BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220209T160000Z
DTEND:20220209T170000Z
DTSTAMP:20260508T113157
CREATED:20220119T163946Z
LAST-MODIFIED:20220119T163946Z
UID:21829-1644400800-1644404400@hdpusergroup.org
SUMMARY:Single Surface Finish Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-8/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220209T150000Z
DTEND:20220209T160000Z
DTSTAMP:20260508T113157
CREATED:20220203T170642Z
LAST-MODIFIED:20220203T170642Z
UID:21922-1644397200-1644400800@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-10/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220208T190000Z
DTEND:20220208T200000Z
DTSTAMP:20260508T113157
CREATED:20220201T193716Z
LAST-MODIFIED:20220201T193716Z
UID:21904-1644325200-1644328800@hdpusergroup.org
SUMMARY:Rescheduled Glass Type Comparison project meeting for Feb 8\, 2022
DESCRIPTION:Rescheduled Glass Type Comparison project meeting for Feb 8\, 2022. Feb 9th meeting cancelled 
URL:https://hdpusergroup.org/event/rescheduled-glass-type-comparison-project-meeting-for-feb-8-2022/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220203T200000Z
DTEND:20220203T210000Z
DTSTAMP:20260508T113157
CREATED:20220119T202743Z
LAST-MODIFIED:20220119T202743Z
UID:21832-1643896800-1643900400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Work on Members' Meeting PowerPoint \nAny build update 
URL:https://hdpusergroup.org/event/pcb-feature-min-17/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220203T160000Z
DTEND:20220203T170000Z
DTSTAMP:20260508T113157
CREATED:20220106T165537Z
LAST-MODIFIED:20220106T165537Z
UID:21761-1643882400-1643886000@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-14/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220203T150000Z
DTEND:20220203T160000Z
DTSTAMP:20260508T113157
CREATED:20220113T154308Z
LAST-MODIFIED:20220113T154308Z
UID:21794-1643878800-1643882400@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-9/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220202T200000Z
DTEND:20220202T210000Z
DTSTAMP:20260508T113157
CREATED:20220113T142045Z
LAST-MODIFIED:20220113T142045Z
UID:21793-1643810400-1643814000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Continue working in project definition and PowerPoint for Members Meeting 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-12/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220202T190000Z
DTEND:20220202T200000Z
DTSTAMP:20260508T113157
CREATED:20220113T141826Z
LAST-MODIFIED:20220113T141826Z
UID:21792-1643806800-1643810400@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Work on PowerPoint for Members Meeting 
URL:https://hdpusergroup.org/event/disc2a-40/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220202T170000Z
DTEND:20220202T180000Z
DTSTAMP:20260508T113157
CREATED:20220119T182302Z
LAST-MODIFIED:20220119T182302Z
UID:21830-1643799600-1643803200@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue the discussion 
URL:https://hdpusergroup.org/event/microvia-rel-4/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220202T160000Z
DTEND:20220202T170000Z
DTSTAMP:20260508T113157
CREATED:20220112T165833Z
LAST-MODIFIED:20220112T165833Z
UID:21777-1643796000-1643799600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Testing progress 
URL:https://hdpusergroup.org/event/better-caf-eq-15/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220202T150000Z
DTEND:20220202T160000Z
DTSTAMP:20260508T113157
CREATED:20220105T161402Z
LAST-MODIFIED:20220105T161402Z
UID:21755-1643792400-1643796000@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-3/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220201T180000Z
DTEND:20220201T190000Z
DTSTAMP:20260508T113157
CREATED:20220127T191717Z
LAST-MODIFIED:20220127T191717Z
UID:21862-1643716800-1643720400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-4/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220201T160000Z
DTEND:20220201T170000Z
DTSTAMP:20260508T113157
CREATED:20220118T164010Z
LAST-MODIFIED:20220118T164010Z
UID:21812-1643709600-1643713200@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Mike's progress on the final report 
URL:https://hdpusergroup.org/event/board-thickness-ii-27/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220127T010000Z
DTEND:20220127T020000Z
DTSTAMP:20260508T113157
CREATED:20220106T185039Z
LAST-MODIFIED:20220106T185039Z
UID:21766-1643223600-1643227200@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Project call for FA review and report writing 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-20/
LOCATION:Virtual
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220126T140000Z
DTEND:20220126T150000Z
DTSTAMP:20260508T113157
CREATED:20211230T142937Z
LAST-MODIFIED:20211230T142937Z
UID:21736-1643184000-1643187600@hdpusergroup.org
SUMMARY:PFH Technology Phase 2 Project Call
DESCRIPTION:PFH Technology Phase 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-phase-2-project-call-10/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220126T020000Z
DTEND:20220126T030000Z
DTSTAMP:20260508T113157
CREATED:20220119T121002Z
LAST-MODIFIED:20220119T121002Z
UID:21828-1643140800-1643144400@hdpusergroup.org
SUMMARY:HDP Welcomes VGT and Orientation Call
DESCRIPTION:HDP Welcomes VGT and Orientation Call 
URL:https://hdpusergroup.org/event/hdp-welcomes-vgt-and-orientation-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220119T200000Z
DTEND:20220119T210000Z
DTSTAMP:20260508T113157
CREATED:20211215T201352Z
LAST-MODIFIED:20211215T201352Z
UID:21588-1642600800-1642604400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Progress report from Calumet 
URL:https://hdpusergroup.org/event/pcb-feature-min-16/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220119T160000Z
DTEND:20220119T170000Z
DTSTAMP:20260508T113157
CREATED:20211217T001710Z
LAST-MODIFIED:20211217T001710Z
UID:21711-1642586400-1642590000@hdpusergroup.org
SUMMARY:Single Surface Finish Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-7/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220119T150000Z
DTEND:20220119T160000Z
DTSTAMP:20260508T113157
CREATED:20220112T170323Z
LAST-MODIFIED:20220112T170323Z
UID:21778-1642582800-1642586400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue working on determining project direction 
URL:https://hdpusergroup.org/event/microvia-rel-3/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220118T180000Z
DTEND:20220118T190000Z
DTSTAMP:20260508T113157
CREATED:20220103T170450Z
LAST-MODIFIED:20220103T170450Z
UID:21739-1642507200-1642510800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project
DESCRIPTION:Project review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220118T170000Z
DTEND:20220118T180000Z
DTSTAMP:20260508T113157
CREATED:20220113T155619Z
LAST-MODIFIED:20220113T155619Z
UID:21795-1642503600-1642507200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-31/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220118T160000Z
DTEND:20220118T170000Z
DTSTAMP:20260508T113157
CREATED:20211216T202006Z
LAST-MODIFIED:20211216T202006Z
UID:21710-1642500000-1642503600@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Final report 
URL:https://hdpusergroup.org/event/board-thickness-ii-26/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220117T190000Z
DTEND:20220117T200000Z
DTSTAMP:20260508T113157
CREATED:20220112T171240Z
LAST-MODIFIED:20220112T171240Z
UID:21779-1642424400-1642428000@hdpusergroup.org
SUMMARY:Discussion with Joe Dickson
DESCRIPTION:Discussion with Joe Dickson 
URL:https://hdpusergroup.org/event/discussion-with-joe-dickson/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220114T170000Z
DTEND:20220114T180000Z
DTSTAMP:20260508T113157
CREATED:20220106T223601Z
LAST-MODIFIED:20220106T223601Z
UID:21762-1642158000-1642161600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Call
DESCRIPTION:Ultra-Low Dk Glass project call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-call-3/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220114T160000Z
DTEND:20220114T170000Z
DTSTAMP:20260508T113157
CREATED:20220103T214804Z
LAST-MODIFIED:20220103T214804Z
UID:21561-1642154400-1642158000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-16/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220114T150000Z
DTEND:20220114T160000Z
DTSTAMP:20260508T113157
CREATED:20211213T142057Z
LAST-MODIFIED:20211213T142057Z
UID:21545-1642150800-1642154400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-7/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220113T160000Z
DTEND:20220113T170000Z
DTSTAMP:20260508T113157
CREATED:20220103T214727Z
LAST-MODIFIED:20220103T214727Z
UID:21560-1642068000-1642071600@hdpusergroup.org
SUMMARY:Backdrill Transition KO telecom
DESCRIPTION:Backdrill Transition KO telecom 
URL:https://hdpusergroup.org/event/backdrill-transition-ko-telecom/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220113T150000Z
DTEND:20220113T160000Z
DTSTAMP:20260508T113157
CREATED:20211208T152142Z
LAST-MODIFIED:20211208T152142Z
UID:21523-1642064400-1642068000@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-8/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220113T140000Z
DTEND:20220113T150000Z
DTSTAMP:20260508T113157
CREATED:20220106T141357Z
LAST-MODIFIED:20220106T141357Z
UID:21759-1642060800-1642064400@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:We will start working on the final report. 
URL:https://hdpusergroup.org/event/disc2a-39/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220112T210000Z
DTEND:20220112T220000Z
DTSTAMP:20260508T113157
CREATED:20220106T161241Z
LAST-MODIFIED:20220106T161241Z
UID:21760-1641999600-1642003200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Continuing to work towards Implementation 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-11/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR