BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220323T170000Z
DTEND:20220323T180000Z
DTSTAMP:20260508T034818
CREATED:20220128T193917Z
LAST-MODIFIED:20220308T214036Z
UID:21883-1648036800-1648040400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Low Ag Alloy Solderpaste -BGA leg project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting-2022-03-23/2022-03-23/
LOCATION:Virtual
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220318T140000Z
DTEND:20220318T150000Z
DTSTAMP:20260508T034818
CREATED:20220314T202527Z
LAST-MODIFIED:20220314T202527Z
UID:22272-1647594000-1647597600@hdpusergroup.org
SUMMARY:Presentation Prep
DESCRIPTION:Meeting to fix presentation 
URL:https://hdpusergroup.org/event/presentation-prep/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220317T190000Z
DTEND:20220317T200000Z
DTSTAMP:20260508T034818
CREATED:20220223T201157Z
LAST-MODIFIED:20220223T201157Z
UID:22063-1647525600-1647529200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Status update on boards and components 
URL:https://hdpusergroup.org/event/photonic-soldering-2-3/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220316T140000Z
DTEND:20220316T150000Z
DTSTAMP:20260508T034818
CREATED:20220302T160123Z
LAST-MODIFIED:20220302T160123Z
UID:22145-1647421200-1647424800@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220315T170000Z
DTEND:20220315T180000Z
DTSTAMP:20260508T034818
CREATED:20220307T165033Z
LAST-MODIFIED:20220307T165033Z
UID:22166-1647345600-1647349200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220315T150000Z
DTEND:20220315T160000Z
DTSTAMP:20260508T034818
CREATED:20220308T235107Z
LAST-MODIFIED:20220308T235107Z
UID:22223-1647338400-1647342000@hdpusergroup.org
SUMMARY:Backdrill Under BGA final report discussion
DESCRIPTION:Backdrill Under BGA final report discussion 
URL:https://hdpusergroup.org/event/backdrill-under-bga-final-report-discussion/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220314T150000Z
DTEND:20220314T160000Z
DTSTAMP:20260508T034818
CREATED:20220228T170606Z
LAST-MODIFIED:20220228T170606Z
UID:22108-1647252000-1647255600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-2/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220311T180000Z
DTEND:20220311T190000Z
DTSTAMP:20260508T034818
CREATED:20220304T191751Z
LAST-MODIFIED:20220304T191751Z
UID:22163-1647000000-1647003600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220310T190000Z
DTEND:20220310T200000Z
DTSTAMP:20260508T034818
CREATED:20220128T190226Z
LAST-MODIFIED:20220128T190226Z
UID:21870-1646917200-1646920800@hdpusergroup.org
SUMMARY:Cu Peel Strength II project meeting
DESCRIPTION:Cu Peel Strength II project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-ii-project-meeting/2022-03-10/
LOCATION:Virtual
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220310T010000Z
DTEND:20220310T020000Z
DTSTAMP:20260508T034818
CREATED:20220221T124526Z
LAST-MODIFIED:20220221T124526Z
UID:22003-1646852400-1646856000@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive  Project call
DESCRIPTION:Discuss Final report 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-22/
LOCATION:Virtual
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220309T150000Z
DTEND:20220309T160000Z
DTSTAMP:20260508T034818
CREATED:20220202T160539Z
LAST-MODIFIED:20220202T160539Z
UID:21911-1646816400-1646820000@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-4/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220304T160000Z
DTEND:20220304T170000Z
DTSTAMP:20260508T034818
CREATED:20220223T140500Z
LAST-MODIFIED:20220223T140500Z
UID:22054-1646388000-1646391600@hdpusergroup.org
SUMMARY:Board Thickness 2
DESCRIPTION:To examine Mike and Omar's proposal. \nStart working on report for things already completed\, 
URL:https://hdpusergroup.org/event/board-thickness-2-2/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220303T200000Z
DTEND:20220303T210000Z
DTSTAMP:20260508T034818
CREATED:20220203T201709Z
LAST-MODIFIED:20220203T201709Z
UID:21925-1646316000-1646319600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/pcb-feature-min-18/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220303T170000Z
DTEND:20220303T180000Z
DTSTAMP:20260508T034818
CREATED:20220224T174051Z
LAST-MODIFIED:20220224T174051Z
UID:22069-1646305200-1646308800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue trying to flesh out the project 
URL:https://hdpusergroup.org/event/microvia-rel-5/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220303T160000Z
DTEND:20220303T170000Z
DTSTAMP:20260508T034818
CREATED:20220203T171054Z
LAST-MODIFIED:20220203T171054Z
UID:21923-1646301600-1646305200@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-15/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220303T150000Z
DTEND:20220303T160000Z
DTSTAMP:20260508T034818
CREATED:20220303T155712Z
LAST-MODIFIED:20220303T155712Z
UID:22153-1646298000-1646301600@hdpusergroup.org
SUMMARY:Single Surface Finish project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-project-call-5/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220303T150000Z
DTEND:20220303T160000Z
DTSTAMP:20260508T034818
CREATED:20220209T205038Z
LAST-MODIFIED:20220209T205038Z
UID:21946-1646298000-1646301600@hdpusergroup.org
SUMMARY:Single Surface Finish project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-project-call-4/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220302T150000Z
DTEND:20220302T160000Z
DTSTAMP:20260508T034818
CREATED:20220218T144605Z
LAST-MODIFIED:20220218T144605Z
UID:21984-1646211600-1646215200@hdpusergroup.org
SUMMARY:ECM2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-meeting-2/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220302T010000Z
DTEND:20220302T020000Z
DTSTAMP:20260508T034818
CREATED:20211221T064640Z
LAST-MODIFIED:20211221T064640Z
UID:21725-1646161200-1646164800@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-10/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220301T180000Z
DTEND:20220301T190000Z
DTSTAMP:20260508T034818
CREATED:20220222T181921Z
LAST-MODIFIED:20220222T181921Z
UID:22051-1646136000-1646139600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Projects
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-projects/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220301T160000Z
DTEND:20220301T170000Z
DTSTAMP:20260508T034818
CREATED:20220222T163623Z
LAST-MODIFIED:20220222T163623Z
UID:22049-1646128800-1646132400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-7/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220228T160000Z
DTEND:20220228T170000Z
DTSTAMP:20260508T034818
CREATED:20220214T091233Z
LAST-MODIFIED:20220214T091233Z
UID:21958-1646042400-1646046000@hdpusergroup.org
SUMMARY:Kick-off of Final Finish Layer Deposits for High Frequency
DESCRIPTION:Kick-off of Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/kick-off-of-final-finish-layer-deposits-for-high-frequency/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220225T180000Z
DTEND:20220225T190000Z
DTSTAMP:20260508T034818
CREATED:20220222T181605Z
LAST-MODIFIED:20220222T181605Z
UID:22050-1645790400-1645794000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-8/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220225T150000Z
DTEND:20220225T160000Z
DTSTAMP:20260508T034818
CREATED:20220211T153300Z
LAST-MODIFIED:20220211T153300Z
UID:21956-1645779600-1645783200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-9/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220224T160000Z
DTEND:20220224T170000Z
DTSTAMP:20260508T034818
CREATED:20220202T180017Z
LAST-MODIFIED:20220202T180017Z
UID:21914-1645696800-1645700400@hdpusergroup.org
SUMMARY:Microvia reliability
DESCRIPTION:Continued Discussion 
URL:https://hdpusergroup.org/event/microvia-reliability-2/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220224T140000Z
DTEND:20220224T150000Z
DTSTAMP:20260508T034818
CREATED:20220222T233014Z
LAST-MODIFIED:20220222T233014Z
UID:22053-1645689600-1645693200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua to explain the back drill results to Thilo. \nStart working on final report 
URL:https://hdpusergroup.org/event/disc2a-42/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220223T210000Z
DTEND:20220223T220000Z
DTSTAMP:20260508T034818
CREATED:20220223T201406Z
LAST-MODIFIED:20220223T201406Z
UID:21916-1645628400-1645632000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Hopefully\, our first Omplementation meeting! 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-13/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220223T190000Z
DTEND:20220223T200000Z
DTSTAMP:20260508T034818
CREATED:20220218T174542Z
LAST-MODIFIED:20220218T174542Z
UID:21986-1645621200-1645624800@hdpusergroup.org
SUMMARY:Glass Type Comparison Feb 23\, 2022 project meeting
DESCRIPTION:Glass Type Comparison Feb 23\, 2022 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-feb-23-2022-project-meeting/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220223T160000Z
DTEND:20220223T170000Z
DTSTAMP:20260508T034818
CREATED:20220114T163151Z
LAST-MODIFIED:20220114T163151Z
UID:21807-1645610400-1645614000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-17/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220222T160000Z
DTEND:20220222T170000Z
DTSTAMP:20260508T034818
CREATED:20220215T134143Z
LAST-MODIFIED:20220215T134143Z
UID:21962-1645524000-1645527600@hdpusergroup.org
SUMMARY:Reliability and Power Cycles
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-6/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR