BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20211117T190000Z
DTEND:20211117T200000Z
DTSTAMP:20260509T053901
CREATED:20220121T181333Z
LAST-MODIFIED:20220121T181333Z
UID:20975-1637154000-1637157600@hdpusergroup.org
SUMMARY:Glass Type Composition project meeting
DESCRIPTION:Glass Type Composition project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-project-meeting-2021-11-17/2021-11-17/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211117T180000Z
DTEND:20211117T190000Z
DTSTAMP:20260509T053901
CREATED:20210929T181159Z
LAST-MODIFIED:20211013T192510Z
UID:20982-1637150400-1637154000@hdpusergroup.org
SUMMARY:HDP Low Ag Alloy Solderpaste BGA Leg project meeting
DESCRIPTION:HDP Low Ag Alloy Solderpaste BGA Leg project meeting 
URL:https://hdpusergroup.org/event/hdp-low-ag-alloy-solderpaste-bga-leg-project-meeting-2021-11-17/2021-11-17/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211117T150000Z
DTEND:20211117T160000Z
DTSTAMP:20260509T053901
CREATED:20211111T170534Z
LAST-MODIFIED:20211111T170534Z
UID:21401-1637139600-1637143200@hdpusergroup.org
SUMMARY:Microvia Reliability Discussion
DESCRIPTION:At our member meeting a few weeks ago we discussed an idea project proposal on microvia reliability. Some of the members wanted to have a further discussion on the topic. This is an opportunity to discuss further. \nI will be forwarding call info to both PCB miniaturization project group and meeting attendees. 
URL:https://hdpusergroup.org/event/microvia-reliability-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T180000Z
DTEND:20211115T190000Z
DTSTAMP:20260509T053901
CREATED:20211111T201738Z
LAST-MODIFIED:20211111T201738Z
UID:21404-1636977600-1636981200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model preliminary discussions
DESCRIPTION:Initial new project discussion withon Cu Surface Roughness Model 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-preliminary-discussions/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T160000Z
DTEND:20211115T170000Z
DTSTAMP:20260509T053901
CREATED:20211101T210635Z
LAST-MODIFIED:20211101T210635Z
UID:21333-1636970400-1636974000@hdpusergroup.org
SUMMARY:SIR Testing for the future
DESCRIPTION:Kick off Meeting 
URL:https://hdpusergroup.org/event/sir-testing-for-the-future/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T160000Z
DTEND:20211115T160000Z
DTSTAMP:20260509T053901
CREATED:20211101T205300Z
LAST-MODIFIED:20211101T205300Z
UID:21331-1636970400-1636970400@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Kick-off meeting
DESCRIPTION:Kick-off meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-kick-off-meeting-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211112T160000Z
DTEND:20211112T170000Z
DTSTAMP:20260509T053901
CREATED:20211108T162930Z
LAST-MODIFIED:20211108T162930Z
UID:21378-1636711200-1636714800@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Call
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-call/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211111T170000Z
DTEND:20211111T180000Z
DTSTAMP:20260509T053901
CREATED:20211028T152930Z
LAST-MODIFIED:20211028T152930Z
UID:21298-1636628400-1636632000@hdpusergroup.org
SUMMARY:Single Surface Finish Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-4/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211111T160000Z
DTEND:20211111T170000Z
DTSTAMP:20260509T053901
CREATED:20211019T124233Z
LAST-MODIFIED:20211019T124233Z
UID:21146-1636624800-1636628400@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-14/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211111T150000Z
DTEND:20211111T160000Z
DTSTAMP:20260509T053901
CREATED:20211110T190357Z
LAST-MODIFIED:20211110T190357Z
UID:21396-1636621200-1636624800@hdpusergroup.org
SUMMARY:Kick-off discussion for SIR New Testing
DESCRIPTION:Planning Meeting 
URL:https://hdpusergroup.org/event/kick-off-discussion-for-sir-new-testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211111T140000Z
DTEND:20211111T150000Z
DTSTAMP:20260509T053901
CREATED:20211101T141254Z
LAST-MODIFIED:20211101T141254Z
UID:21307-1636617600-1636621200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Status update 
URL:https://hdpusergroup.org/event/disc2a-35/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211110T160000Z
DTEND:20211110T170000Z
DTSTAMP:20260509T053901
CREATED:20211027T155139Z
LAST-MODIFIED:20211027T155139Z
UID:21230-1636538400-1636542000@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-6/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211110T020000Z
DTEND:20211110T030000Z
DTSTAMP:20260509T053901
CREATED:20211013T062245Z
LAST-MODIFIED:20211013T062245Z
UID:21077-1636488000-1636491600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-36/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211109T210000Z
DTEND:20211109T220000Z
DTSTAMP:20260509T053901
CREATED:20211027T133141Z
LAST-MODIFIED:20211027T133141Z
UID:21229-1636470000-1636473600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Next iteration of test board \nVolunteers for testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-6/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211109T180000Z
DTEND:20211109T190000Z
DTSTAMP:20260509T053902
CREATED:20211102T144733Z
LAST-MODIFIED:20211102T144733Z
UID:21340-1636459200-1636462800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Harsh Use Alloy Evaluation Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211108T170000Z
DTEND:20211108T180000Z
DTSTAMP:20260509T053902
CREATED:20211027T190934Z
LAST-MODIFIED:20211027T190934Z
UID:21231-1636369200-1636372800@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-29/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211105T140000Z
DTEND:20211105T150000Z
DTSTAMP:20260509T053902
CREATED:20211105T134723Z
LAST-MODIFIED:20211105T134723Z
UID:21056-1636102800-1636106400@hdpusergroup.org
SUMMARY:Effect of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effect of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effect-of-plating-thickness-on-ctf-at-ist-project-call/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211104T160000Z
DTEND:20211104T170000Z
DTSTAMP:20260509T053902
CREATED:20220121T000643Z
LAST-MODIFIED:20220121T000643Z
UID:20957-1636023600-1636027200@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-meeting/2021-11-04/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211104T150000Z
DTEND:20211104T160000Z
DTSTAMP:20260509T053902
CREATED:20211007T155153Z
LAST-MODIFIED:20211007T155153Z
UID:21052-1636020000-1636023600@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-11/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211103T160000Z
DTEND:20211103T170000Z
DTSTAMP:20260509T053902
CREATED:20210929T181552Z
LAST-MODIFIED:20210929T181552Z
UID:20988-1635937200-1635940800@hdpusergroup.org
SUMMARY:HDP Thermal Analysis Methodology Evaluation project meeting
DESCRIPTION:HDP Thermal Analysis Methodology Evaluation project meeting 
URL:https://hdpusergroup.org/event/hdp-thermal-analysis-methodology-evaluation-project-meeting/2021-11-03/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211103T140000Z
DTEND:20211103T150000Z
DTSTAMP:20260509T053902
CREATED:20211013T142658Z
LAST-MODIFIED:20211013T142658Z
UID:21078-1635930000-1635933600@hdpusergroup.org
SUMMARY:PFH Technology Phase 2 Project Call
DESCRIPTION:PFH Technology Phase 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-phase-2-project-call-7/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211102T130000Z
DTEND:20211102T140000Z
DTSTAMP:20260509T053902
CREATED:20211028T150800Z
LAST-MODIFIED:20211028T150800Z
UID:21280-1635840000-1635843600@hdpusergroup.org
SUMMARY:Weekly Staff Call
DESCRIPTION:Weekly staff call 
URL:https://hdpusergroup.org/event/weekly-staff-call/2021-11-02/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211029T150000Z
DTEND:20211029T160000Z
DTSTAMP:20260509T053902
CREATED:20211021T131319Z
LAST-MODIFIED:20211021T131319Z
UID:21150-1635501600-1635505200@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Review
DESCRIPTION:Ultra-Low Dk Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-review-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211028T150000Z
DTEND:20211028T160000Z
DTSTAMP:20260509T053902
CREATED:20211014T155143Z
LAST-MODIFIED:20211014T155143Z
UID:21112-1635415200-1635418800@hdpusergroup.org
SUMMARY:Single Surface Finish Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-3/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211027T150000Z
DTEND:20211027T160000Z
DTSTAMP:20260509T053902
CREATED:20211019T124536Z
LAST-MODIFIED:20211019T124536Z
UID:21147-1635328800-1635332400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-27/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211027T150000Z
DTEND:20211027T160000Z
DTSTAMP:20260509T053902
CREATED:20211011T160332Z
LAST-MODIFIED:20211011T160332Z
UID:21073-1635328800-1635332400@hdpusergroup.org
SUMMARY:ECM 2 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-11/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211027T000000Z
DTEND:20211027T010000Z
DTSTAMP:20260509T053902
CREATED:20211008T151425Z
LAST-MODIFIED:20211008T151425Z
UID:21057-1635274800-1635278400@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive
DESCRIPTION:Call to discuss the final report. 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-11/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211026T200000Z
DTEND:20211026T210000Z
DTSTAMP:20260509T053902
CREATED:20211006T200703Z
LAST-MODIFIED:20211006T200703Z
UID:21050-1635260400-1635264000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Continue building the project plan 
URL:https://hdpusergroup.org/event/photonic-soldering-2-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211026T170000Z
DTEND:20211026T180000Z
DTSTAMP:20260509T053902
CREATED:20211021T130859Z
LAST-MODIFIED:20211021T130859Z
UID:21149-1635249600-1635253200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project
DESCRIPTION:Harsh Use Alloy Project Review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211025T160000Z
DTEND:20211025T170000Z
DTSTAMP:20260509T053902
CREATED:20211019T123733Z
LAST-MODIFIED:20211019T123733Z
UID:21144-1635159600-1635163200@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-28/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR