BEGIN:VCALENDAR VERSION:2.0 PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://hdpusergroup.org X-WR-CALDESC:Events for HDP User Group REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20260308T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20261101T070000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART:20260617T180000Z DTEND:20260617T190000Z DTSTAMP:20261019T184749 CREATED:20260608T204040Z LAST-MODIFIED:20260608T204040Z UID:40550-1781701200-1781704800@hdpusergroup.org SUMMARY:High Aspect Ratio Plating Limits-kick-off meeting DESCRIPTION:Kick-off meeting to discuss project. URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-kick-off-meeting/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260617T150000Z DTEND:20260617T160000Z DTSTAMP:20261019T184749 CREATED:20260513T155344Z LAST-MODIFIED:20260513T155344Z UID:40226-1781690400-1781694000@hdpusergroup.org SUMMARY:Pb Free Materials 7 Project Ca DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/pb-free-materials-7-project-ca/ CATEGORIES:Materials #7 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260617T140000Z DTEND:20260617T150000Z DTSTAMP:20261019T184749 CREATED:20260521T142526Z LAST-MODIFIED:20260521T142526Z UID:40340-1781686800-1781690400@hdpusergroup.org SUMMARY:Better CAF Equation DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/better-caf-equation-16/ CATEGORIES:Better CAF Acceleration Equation ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260617T020000Z DTEND:20260617T030000Z DTSTAMP:20261019T184749 CREATED:20260611T081929Z LAST-MODIFIED:20260611T081929Z UID:40331-1781643600-1781647200@hdpusergroup.org SUMMARY:Large Component PWB Warpage Project Kick-off Meeting DESCRIPTION:Large Component PWB Warpage Project Kick-off Meeting URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-kick-off-meeting/ CATEGORIES:Large Component PWB Warpage ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260616T170000Z DTEND:20260616T180000Z DTSTAMP:20261019T184749 CREATED:20260521T181753Z LAST-MODIFIED:20260521T181753Z UID:40344-1781611200-1781614800@hdpusergroup.org SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call DESCRIPTION:Periodic Project Call URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-3/ CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260616T140000Z DTEND:20260616T150000Z DTSTAMP:20261019T184749 CREATED:20260528T150545Z LAST-MODIFIED:20260528T150545Z UID:40370-1781600400-1781604000@hdpusergroup.org SUMMARY:D-Coupon IST CITC Reliability Testing DESCRIPTION:Project Meeting URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-18/ CATEGORIES:D-Coupon IST CITC Reliability Testing ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260615T150000Z DTEND:20260615T160000Z DTSTAMP:20261019T184749 CREATED:20260518T160059Z LAST-MODIFIED:20260518T160059Z UID:40333-1781517600-1781521200@hdpusergroup.org SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-7/ CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T180000Z DTEND:20260611T190000Z DTSTAMP:20261019T184749 CREATED:20260515T133549Z LAST-MODIFIED:20260515T133549Z UID:40291-1781182800-1781186400@hdpusergroup.org SUMMARY:High Aspect Ratio Plating Limitations DESCRIPTION:What are limitations related to plated through hole reliabilty? With designs approaching 30:1 and beyond\, what are the factors that contribute either to the success or failure of the the PTH? \nIs there a new or revised standard that is required to set expectations for rugged environments as well as those end products that must perform 24/7 365 days per year? \nthe kick-off meeting provided many ideas of key factos that could influence PTH plating sucess and reliability. \nIn addition\, the first order of business is to decide on a test vehicle and decide on a few key parameters to study initially. This project is considered a multi-phase exercise that will be set up as various parts. URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limitations/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T170000Z DTEND:20260611T180000Z DTSTAMP:20261019T184749 CREATED:20260515T130324Z LAST-MODIFIED:20260515T130324Z UID:40290-1781179200-1781182800@hdpusergroup.org SUMMARY:Paste Interconnect Exploratory Meeting DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting-3/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T160000Z DTEND:20260611T170000Z DTSTAMP:20261019T184749 CREATED:20260521T162633Z LAST-MODIFIED:20260521T162633Z UID:40343-1781175600-1781179200@hdpusergroup.org SUMMARY:TCE Materials-CTE Validation DESCRIPTION:CTE x-y and Z axis validation URL:https://hdpusergroup.org/event/tce-materials-cte-validation/ CATEGORIES:TCE Materials Dimensional Properties ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T150000Z DTEND:20260611T160000Z DTSTAMP:20261019T184749 CREATED:20260521T141322Z LAST-MODIFIED:20260521T141322Z UID:40339-1781172000-1781175600@hdpusergroup.org SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-21/ CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T140000Z DTEND:20260611T150000Z DTSTAMP:20261019T184749 CREATED:20260513T142900Z LAST-MODIFIED:20260513T142900Z UID:40044-1781168400-1781172000@hdpusergroup.org SUMMARY:ECM-4 DESCRIPTION:Project Meeting URL:https://hdpusergroup.org/event/ecm-4-22/ CATEGORIES:Electro-Chemical Migration 4 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260611T010000Z DTEND:20260611T020000Z DTSTAMP:20261019T184749 CREATED:20260520T011933Z LAST-MODIFIED:20260520T011933Z UID:40338-1781121600-1781125200@hdpusergroup.org SUMMARY:Correlating CF Profile to Signal Integrity Project Call DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-37/ CATEGORIES:Correlating Copper Foil Profile to Signal Integrity ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260610T150000Z DTEND:20260610T160000Z DTSTAMP:20261019T184749 CREATED:20260401T163431Z LAST-MODIFIED:20260401T163431Z UID:39963-1781085600-1781089200@hdpusergroup.org SUMMARY:Inner Layer Copper Balancing 2 DESCRIPTION:Project Meeting Minutes URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-8/ CATEGORIES:Inner Layer Copper Balancing 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260609T150000Z DTEND:20260609T160000Z DTSTAMP:20261019T184749 CREATED:20260515T124829Z LAST-MODIFIED:20260515T124829Z UID:40288-1780999200-1781002800@hdpusergroup.org SUMMARY:Stacked Microvia Capability Improvement DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-15/ CATEGORIES:Stacked vs. Staggered Microvias ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260604T010000Z DTEND:20260604T090000Z DTSTAMP:20261019T184749 CREATED:20260702T134909Z LAST-MODIFIED:20260702T134909Z UID:38789-1780516800-1780545600@hdpusergroup.org SUMMARY:HDP June 2026 Asia Meeting DESCRIPTION:Meeting presentations\, recordings from Day 1 and Day 2\, and an agenda showing the presentation recording time stamp are available for download at the bottom of this page. \nThe HDP June 2026 Asia Meeting will be held on June 3 & 4\, 2026 (Thailand Time) / June 2 (evening) – June 4 (early morning) (US Central Time) in Nonthaburi\, Thailand.  The meeting will be hosted by Sundell.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews Forsha\, at kima77@hdpug.org \nMeeting Location and Hotel Information: \nBest Western Plus Wanda Grand Hotel111 Moo 4 Chaengwattana Road\, Klongklua\, Pakkred\, Nonthaburi 11120 \nThe HDP Room block price:Superior Single Room with daily breakfast buffet – Baht 2\,200 (~71 USD) room/nightSuperior Double Room with daily breakfast buffet – Baht 2\,400 (~78 USD) room/night \nTo request a room reservation\, please contact the HDP Business Manager or include your check-in and check-out dates when registering on this page.  The discounted room rate cannot be guaranteed after May 1. \nCall Information (ics files are available for download at the bottom of this page) \nHDP June 2026 Asia Meeting Day 1When it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m5af2958f1c395c1c9779591a8b00731dJoin by meeting numberMeeting number (access code): 2551 018 5505Meeting password: HDPAsia1Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nHDP June 2026 Asia Meeting Day 2When it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=me8f2443d724e9a483163d7072923873c Join by meeting numberMeeting number (access code): 2553 857 2376Meeting password: Day2HDP2026AsiaJoin by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n  URL:https://hdpusergroup.org/event/hdp-june-2026-asia-meeting-2/ LOCATION:Nonthaburi\, Thailand CATEGORIES:Member Meetings ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260603T010000Z DTEND:20260603T090000Z DTSTAMP:20261019T184749 CREATED:20260702T134952Z LAST-MODIFIED:20260702T134952Z UID:38783-1780430400-1780459200@hdpusergroup.org SUMMARY:HDP June 2026 Asia Meeting DESCRIPTION:Meeting presentations\, recordings from Day 1 and Day 2\, and an agenda showing the presentation recording time stamp are available for download at the bottom of this page. \nThe HDP June Asia Member Meeting will be held June 3 & 4\, 2026 in Nonthaburi\, Thailand. The meeting will be hosted by Sundell. Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews Forsha\, at kima77@hdpug.org \nMeeting Location and Hotel: \nHDP has worked with the Best Western Plus Wanda Grand Hotel to secure a room block.  Room pricing is as follows: \nSuperior Single Room – Baht 2\,200 (~67 USD)Superior Double Room – Baht 2\,400 (~73 USD) \nBest Western Plus Wanda Grand Hotel111 หมู่ที่4 Chaeng Watthana Rd\, Khlong Kluea\, Pak Kret District\, Nonthaburi 11120\,ThailandTelephone +66 2 582 8282 \nTo secure the HDP group rate please make your reservations by May 1.  Reservations can be requested by entering your check-in and check-out dates on the registration form on this page\, or by emailing the HDP Business Manager at kima77@hdpug.org. \nCall Information (ics files are available for download at the bottom of this page) \n \nHDP June 2026 Asia Meeting Day 1When it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m5af2958f1c395c1c9779591a8b00731dJoin by meeting numberMeeting number (access code): 2551 018 5505Meeting password: HDPAsia1Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nHDP June 2026 Asia Meeting Day 2When it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=me8f2443d724e9a483163d7072923873c Join by meeting numberMeeting number (access code): 2553 857 2376Meeting password: Day2HDP2026AsiaJoin by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n  \n  \n  URL:https://hdpusergroup.org/event/hdp-june-2026-asia-meeting/ LOCATION:Nonthaburi\, Thailand CATEGORIES:Member Meetings ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260601T070000Z DTEND:20260601T080000Z DTSTAMP:20261019T184749 CREATED:20260601T051321Z LAST-MODIFIED:20260601T051321Z UID:40498-1780279200-1780282800@hdpusergroup.org SUMMARY:BW Plus Wanda Grand AV Test DESCRIPTION:Test URL:https://hdpusergroup.org/event/bw-plus-wanda-grand-av-test/ CATEGORIES:Staff Calendar ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260528T140000Z DTEND:20260528T150000Z DTSTAMP:20261019T184749 CREATED:20260507T153339Z LAST-MODIFIED:20260507T153339Z UID:40130-1779958800-1779962400@hdpusergroup.org SUMMARY:D-Coupon IST CITC Reliability Testing DESCRIPTION:Project Meeting URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-17/ CATEGORIES:D-Coupon IST CITC Reliability Testing ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260527T150000Z DTEND:20260527T160000Z DTSTAMP:20261019T184749 CREATED:20260506T152732Z LAST-MODIFIED:20260506T152732Z UID:40127-1779876000-1779879600@hdpusergroup.org SUMMARY:SIR Testing meeting DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/sir-testing-meeting-46/ CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260521T210000Z DTEND:20260521T220000Z DTSTAMP:20261019T184749 CREATED:20260507T220748Z LAST-MODIFIED:20260507T220748Z UID:40131-1779379200-1779382800@hdpusergroup.org SUMMARY:Glass Substrate Reliability Analysis DESCRIPTION:Glass Substrate Reliability Analysis URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-36/ CATEGORIES:Glass Substrate Reliability Analysis ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260521T160000Z DTEND:20260521T170000Z DTSTAMP:20261019T184749 CREATED:20260502T174759Z LAST-MODIFIED:20260502T174759Z UID:40114-1779361200-1779364800@hdpusergroup.org SUMMARY:TCE Materials DESCRIPTION:Review data received for Z and XY measurements. Discuss path forward. URL:https://hdpusergroup.org/event/tce-materials-5/ CATEGORIES:TCE Materials Dimensional Properties ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260521T150000Z DTEND:20260521T160000Z DTSTAMP:20261019T184749 CREATED:20260430T152111Z LAST-MODIFIED:20260430T152111Z UID:40102-1779357600-1779361200@hdpusergroup.org SUMMARY:Thin Dielectric Skew Project DESCRIPTION:Thin Dielectric Skew Project Meeting URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-8/ CATEGORIES:Thin Dielectric Skew ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260521T140000Z DTEND:20260521T150000Z DTSTAMP:20261019T184749 CREATED:20260430T141743Z LAST-MODIFIED:20260430T141743Z UID:40101-1779354000-1779357600@hdpusergroup.org SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-20/ CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260520T150000Z DTEND:20260520T160000Z DTSTAMP:20261019T184749 CREATED:20260513T172826Z LAST-MODIFIED:20260513T172826Z UID:40227-1779271200-1779274800@hdpusergroup.org SUMMARY:Better CAF Equation DESCRIPTION:Meeting URL:https://hdpusergroup.org/event/better-caf-equation-15/ CATEGORIES:Better CAF Acceleration Equation ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260520T010000Z DTEND:20260520T020000Z DTSTAMP:20261019T184749 CREATED:20260514T015545Z LAST-MODIFIED:20260514T015545Z UID:40235-1779220800-1779224400@hdpusergroup.org SUMMARY:Correlating CF Profile to Signal Integrity Project Call DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-36/ CATEGORIES:Correlating Copper Foil Profile to Signal Integrity ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260519T190000Z DTEND:20260519T200000Z DTSTAMP:20261019T184749 CREATED:20260507T140756Z LAST-MODIFIED:20260507T140756Z UID:40129-1779199200-1779202800@hdpusergroup.org SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call DESCRIPTION:Periodic Project Call URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-2/ CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260518T150000Z DTEND:20260518T160000Z DTSTAMP:20261019T184749 CREATED:20260504T160442Z LAST-MODIFIED:20260504T160442Z UID:40117-1779098400-1779102000@hdpusergroup.org SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-6/ CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2 ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260514T200000Z DTEND:20260514T210000Z DTSTAMP:20261019T184749 CREATED:20260430T204845Z LAST-MODIFIED:20260430T204845Z UID:40107-1778770800-1778774400@hdpusergroup.org SUMMARY:Cu Outer Layer Trace Adhesion DESCRIPTION:Review final report and DATA URL:https://hdpusergroup.org/event/cu-outer-layer-trace-adhesion/ CATEGORIES:Cu Outer Trace Adhesion ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT BEGIN:VEVENT DTSTART:20260514T190000Z DTEND:20260514T200000Z DTSTAMP:20261019T184749 CREATED:20260416T194737Z LAST-MODIFIED:20260416T194737Z UID:40034-1778767200-1778770800@hdpusergroup.org SUMMARY:Non-Glass Microvia Build-ups DESCRIPTION:Look at last round of FA \nWork on final report URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-20/ CATEGORIES:Non-Glass Microvia Build-ups ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org END:VEVENT END:VCALENDAR