BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220804T130000Z
DTEND:20220804T140000Z
DTSTAMP:20260506T155301
CREATED:20220728T184648Z
LAST-MODIFIED:20220728T184648Z
UID:22983-1659600000-1659603600@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Possible test houses \nWhat exactly will we tackle that will be different than other ventures? 
URL:https://hdpusergroup.org/event/sir-next-ev/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220803T180000Z
DTEND:20220803T190000Z
DTSTAMP:20260506T155301
CREATED:20220720T122829Z
LAST-MODIFIED:20220720T122829Z
UID:22958-1659531600-1659535200@hdpusergroup.org
SUMMARY:Glass type composition Project call
DESCRIPTION:Call to discuss project results 
URL:https://hdpusergroup.org/event/glass-type-composition-project-call/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220803T150000Z
DTEND:20220803T160000Z
DTSTAMP:20260506T155301
CREATED:20220720T160907Z
LAST-MODIFIED:20220720T160907Z
UID:22965-1659520800-1659524400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-4/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220802T170000Z
DTEND:20220802T180000Z
DTSTAMP:20260506T155301
CREATED:20220706T181214Z
LAST-MODIFIED:20220706T181214Z
UID:22905-1659441600-1659445200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-8/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220801T160000Z
DTEND:20220801T170000Z
DTSTAMP:20260506T155301
CREATED:20220719T123553Z
LAST-MODIFIED:20220719T123553Z
UID:22951-1659351600-1659355200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer Copper Balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-6/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220729T170000Z
DTEND:20220729T180000Z
DTSTAMP:20260506T155301
CREATED:20220715T174156Z
LAST-MODIFIED:20220715T174156Z
UID:22941-1659096000-1659099600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Call
DESCRIPTION:Project Status Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-call-4/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T200000Z
DTEND:20220728T210000Z
DTSTAMP:20260506T155301
CREATED:20220714T201524Z
LAST-MODIFIED:20220714T201524Z
UID:22938-1659020400-1659024000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Coupons should be in Kevin's hands by the time of this meeting. 
URL:https://hdpusergroup.org/event/pcb-feature-min-24/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T190000Z
DTEND:20220728T200000Z
DTSTAMP:20260506T155301
CREATED:20220714T192645Z
LAST-MODIFIED:20220714T192645Z
UID:22937-1659016800-1659020400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Do we have a build house? 
URL:https://hdpusergroup.org/event/microvia-rel-14/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T190000Z
DTEND:20220728T200000Z
DTSTAMP:20260506T155301
CREATED:20220714T191710Z
LAST-MODIFIED:20220714T191710Z
UID:22936-1659016800-1659020400@hdpusergroup.org
SUMMARY:Micronia Rel
DESCRIPTION:Do we have a build house? 
URL:https://hdpusergroup.org/event/micronia-rel/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T180000Z
DTEND:20220728T190000Z
DTSTAMP:20260506T155301
CREATED:20220719T134701Z
LAST-MODIFIED:20220719T134701Z
UID:22956-1659013200-1659016800@hdpusergroup.org
SUMMARY:Project Call Cu Peel Strength 2
DESCRIPTION:Project call to discuss results 
URL:https://hdpusergroup.org/event/project-call-cu-peel-strength-2/
LOCATION:Virtual
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T160000Z
DTEND:20220728T170000Z
DTSTAMP:20260506T155301
CREATED:20220718T155350Z
LAST-MODIFIED:20220718T155350Z
UID:22949-1659006000-1659009600@hdpusergroup.org
SUMMARY:Copper Surface Treatment vs Loss Project Call
DESCRIPTION:Go over Joe's final Data analysis 
URL:https://hdpusergroup.org/event/copper-surface-treatment-vs-loss-project-call/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T140000Z
DTEND:20220728T150000Z
DTSTAMP:20260506T155301
CREATED:20220718T154130Z
LAST-MODIFIED:20220718T154130Z
UID:22948-1658998800-1659002400@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting-7/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T130000Z
DTEND:20220728T140000Z
DTSTAMP:20260506T155301
CREATED:20220714T132516Z
LAST-MODIFIED:20220714T132516Z
UID:22934-1658995200-1658998800@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Project updates from Ara\, Tim and Thilo 
URL:https://hdpusergroup.org/event/photonic-soldering-2-8/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220727T183000Z
DTEND:20220727T193000Z
DTSTAMP:20260506T155301
CREATED:20220715T181343Z
LAST-MODIFIED:20220715T181343Z
UID:22944-1658928600-1658932200@hdpusergroup.org
SUMMARY:AGC\, HDP technical direction discussion
DESCRIPTION:AGC\, HDP technical direction discussion 
URL:https://hdpusergroup.org/event/agc-hdp-technical-direction-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220727T140000Z
DTEND:20220727T150000Z
DTSTAMP:20260506T155301
CREATED:20220713T163621Z
LAST-MODIFIED:20220713T163621Z
UID:22931-1658912400-1658916000@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-9/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220726T160000Z
DTEND:20220726T170000Z
DTSTAMP:20260506T155301
CREATED:20220719T124424Z
LAST-MODIFIED:20220719T124424Z
UID:22953-1658833200-1658836800@hdpusergroup.org
SUMMARY:Reduced Cost CAf telecom
DESCRIPTION:Reduced Cost CAf telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-2/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220721T140000Z
DTEND:20220721T150000Z
DTSTAMP:20260506T155301
CREATED:20220707T142358Z
LAST-MODIFIED:20220707T142358Z
UID:22909-1658394000-1658397600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-14/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220720T160000Z
DTEND:20220720T170000Z
DTSTAMP:20260506T155301
CREATED:20220706T162404Z
LAST-MODIFIED:20220706T162404Z
UID:22903-1658314800-1658318400@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Sample status 
URL:https://hdpusergroup.org/event/ta-method-2/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220720T150000Z
DTEND:20220720T160000Z
DTSTAMP:20260506T155301
CREATED:20220706T160703Z
LAST-MODIFIED:20220706T160703Z
UID:22902-1658311200-1658314800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-3/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220715T170000Z
DTEND:20220715T180000Z
DTSTAMP:20260506T155301
CREATED:20220628T203659Z
LAST-MODIFIED:20220628T203659Z
UID:22874-1657886400-1657890000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T200000Z
DTEND:20220714T210000Z
DTSTAMP:20260506T155301
CREATED:20220630T200909Z
LAST-MODIFIED:20220630T200909Z
UID:22894-1657810800-1657814400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Calumet status 
URL:https://hdpusergroup.org/event/pcb-feature-min-23/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T190000Z
DTEND:20220714T200000Z
DTSTAMP:20260506T155301
CREATED:20220630T192324Z
LAST-MODIFIED:20220630T192324Z
UID:22893-1657807200-1657810800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review quotes \nFollow up on what Paul puts together out of previous minutes and what Kuldip proposed 
URL:https://hdpusergroup.org/event/microvia-rel-13/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T160000Z
DTEND:20220714T170000Z
DTSTAMP:20260506T155301
CREATED:20220623T161549Z
LAST-MODIFIED:20220623T161549Z
UID:22827-1657796400-1657800000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Project Call
DESCRIPTION:Review Data Analysis \nDiscuss Final Report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-3/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T140000Z
DTEND:20220714T150000Z
DTSTAMP:20260506T155301
CREATED:20220608T144843Z
LAST-MODIFIED:20220608T144843Z
UID:22747-1657789200-1657792800@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting-5/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T130000Z
DTEND:20220714T140000Z
DTSTAMP:20260506T155301
CREATED:20220630T133358Z
LAST-MODIFIED:20220630T133358Z
UID:22890-1657785600-1657789200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:What can we do for drop testing \nThermocouple update \nBuild Update 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-18/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T170000Z
DTEND:20220713T180000Z
DTSTAMP:20260506T155301
CREATED:20220629T172935Z
LAST-MODIFIED:20220629T172935Z
UID:22842-1657713600-1657717200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting/2022-07-13/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T140000Z
DTEND:20220713T150000Z
DTSTAMP:20260506T155301
CREATED:20220622T150531Z
LAST-MODIFIED:20220622T150531Z
UID:22819-1657702800-1657706400@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T010000Z
DTEND:20220713T020000Z
DTSTAMP:20260506T155301
CREATED:20220624T074026Z
LAST-MODIFIED:20220624T074026Z
UID:22746-1657656000-1657659600@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-13/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T160000Z
DTEND:20220712T170000Z
DTSTAMP:20260506T155301
CREATED:20220705T122058Z
LAST-MODIFIED:20220705T122058Z
UID:22898-1657623600-1657627200@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T150000Z
DTEND:20220712T160000Z
DTSTAMP:20260506T155301
CREATED:20220630T122654Z
LAST-MODIFIED:20220630T122654Z
UID:22889-1657620000-1657623600@hdpusergroup.org
SUMMARY:Manage Backdrill Transition Kickoff
DESCRIPTION:Manage Backdrill Transition Kickoff 
URL:https://hdpusergroup.org/event/manage-backdrill-transition-kickoff/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR