BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20221117T170000Z
DTEND:20221117T180000Z
DTSTAMP:20260505T204145
CREATED:20221103T164619Z
LAST-MODIFIED:20221103T164619Z
UID:23366-1668682800-1668686400@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Next Update 
URL:https://hdpusergroup.org/event/ta-method-8/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T160000Z
DTEND:20221117T170000Z
DTSTAMP:20260505T204145
CREATED:20221103T153041Z
LAST-MODIFIED:20221103T153041Z
UID:23363-1668679200-1668682800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-10/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T010000Z
DTEND:20221117T020000Z
DTSTAMP:20260505T204145
CREATED:20221109T130722Z
LAST-MODIFIED:20221109T130722Z
UID:23405-1668625200-1668628800@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221116T170000Z
DTEND:20221116T180000Z
DTSTAMP:20260505T204145
CREATED:20221031T160636Z
LAST-MODIFIED:20221031T160636Z
UID:23246-1668596400-1668600000@hdpusergroup.org
SUMMARY:Backdrill Transition telecom
DESCRIPTION:Backdrill Transition telecom change 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom-3/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221116T150000Z
DTEND:20221116T160000Z
DTSTAMP:20260505T204145
CREATED:20221102T145344Z
LAST-MODIFIED:20221102T145344Z
UID:23361-1668589200-1668592800@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-4/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221115T203000Z
DTEND:20221115T213000Z
DTSTAMP:20260505T204145
CREATED:20221101T204009Z
LAST-MODIFIED:20221101T204009Z
UID:23358-1668522600-1668526200@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:Second meeting of website redesign team 
URL:https://hdpusergroup.org/event/website-redesign-team-2/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221115T170000Z
DTEND:20221115T180000Z
DTSTAMP:20260505T204145
CREATED:20221031T161037Z
LAST-MODIFIED:20221031T161037Z
UID:23245-1668510000-1668513600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing telecom
DESCRIPTION:Inner Layer Copper Balancing telecom change 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-telecom/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221114T170000Z
DTEND:20221114T180000Z
DTSTAMP:20260505T204145
CREATED:20221028T160118Z
LAST-MODIFIED:20221028T160118Z
UID:23349-1668423600-1668427200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Review previous work on Signal Integrtity from Materials #7 project.  \ndiscuss how to test model with the data from the Materials #7. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-3/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221114T160000Z
DTEND:20221114T170000Z
DTSTAMP:20260505T204145
CREATED:20221031T155905Z
LAST-MODIFIED:20221031T155905Z
UID:23351-1668420000-1668423600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-13/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221109T160000Z
DTEND:20221109T170000Z
DTSTAMP:20260505T204145
CREATED:20221026T160253Z
LAST-MODIFIED:20221026T160253Z
UID:23332-1667988000-1667991600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221108T140000Z
DTEND:20221108T150000Z
DTSTAMP:20260505T204145
CREATED:20221107T130318Z
LAST-MODIFIED:20221107T130318Z
UID:23373-1667894400-1667898000@hdpusergroup.org
SUMMARY:Weekly Staff Call
DESCRIPTION:Weekly Staff call 
URL:https://hdpusergroup.org/event/weekly-staff-call-2/2022-11-08/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221107T170000Z
DTEND:20221107T180000Z
DTSTAMP:20260505T204145
CREATED:20221025T132532Z
LAST-MODIFIED:20221025T132532Z
UID:23330-1667818800-1667822400@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-2/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221104T130000Z
DTEND:20221104T140000Z
DTSTAMP:20260505T204145
CREATED:20221103T210333Z
LAST-MODIFIED:20221103T210333Z
UID:23369-1667548800-1667552400@hdpusergroup.org
SUMMARY:Call to rework slides
DESCRIPTION:Rework slides 
URL:https://hdpusergroup.org/event/call-to-rework-slides/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221104T010000Z
DTEND:20221104T020000Z
DTSTAMP:20260505T204145
CREATED:20221102T132333Z
LAST-MODIFIED:20221102T132333Z
UID:23318-1667505600-1667509200@hdpusergroup.org
SUMMARY:New Idea Project Non Contact CF Profile Kick Off Meeting
DESCRIPTION:New Idea Project “CF Grade” Kick Off Meeting 
URL:https://hdpusergroup.org/event/new-idea-project-cf-grade-kick-off-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221103T160000Z
DTEND:20221103T170000Z
DTSTAMP:20260505T204145
CREATED:20221020T163510Z
LAST-MODIFIED:20221020T163510Z
UID:23322-1667473200-1667476800@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Further testing progress 
URL:https://hdpusergroup.org/event/ta-method-7/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221103T150000Z
DTEND:20221103T160000Z
DTSTAMP:20260505T204145
CREATED:20221020T162004Z
LAST-MODIFIED:20221020T162004Z
UID:23321-1667469600-1667473200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-9/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221102T140000Z
DTEND:20221102T150000Z
DTSTAMP:20260505T204145
CREATED:20221019T145255Z
LAST-MODIFIED:20221019T145255Z
UID:23309-1667379600-1667383200@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-3/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221101T193000Z
DTEND:20221101T203000Z
DTSTAMP:20260505T204145
CREATED:20221024T183816Z
LAST-MODIFIED:20221024T183816Z
UID:23329-1667313000-1667316600@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:First meeting of team to review website redesign. 
URL:https://hdpusergroup.org/event/website-redesign-team/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221101T180000Z
DTEND:20221101T190000Z
DTSTAMP:20260505T204145
CREATED:20220928T210909Z
LAST-MODIFIED:20220928T210909Z
UID:23251-1667307600-1667311200@hdpusergroup.org
SUMMARY:Glass Composition
DESCRIPTION:Review status of phase 3 and oven stressing from UL 
URL:https://hdpusergroup.org/event/glass-composition-3/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221031T150000Z
DTEND:20221031T160000Z
DTSTAMP:20260505T204145
CREATED:20221025T144353Z
LAST-MODIFIED:20221025T144353Z
UID:23305-1667210400-1667214000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Fequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-fequency/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221028T140000Z
DTEND:20221028T150000Z
DTSTAMP:20260505T204145
CREATED:20220930T150712Z
LAST-MODIFIED:20220930T150712Z
UID:23257-1666947600-1666951200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-18/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221027T200000Z
DTEND:20221027T210000Z
DTSTAMP:20260505T204145
CREATED:20221018T205934Z
LAST-MODIFIED:20221018T205934Z
UID:23239-1666882800-1666886400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Finally!  PCBs built and some testing started. 
URL:https://hdpusergroup.org/event/pcb-feature-min-26/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221027T190000Z
DTEND:20221027T200000Z
DTSTAMP:20260505T204145
CREATED:20221018T205810Z
LAST-MODIFIED:20221018T205810Z
UID:23238-1666879200-1666882800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Nail down more details 
URL:https://hdpusergroup.org/event/microvia-rel-20/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221027T170000Z
DTEND:20221027T180000Z
DTSTAMP:20260505T204145
CREATED:20221017T154127Z
LAST-MODIFIED:20221017T154127Z
UID:23255-1666872000-1666875600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-18/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221027T140000Z
DTEND:20221027T150000Z
DTSTAMP:20260505T204145
CREATED:20220929T150104Z
LAST-MODIFIED:20220929T150104Z
UID:23254-1666861200-1666864800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Testing updates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-23/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221026T150000Z
DTEND:20221026T160000Z
DTSTAMP:20260505T204145
CREATED:20221003T155128Z
LAST-MODIFIED:20221003T155128Z
UID:23259-1666778400-1666782000@hdpusergroup.org
SUMMARY:ECM3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm3-meeting-4/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221020T180000Z
DTEND:20221020T190000Z
DTSTAMP:20260505T204145
CREATED:20220927T143000Z
LAST-MODIFIED:20220927T143000Z
UID:23240-1666270800-1666274400@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review results of peel tests. 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-4/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221020T160000Z
DTEND:20221020T170000Z
DTSTAMP:20260505T204145
CREATED:20220922T170257Z
LAST-MODIFIED:20220922T170257Z
UID:23219-1666263600-1666267200@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Further testing progress 
URL:https://hdpusergroup.org/event/ta-methods/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221020T150000Z
DTEND:20221020T160000Z
DTSTAMP:20260505T204145
CREATED:20220922T162008Z
LAST-MODIFIED:20220922T162008Z
UID:23218-1666260000-1666263600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-8/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221019T190000Z
DTEND:20221019T200000Z
DTSTAMP:20260505T204145
CREATED:20220928T192352Z
LAST-MODIFIED:20220928T192352Z
UID:23250-1666188000-1666191600@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Status of thermcouples \nStatus on build with Pulse Forge 
URL:https://hdpusergroup.org/event/photo-solder-2-3/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR