate how typical D-Coupon\, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-project-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251024T140000Z
DTEND:20251024T150000Z
DTSTAMP:20260413T123744
CREATED:20251022T131018Z
LAST-MODIFIED:20251022T131018Z
UID:37914-1761296400-1761300000@hdpusergroup.org
SUMMARY:Holy Trinity of Problems Charts
DESCRIPTION:Discuss Charts for problem discussion 
URL:https://hdpusergroup.org/event/holy-trinity-of-problems-charts/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251023T210000Z
DTEND:20251023T220000Z
DTSTAMP:20260413T123744
CREATED:20251009T222144Z
LAST-MODIFIED:20251009T222144Z
UID:37630-1761235200-1761238800@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-25/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251023T000000Z
DTEND:20251023T010000Z
DTSTAMP:20260413T123744
CREATED:20251013T034303Z
LAST-MODIFIED:20251013T034303Z
UID:37374-1761159600-1761163200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-9/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251022T150000Z
DTEND:20251022T160000Z
DTSTAMP:20260413T123744
CREATED:20251002T160132Z
LAST-MODIFIED:20251002T160132Z
UID:37570-1761127200-1761130800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-4/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251022T140000Z
DTEND:20251022T150000Z
DTSTAMP:20260413T123744
CREATED:20251008T144911Z
LAST-MODIFIED:20251008T144911Z
UID:37622-1761123600-1761127200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Evaluate the worst case electrical skew when using thinner dielectrics\, particularly L-glass. Results may indicate how electrical skew can be mitigated using some design\, process\, material\, and/or other options. 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251021T160000Z
DTEND:20251021T170000Z
DTSTAMP:20260413T123744
CREATED:20251007T162553Z
LAST-MODIFIED:20251007T162553Z
UID:37619-1761044400-1761048000@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251021T150000Z
DTEND:20251021T160000Z
DTSTAMP:20260413T123744
CREATED:20251001T142442Z
LAST-MODIFIED:20251001T142442Z
UID:37525-1761040800-1761044400@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-13/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T160000Z
DTEND:20251016T170000Z
DTSTAMP:20260413T123744
CREATED:20251002T200522Z
LAST-MODIFIED:20251002T200522Z
UID:37576-1760612400-1760616000@hdpusergroup.org
SUMMARY:TCE Materials-CTE Method validation
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. System developments in packaging are driving the size of packages to grow\, and I/O pitches to become finer. Both of these factors are impacting the reliability of products\, as more x-y stress is being placed on the solder joints. \nThe industry lacks a validated universal test method designed to measure CTE \nMaterials suppliers and OEMs rely on their own internal testing methodologies with no standard method. \nThis project will develop a standard test method through a validation process to measure CTE in the Z and X-Y axes. \n  
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T150000Z
DTEND:20251016T160000Z
DTSTAMP:20260413T123744
CREATED:20250924T153519Z
LAST-MODIFIED:20250924T153519Z
UID:37372-1760608800-1760612400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-3/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T140000Z
DTEND:20251016T150000Z
DTSTAMP:20260413T123744
CREATED:20250924T143411Z
LAST-MODIFIED:20250924T143411Z
UID:37371-1760605200-1760608800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Hopefully finalize fall meeeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-51/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T010000Z
DTEND:20251016T020000Z
DTSTAMP:20260413T123744
CREATED:20250918T012735Z
LAST-MODIFIED:20250918T012735Z
UID:37353-1760558400-1760562000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-26/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251015T160000Z
DTEND:20251015T170000Z
DTSTAMP:20260413T123744
CREATED:20250925T161851Z
LAST-MODIFIED:20250925T161851Z
UID:37378-1760526000-1760529600@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call-3/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251015T150000Z
DTEND:20251015T160000Z
DTSTAMP:20260413T123744
CREATED:20251015T145937Z
LAST-MODIFIED:20251015T145937Z
UID:37297-1760522400-1760526000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:This project seeks to develop a CAD translator utility for members that will provide analysis of local copper distribution to identify risk areas for: Core deformation and backdrill stub variation; Surface Topography variations; Glass Stop (local areas). It may also provide additional validation of the coplanarity and core deformation mitigation by using sub-lam sequence and stackup optimization. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251014T150000Z
DTEND:20251014T160000Z
DTSTAMP:20260413T123744
CREATED:20251008T144034Z
LAST-MODIFIED:20251008T144034Z
UID:37621-1760436000-1760439600@hdpusergroup.org
SUMMARY:Microvia Electrical Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-characterization-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251013T150000Z
DTEND:20251013T160000Z
DTSTAMP:20260413T123744
CREATED:20250929T160402Z
LAST-MODIFIED:20250929T160402Z
UID:37393-1760349600-1760353200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-72/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251009T230000Z
DTEND:20251010T000000Z
DTSTAMP:20260413T123744
CREATED:20251008T181236Z
LAST-MODIFIED:20251008T181236Z
UID:37625-1760032800-1760036400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Project status 
URL:https://hdpusergroup.org/event/porosity-testing-6/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251009T210000Z
DTEND:20251009T220000Z
DTSTAMP:20260413T123744
CREATED:20250925T214954Z
LAST-MODIFIED:20250925T214954Z
UID:37384-1760025600-1760029200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-24/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251009T150000Z
DTEND:20251009T160000Z
DTSTAMP:20260413T123744
CREATED:20250925T151201Z
LAST-MODIFIED:20250925T151201Z
UID:37377-1760004000-1760007600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update from Sabmina \nGo over first draft of presentation for Members' Meetting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-13/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251009T140000Z
DTEND:20251009T150000Z
DTSTAMP:20260413T123744
CREATED:20250911T145504Z
LAST-MODIFIED:20250911T145504Z
UID:37321-1760000400-1760004000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/september-11-1000-am-1100-am-edt-sir-testing-meeting/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251008T200000Z
DTEND:20251008T210000Z
DTSTAMP:20260413T123744
CREATED:20250918T202918Z
LAST-MODIFIED:20250918T202918Z
UID:37357-1759935600-1759939200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Progress on build 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-18/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251008T140000Z
DTEND:20251008T150000Z
DTSTAMP:20260413T123744
CREATED:20250903T144940Z
LAST-MODIFIED:20250903T144940Z
UID:37132-1759914000-1759917600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Project Kickoff Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251007T170000Z
DTEND:20251007T180000Z
DTSTAMP:20260413T123744
CREATED:20250908T195638Z
LAST-MODIFIED:20250908T195638Z
UID:37182-1759838400-1759842000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-14/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251007T150000Z
DTEND:20251007T160000Z
DTSTAMP:20260413T123744
CREATED:20250925T132155Z
LAST-MODIFIED:20250925T132155Z
UID:37375-1759831200-1759834800@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251005T201500Z
DTEND:20251005T211500Z
DTSTAMP:20260413T123744
CREATED:20250930T171934Z
LAST-MODIFIED:20250930T171934Z
UID:37358-1759677300-1759680900@hdpusergroup.org
SUMMARY:Testing email notification – updated 4
DESCRIPTION:please ignore – Testing email notification edited 4 
URL:https://hdpusergroup.org/event/testing-email-notification/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T160000Z
DTEND:20251002T170000Z
DTSTAMP:20260413T123744
CREATED:20250918T163932Z
LAST-MODIFIED:20250918T163932Z
UID:37356-1759402800-1759406400@hdpusergroup.org
SUMMARY:TCE Materials-CTE method validation
DESCRIPTION:Finalize test plan and shipment addresses 
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T150000Z
DTEND:20251002T160000Z
DTSTAMP:20260413T123744
CREATED:20250918T160223Z
LAST-MODIFIED:20250918T160223Z
UID:37355-1759399200-1759402800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-3/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260413T123744
CREATED:20251002T150606Z
LAST-MODIFIED:20251002T150606Z
UID:37566-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing Project
DESCRIPTION:Evaluate how typical D-Coupon\, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR