BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220920T170000Z
DTEND:20220920T180000Z
DTSTAMP:20260506T060311
CREATED:20220907T182533Z
LAST-MODIFIED:20220907T182533Z
UID:23173-1663675200-1663678800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Various models proposed for predicting signal integrity. Huray model under consideration. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-2/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220915T190000Z
DTEND:20220915T200000Z
DTSTAMP:20260506T060311
CREATED:20220915T232034Z
LAST-MODIFIED:20220915T232034Z
UID:23193-1663250400-1663254000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:More work on defining project 
URL:https://hdpusergroup.org/event/microvia-rel-18/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220915T190000Z
DTEND:20220915T200000Z
DTSTAMP:20260506T060311
CREATED:20220901T200008Z
LAST-MODIFIED:20220901T200008Z
UID:23157-1663250400-1663254000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Hopefully pick one or two fabricatoes\, start assigning tasks and setting dates 
URL:https://hdpusergroup.org/event/microvia-rel-17/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220915T150000Z
DTEND:20220915T160000Z
DTSTAMP:20260506T060311
CREATED:20220824T152706Z
LAST-MODIFIED:20220824T152706Z
UID:23108-1663236000-1663239600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-16/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220914T180000Z
DTEND:20220914T190000Z
DTSTAMP:20260506T060311
CREATED:20220811T220029Z
LAST-MODIFIED:20220811T220029Z
UID:23056-1663160400-1663164000@hdpusergroup.org
SUMMARY:Glass Composition
DESCRIPTION:REview latest results and path forward. 
URL:https://hdpusergroup.org/event/glass-composition-2/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220914T150000Z
DTEND:20220914T160000Z
DTSTAMP:20260506T060311
CREATED:20220831T161433Z
LAST-MODIFIED:20220831T161433Z
UID:23148-1663149600-1663153200@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Reduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220914T140000Z
DTEND:20220914T150000Z
DTSTAMP:20260506T060311
CREATED:20220831T135546Z
LAST-MODIFIED:20220831T135546Z
UID:23147-1663146000-1663149600@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-next-ev-3/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220912T150000Z
DTEND:20220912T160000Z
DTSTAMP:20260506T060311
CREATED:20220822T154006Z
LAST-MODIFIED:20220822T154006Z
UID:23097-1662976800-1662980400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-10/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220909T170000Z
DTEND:20220909T180000Z
DTSTAMP:20260506T060311
CREATED:20220830T171611Z
LAST-MODIFIED:20220830T171611Z
UID:23144-1662724800-1662728400@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-9/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220908T190000Z
DTEND:20220908T200000Z
DTSTAMP:20260506T060311
CREATED:20220825T200700Z
LAST-MODIFIED:20220825T200700Z
UID:23128-1662645600-1662649200@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Progress on test vehicle production 
URL:https://hdpusergroup.org/event/photo-solder-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220908T180000Z
DTEND:20220908T190000Z
DTSTAMP:20260506T060311
CREATED:20220823T134207Z
LAST-MODIFIED:20220823T134207Z
UID:23105-1662642000-1662645600@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review latest progress on the TV builds and other data necessary to move project forward\, 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-2/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220908T160000Z
DTEND:20220908T170000Z
DTSTAMP:20260506T060311
CREATED:20220901T171131Z
LAST-MODIFIED:20220901T171131Z
UID:23156-1662634800-1662638400@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Updates on sample prep\, shipping and testing 
URL:https://hdpusergroup.org/event/ta-method-5/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220907T160000Z
DTEND:20220907T170000Z
DTSTAMP:20260506T060311
CREATED:20220810T164146Z
LAST-MODIFIED:20220810T164146Z
UID:23046-1662548400-1662552000@hdpusergroup.org
SUMMARY:Backdrill Transition Telecom
DESCRIPTION:Backdrill Transition Telecom 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220906T150000Z
DTEND:20220906T160000Z
DTSTAMP:20260506T060311
CREATED:20220901T165758Z
LAST-MODIFIED:20220901T165758Z
UID:23152-1662458400-1662462000@hdpusergroup.org
SUMMARY:Technical Direction
DESCRIPTION:Technical direction discussion 
URL:https://hdpusergroup.org/event/technical-direction/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220902T160000Z
DTEND:20220902T170000Z
DTSTAMP:20260506T060311
CREATED:20220811T233845Z
LAST-MODIFIED:20220811T233845Z
UID:23057-1662116400-1662120000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discuss whether or not to continue projet  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-2/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220902T140000Z
DTEND:20220902T150000Z
DTSTAMP:20260506T060311
CREATED:20220813T043117Z
LAST-MODIFIED:20220813T043117Z
UID:23018-1662109200-1662112800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-16/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T190000Z
DTEND:20220901T200000Z
DTSTAMP:20260506T060311
CREATED:20220823T152407Z
LAST-MODIFIED:20220823T152407Z
UID:23106-1662040800-1662044400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue fleshing out project parameters 
URL:https://hdpusergroup.org/event/microvia-rel-16/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T160000Z
DTEND:20220901T170000Z
DTSTAMP:20260506T060311
CREATED:20220811T170932Z
LAST-MODIFIED:20220811T170932Z
UID:23053-1662030000-1662033600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:All samples should have complleted initial manufacture. \nAll samples requiring etching should have reached Jenny \nJenny and Sarah will have completed more testing 
URL:https://hdpusergroup.org/event/ta-method-4/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T150000Z
DTEND:20220901T160000Z
DTSTAMP:20260506T060311
CREATED:20220817T160030Z
LAST-MODIFIED:20220817T160030Z
UID:23075-1662026400-1662030000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-6/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T140000Z
DTEND:20220901T150000Z
DTSTAMP:20260506T060311
CREATED:20220823T125313Z
LAST-MODIFIED:20220823T125313Z
UID:23104-1662022800-1662026400@hdpusergroup.org
SUMMARY:Better CAF EQ
DESCRIPTION:Updates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-21/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T160000Z
DTEND:20220831T170000Z
DTSTAMP:20260506T060311
CREATED:20220817T140933Z
LAST-MODIFIED:20220817T140933Z
UID:23073-1661943600-1661947200@hdpusergroup.org
SUMMARY:ECM3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm3-meeting/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T150000Z
DTEND:20220831T160000Z
DTSTAMP:20260506T060311
CREATED:20220818T163602Z
LAST-MODIFIED:20220818T163602Z
UID:23091-1661940000-1661943600@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-4/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T130000Z
DTEND:20220831T140000Z
DTSTAMP:20260506T060311
CREATED:20220804T134921Z
LAST-MODIFIED:20220804T134921Z
UID:23017-1661932800-1661936400@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Last chance for getting participants for high voltage testing? \nIf no participants\, then move to Phase 2 (low voltage testing). 
URL:https://hdpusergroup.org/event/sir-next-ev-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220830T170000Z
DTEND:20220830T180000Z
DTSTAMP:20260506T060311
CREATED:20220808T125309Z
LAST-MODIFIED:20220808T125309Z
UID:23019-1661860800-1661864400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220829T160000Z
DTEND:20220829T170000Z
DTSTAMP:20260506T060311
CREATED:20220822T171909Z
LAST-MODIFIED:20220822T171909Z
UID:22993-1661770800-1661774400@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-18/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220826T170000Z
DTEND:20220826T180000Z
DTSTAMP:20260506T060311
CREATED:20220817T144426Z
LAST-MODIFIED:20220817T144426Z
UID:23074-1661515200-1661518800@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis Project
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-8/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T190000Z
DTEND:20220825T200000Z
DTSTAMP:20260506T060312
CREATED:20220811T130926Z
LAST-MODIFIED:20220811T130926Z
UID:23048-1661436000-1661439600@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Update from Ara 
URL:https://hdpusergroup.org/event/photonic-soldering-2-9/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T160000Z
DTEND:20220825T170000Z
DTSTAMP:20260506T060312
CREATED:20220811T194714Z
LAST-MODIFIED:20220811T194714Z
UID:23055-1661425200-1661428800@hdpusergroup.org
SUMMARY:Copper Surface Treatment vs Loss Project C all
DESCRIPTION:Call to discuss outliers in data 
URL:https://hdpusergroup.org/event/copper-surface-treatment-vs-loss-project-c-all/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T140000Z
DTEND:20220825T150000Z
DTSTAMP:20260506T060312
CREATED:20220809T173533Z
LAST-MODIFIED:20220809T173533Z
UID:23035-1661418000-1661421600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-20/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220824T150000Z
DTEND:20220824T160000Z
DTSTAMP:20260506T060312
CREATED:20220811T144133Z
LAST-MODIFIED:20220811T144133Z
UID:23051-1661335200-1661338800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-15/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR