BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20211213T170000Z
DTEND:20211213T180000Z
DTSTAMP:20260508T231100
CREATED:20211208T210920Z
LAST-MODIFIED:20211208T210920Z
UID:21517-1639393200-1639396800@hdpusergroup.org
SUMMARY:Back Drill to Primary Via Transition Conditions kickoff telecom
DESCRIPTION:Back Drill to Primary Via Transition Conditions kickoff telecom 
URL:https://hdpusergroup.org/event/back-drill-to-primary-via-transition-conditions-kickoff-telecom/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211213T160000Z
DTEND:20211213T170000Z
DTSTAMP:20260508T231100
CREATED:20211115T202045Z
LAST-MODIFIED:20211115T202045Z
UID:21415-1639389600-1639393200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model project continuation #2
DESCRIPTION:Continuation of discussions on project proposal for Cu Roughness Model 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-project-continuation-2/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211210T150000Z
DTEND:20211210T160000Z
DTSTAMP:20260508T231100
CREATED:20211105T142353Z
LAST-MODIFIED:20211105T142353Z
UID:21375-1639126800-1639130400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-6/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211209T210000Z
DTEND:20211209T220000Z
DTSTAMP:20260508T231100
CREATED:20211202T232754Z
LAST-MODIFIED:20211202T232754Z
UID:21494-1639062000-1639065600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Moving toward Implementation 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-9/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211209T160000Z
DTEND:20211209T170000Z
DTSTAMP:20260508T231100
CREATED:20211116T162754Z
LAST-MODIFIED:20211116T162754Z
UID:21427-1639044000-1639047600@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-15/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211209T150000Z
DTEND:20211209T160000Z
DTSTAMP:20260508T231100
CREATED:20211119T222517Z
LAST-MODIFIED:20211119T222517Z
UID:21437-1639040400-1639044000@hdpusergroup.org
SUMMARY:Microvia Discussion 2
DESCRIPTION:Follow up discussion on project idea 
URL:https://hdpusergroup.org/event/microvia-discussion-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211209T140000Z
DTEND:20211209T150000Z
DTSTAMP:20260508T231100
CREATED:20211126T212217Z
LAST-MODIFIED:20211126T212217Z
UID:21471-1639036800-1639040400@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua's latest results 
URL:https://hdpusergroup.org/event/disc2a-37/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211208T170000Z
DTEND:20211208T180000Z
DTSTAMP:20260508T231100
CREATED:20211129T171756Z
LAST-MODIFIED:20211129T171756Z
UID:21473-1638961200-1638964800@hdpusergroup.org
SUMMARY:Backdrill Under BGA tel;ecom
DESCRIPTION:Backdrill Under BGA tel;ecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-31/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211208T160000Z
DTEND:20211208T170000Z
DTSTAMP:20260508T231100
CREATED:20211104T155322Z
LAST-MODIFIED:20211104T155322Z
UID:21369-1638957600-1638961200@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-12/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211208T150000Z
DTEND:20211208T160000Z
DTSTAMP:20260508T231100
CREATED:20211110T171012Z
LAST-MODIFIED:20211110T171012Z
UID:21394-1638954000-1638957600@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-7/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211208T010000Z
DTEND:20211208T020000Z
DTSTAMP:20260508T231100
CREATED:20211118T123310Z
LAST-MODIFIED:20211118T123310Z
UID:21433-1638903600-1638907200@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive - Call
DESCRIPTION:Update on FA work and review of final report 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-call-4/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211207T180000Z
DTEND:20211207T190000Z
DTSTAMP:20260508T231100
CREATED:20211122T165557Z
LAST-MODIFIED:20211122T165557Z
UID:21457-1638878400-1638882000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Harsh Use Alloy Evaluation Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211206T150000Z
DTEND:20211206T160000Z
DTSTAMP:20260508T231100
CREATED:20211115T171016Z
LAST-MODIFIED:20211115T171016Z
UID:21405-1638781200-1638784800@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211203T160000Z
DTEND:20211203T170000Z
DTSTAMP:20260508T231100
CREATED:20211123T214903Z
LAST-MODIFIED:20211123T214903Z
UID:21466-1638525600-1638529200@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project
DESCRIPTION:Ultra-Low Dk Glass Analysis project call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-3/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211202T210000Z
DTEND:20211202T220000Z
DTSTAMP:20260508T231100
CREATED:20211118T221650Z
LAST-MODIFIED:20211118T221650Z
UID:21435-1638457200-1638460800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Ara to show ATC board design \nGroup to work on presentation for BoD 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-8/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211202T160000Z
DTEND:20211202T170000Z
DTSTAMP:20260508T231100
CREATED:20211111T181311Z
LAST-MODIFIED:20211111T181311Z
UID:21403-1638439200-1638442800@hdpusergroup.org
SUMMARY:Single Surface Finish Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-5/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211201T160000Z
DTEND:20211201T170000Z
DTSTAMP:20260508T231100
CREATED:20211027T191134Z
LAST-MODIFIED:20211027T191134Z
UID:21232-1638352800-1638356400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-28/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211129T170000Z
DTEND:20211129T200000Z
DTSTAMP:20260508T231100
CREATED:20211109T133349Z
LAST-MODIFIED:20211109T133349Z
UID:21380-1638183600-1638194400@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-30/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211129T150000Z
DTEND:20211129T160000Z
DTSTAMP:20260508T231100
CREATED:20211122T165018Z
LAST-MODIFIED:20211122T165018Z
UID:21456-1638176400-1638180000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Nik and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-13/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211125T140000Z
DTEND:20211125T150000Z
DTSTAMP:20260508T231100
CREATED:20211118T144859Z
LAST-MODIFIED:20211118T144859Z
UID:21434-1637827200-1637830800@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Status of depth of cut expt. \nStatus in Intel back drill boards 
URL:https://hdpusergroup.org/event/disc2a-36/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211124T140000Z
DTEND:20211124T150000Z
DTSTAMP:20260508T231100
CREATED:20211103T143759Z
LAST-MODIFIED:20211103T143759Z
UID:21366-1637740800-1637744400@hdpusergroup.org
SUMMARY:PFH Technology Phase 2 Project Call
DESCRIPTION:PFH Technology Phase 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-phase-2-project-call-8/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211118T210000Z
DTEND:20211118T220000Z
DTSTAMP:20260508T231100
CREATED:20211109T213712Z
LAST-MODIFIED:20211109T213712Z
UID:21392-1637247600-1637251200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Status on board design \nStart putting things together (materials\, schedule\, etc.) for BoD approval 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-7/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211118T190000Z
DTEND:20211118T200000Z
DTSTAMP:20260508T231100
CREATED:20210929T180314Z
LAST-MODIFIED:20211013T194009Z
UID:20968-1637240400-1637244000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-project-meeting-2021-11-18/2021-11-18/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211118T010000Z
DTEND:20211118T020000Z
DTSTAMP:20260508T231100
CREATED:20211028T142000Z
LAST-MODIFIED:20211028T142000Z
UID:21234-1637175600-1637179200@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive project call
DESCRIPTION:Review FA draft and update on FA by Haesung 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-18/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211117T190000Z
DTEND:20211117T200000Z
DTSTAMP:20260508T231100
CREATED:20220121T181333Z
LAST-MODIFIED:20220121T181333Z
UID:20975-1637154000-1637157600@hdpusergroup.org
SUMMARY:Glass Type Composition project meeting
DESCRIPTION:Glass Type Composition project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-project-meeting-2021-11-17/2021-11-17/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211117T180000Z
DTEND:20211117T190000Z
DTSTAMP:20260508T231100
CREATED:20210929T181159Z
LAST-MODIFIED:20211013T192510Z
UID:20982-1637150400-1637154000@hdpusergroup.org
SUMMARY:HDP Low Ag Alloy Solderpaste BGA Leg project meeting
DESCRIPTION:HDP Low Ag Alloy Solderpaste BGA Leg project meeting 
URL:https://hdpusergroup.org/event/hdp-low-ag-alloy-solderpaste-bga-leg-project-meeting-2021-11-17/2021-11-17/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211117T150000Z
DTEND:20211117T160000Z
DTSTAMP:20260508T231100
CREATED:20211111T170534Z
LAST-MODIFIED:20211111T170534Z
UID:21401-1637139600-1637143200@hdpusergroup.org
SUMMARY:Microvia Reliability Discussion
DESCRIPTION:At our member meeting a few weeks ago we discussed an idea project proposal on microvia reliability. Some of the members wanted to have a further discussion on the topic. This is an opportunity to discuss further. \nI will be forwarding call info to both PCB miniaturization project group and meeting attendees. 
URL:https://hdpusergroup.org/event/microvia-reliability-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T180000Z
DTEND:20211115T190000Z
DTSTAMP:20260508T231100
CREATED:20211111T201738Z
LAST-MODIFIED:20211111T201738Z
UID:21404-1636977600-1636981200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model preliminary discussions
DESCRIPTION:Initial new project discussion withon Cu Surface Roughness Model 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-preliminary-discussions/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T160000Z
DTEND:20211115T170000Z
DTSTAMP:20260508T231100
CREATED:20211101T210635Z
LAST-MODIFIED:20211101T210635Z
UID:21333-1636970400-1636974000@hdpusergroup.org
SUMMARY:SIR Testing for the future
DESCRIPTION:Kick off Meeting 
URL:https://hdpusergroup.org/event/sir-testing-for-the-future/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20211115T160000Z
DTEND:20211115T160000Z
DTSTAMP:20260508T231100
CREATED:20211101T205300Z
LAST-MODIFIED:20211101T205300Z
UID:21331-1636970400-1636970400@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Kick-off meeting
DESCRIPTION:Kick-off meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-kick-off-meeting-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR