BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20221020T150000Z
DTEND:20221020T160000Z
DTSTAMP:20260506T003013
CREATED:20220922T162008Z
LAST-MODIFIED:20220922T162008Z
UID:23218-1666260000-1666263600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-8/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221019T190000Z
DTEND:20221019T200000Z
DTSTAMP:20260506T003013
CREATED:20220928T192352Z
LAST-MODIFIED:20220928T192352Z
UID:23250-1666188000-1666191600@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Status of thermcouples \nStatus on build with Pulse Forge 
URL:https://hdpusergroup.org/event/photo-solder-2-3/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221019T140000Z
DTEND:20221019T150000Z
DTSTAMP:20260506T003013
CREATED:20220928T145632Z
LAST-MODIFIED:20220928T145632Z
UID:23248-1666170000-1666173600@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221019T113000Z
DTEND:20221019T123000Z
DTSTAMP:20260506T003013
CREATED:20221018T142402Z
LAST-MODIFIED:20221018T142402Z
UID:23306-1666161000-1666164600@hdpusergroup.org
SUMMARY:Drop test new project discussion
DESCRIPTION:Call with Shunichi and Jack Tan 
URL:https://hdpusergroup.org/event/drop-test-new-project-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221017T150000Z
DTEND:20221017T160000Z
DTSTAMP:20260506T003013
CREATED:20220926T155513Z
LAST-MODIFIED:20220926T155513Z
UID:23236-1666000800-1666004400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-12/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221012T130000Z
DTEND:20221012T220000Z
DTSTAMP:20260506T003013
CREATED:20221007T151833Z
LAST-MODIFIED:20221007T151833Z
UID:22960-1665561600-1665594000@hdpusergroup.org
SUMMARY:HDP Fall Member Meeting
DESCRIPTION:The HDP Fall Member Meeting will be held October 12 & 13\, 2022 in Rock Hill\, South Carolina\, USA.  The meeting will be hosted by Atotech.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  The call information is provided below and ics files are available for download at the bottom of this page. \nMeeting Location: \nAtotech USA\, LLC1750 Overview DriveRock Hill\, SC 29730 USA \nThe closest airport to the meeting location is Charlotte Douglas\, approximately 40 minutes from the Atotech campus and Holiday Inn hotel. \nHotel Information:  \nHOLIDAY INN  \n503 Galleria BoulevardRock Hill\, SC 29730  \n RESERVATIONS: 1-803.323.1900  \nEMAIL: frontdesk@hirockhill.com \nAtotech rate including breakfast: $103.95 \nFor assistance with reservations please contact the HDP Administrator at kima77@hdpug.org. \nCall Information: \nDay 1 \n \n\n\n\n\nJoin meeting \n\n\n\n\nMore ways to join:Join from the meeting link –https://hdpug.webex.com/hdpug/j.php?MTID=m40df45df89ce53664a6d2302f7638787  \nJoin by meeting number –Meeting number (access code): 2557 065 8690Meeting password: HDPfall1 \nJoin by phone –1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nDay 2 \n \n\n\n\n\nJoin meeting \n\n\n\n\nMore ways to join:Join from the meeting link –https://hdpug.webex.com/hdpug/j.php?MTID=mba2c7776a726c404353d738cca8d8909  \nJoin by meeting number –Meeting number (access code): 2553 812 0356Meeting password: HDPfall2 \nJoin by phone –1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-fall-member-meeting-3/2022-10-12/
LOCATION:Rock Hill\, South Carolina
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221011T130000Z
DTEND:20221011T190000Z
DTSTAMP:20260506T003013
CREATED:20221005T153248Z
LAST-MODIFIED:20221005T153248Z
UID:23234-1665475200-1665496800@hdpusergroup.org
SUMMARY:HDP Board of Directors Meeting October 11\, 2022
DESCRIPTION:HDP Fall Board of Directors Meeting. 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-meeting-october-11-2022/
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221007T170000Z
DTEND:20221007T180000Z
DTSTAMP:20260506T003013
CREATED:20220926T135459Z
LAST-MODIFIED:20220926T135459Z
UID:23229-1665144000-1665147600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis
DESCRIPTION:Periodic Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-10/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221003T150000Z
DTEND:20221003T160000Z
DTSTAMP:20260506T003013
CREATED:20220922T133411Z
LAST-MODIFIED:20220922T133411Z
UID:23217-1664791200-1664794800@hdpusergroup.org
SUMMARY:ECM3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm3-meeting-3/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220930T140000Z
DTEND:20220930T150000Z
DTSTAMP:20260506T003013
CREATED:20220923T150004Z
LAST-MODIFIED:20220923T150004Z
UID:23225-1664528400-1664532000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-19/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220929T190000Z
DTEND:20220929T200000Z
DTSTAMP:20260506T003013
CREATED:20220922T194856Z
LAST-MODIFIED:20220922T194856Z
UID:23220-1664460000-1664463600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Call to discuss validation measurement status 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-3/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220929T150000Z
DTEND:20220929T160000Z
DTSTAMP:20260506T003013
CREATED:20220915T152055Z
LAST-MODIFIED:20220915T152055Z
UID:23190-1664445600-1664449200@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-17/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220929T140000Z
DTEND:20220929T150000Z
DTSTAMP:20260506T003013
CREATED:20220901T141420Z
LAST-MODIFIED:20220901T141420Z
UID:23153-1664442000-1664445600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Upates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-22/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220928T190000Z
DTEND:20220928T200000Z
DTSTAMP:20260506T003013
CREATED:20220908T192015Z
LAST-MODIFIED:20220908T192015Z
UID:23177-1664373600-1664377200@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Progress on building boards 
URL:https://hdpusergroup.org/event/photo-solder-2-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220928T160000Z
DTEND:20220928T170000Z
DTSTAMP:20260506T003013
CREATED:20220919T124747Z
LAST-MODIFIED:20220919T124747Z
UID:23195-1664362800-1664366400@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-5/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220928T140000Z
DTEND:20220928T150000Z
DTSTAMP:20260506T003013
CREATED:20220914T144611Z
LAST-MODIFIED:20220914T144611Z
UID:23184-1664355600-1664359200@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220928T020000Z
DTEND:20220928T030000Z
DTSTAMP:20260506T003013
CREATED:20220829T140659Z
LAST-MODIFIED:20220829T140659Z
UID:23044-1664312400-1664316000@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-43/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220928T010000Z
DTEND:20220928T020000Z
DTSTAMP:20260506T003013
CREATED:20220713T020116Z
LAST-MODIFIED:20220713T020116Z
UID:22929-1664308800-1664312400@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-14/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220927T170000Z
DTEND:20220927T180000Z
DTSTAMP:20260506T003013
CREATED:20220830T173037Z
LAST-MODIFIED:20220830T173037Z
UID:23145-1664280000-1664283600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Projects Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-projects-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220927T160000Z
DTEND:20220927T170000Z
DTSTAMP:20260506T003013
CREATED:20220908T145504Z
LAST-MODIFIED:20220908T145504Z
UID:23175-1664276400-1664280000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer Copper Balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-7/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220926T170000Z
DTEND:20220926T180000Z
DTSTAMP:20260506T003013
CREATED:20220920T172831Z
LAST-MODIFIED:20220920T172831Z
UID:23198-1664193600-1664197200@hdpusergroup.org
SUMMARY:Verify Webex Setup for October Member Meeting
DESCRIPTION:Verify Webex setup with Atotech IT staff. 
URL:https://hdpusergroup.org/event/verify-webex-setup-for-october-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220926T150000Z
DTEND:20220926T160000Z
DTSTAMP:20260506T003013
CREATED:20220912T154637Z
LAST-MODIFIED:20220912T154637Z
UID:23180-1664186400-1664190000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-11/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220923T170000Z
DTEND:20220923T180000Z
DTSTAMP:20260506T003013
CREATED:20220909T172727Z
LAST-MODIFIED:20220909T172727Z
UID:23179-1663934400-1663938000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-10/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220923T140000Z
DTEND:20220923T150000Z
DTSTAMP:20260506T003013
CREATED:20220902T150108Z
LAST-MODIFIED:20220902T150108Z
UID:23158-1663923600-1663927200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-17/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T200000Z
DTEND:20220922T210000Z
DTSTAMP:20260506T003013
CREATED:20220908T171302Z
LAST-MODIFIED:20220908T171302Z
UID:22985-1663858800-1663862400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Paul is flying to Calumet to see what is the status. 
URL:https://hdpusergroup.org/event/pcb-feature-min-25/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T190000Z
DTEND:20220922T200000Z
DTSTAMP:20260506T003013
CREATED:20220913T020946Z
LAST-MODIFIED:20220913T020946Z
UID:23126-1663855200-1663858800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Call
DESCRIPTION:Call to discuss Cisco measurements and Final report.  \nMoved to 22nd for key person attendance. \n  
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-call-2/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T180000Z
DTEND:20220922T190000Z
DTSTAMP:20260506T003013
CREATED:20220912T222104Z
LAST-MODIFIED:20220912T222104Z
UID:23181-1663851600-1663855200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Update on project from Jim Fuller. 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-3/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T160000Z
DTEND:20220922T170000Z
DTSTAMP:20260506T003013
CREATED:20220908T170445Z
LAST-MODIFIED:20220908T170445Z
UID:23176-1663844400-1663848000@hdpusergroup.org
SUMMARY:TA== Method
DESCRIPTION:Sample testing update 
URL:https://hdpusergroup.org/event/ta-method-6/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T150000Z
DTEND:20220922T160000Z
DTSTAMP:20260506T003013
CREATED:20220901T160603Z
LAST-MODIFIED:20220901T160603Z
UID:23154-1663840800-1663844400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-7/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220921T190000Z
DTEND:20220921T200000Z
DTSTAMP:20260506T003013
CREATED:20220921T180759Z
LAST-MODIFIED:20220921T180759Z
UID:23212-1663768800-1663772400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Meeting missing in system 
URL:https://hdpusergroup.org/event/microvia-rel-19/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR