BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20221214T160000Z
DTEND:20221214T170000Z
DTSTAMP:20260505T165109
CREATED:20221208T193356Z
LAST-MODIFIED:20221208T193356Z
UID:23507-1671012000-1671015600@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Use and validation of Hurray Model to measure signal integrity from copper surface roughness profile 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-4/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221213T200000Z
DTEND:20221213T210000Z
DTSTAMP:20260505T165109
CREATED:20221122T204113Z
LAST-MODIFIED:20221122T204113Z
UID:23460-1670940000-1670943600@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Possibe new reflow board build \nFirst drop test results? 
URL:https://hdpusergroup.org/event/photo-solder-2-4/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221212T170000Z
DTEND:20221212T180000Z
DTSTAMP:20260505T165109
CREATED:20221206T160522Z
LAST-MODIFIED:20221206T160522Z
UID:23499-1670842800-1670846400@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Reduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-4/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T200000Z
DTEND:20221208T210000Z
DTSTAMP:20260505T165109
CREATED:20221201T202427Z
LAST-MODIFIED:20221201T202427Z
UID:23483-1670508000-1670511600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Do we have a Team Leader? 
URL:https://hdpusergroup.org/event/microvia-rel-23/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T170000Z
DTEND:20221208T180000Z
DTSTAMP:20260505T165109
CREATED:20221117T195222Z
LAST-MODIFIED:20221117T195222Z
UID:23454-1670497200-1670500800@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Update on testing 
URL:https://hdpusergroup.org/event/ta-methods-2/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T160000Z
DTEND:20221208T170000Z
DTSTAMP:20260505T165109
CREATED:20221027T172028Z
LAST-MODIFIED:20221027T172028Z
UID:23341-1670493600-1670497200@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-19/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T160000Z
DTEND:20221207T170000Z
DTSTAMP:20260505T165109
CREATED:20221109T165250Z
LAST-MODIFIED:20221109T165250Z
UID:23408-1670407200-1670410800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-2/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T150000Z
DTEND:20221207T160000Z
DTSTAMP:20260505T165109
CREATED:20221116T160610Z
LAST-MODIFIED:20221116T160610Z
UID:23441-1670403600-1670407200@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/sir-testing-5/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T203000Z
DTEND:20221206T213000Z
DTSTAMP:20260505T165109
CREATED:20221115T210554Z
LAST-MODIFIED:20221115T210554Z
UID:23439-1670337000-1670340600@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:Website redesign team call to discuss feedback and pricing from website contractor. 
URL:https://hdpusergroup.org/event/website-redesign-team-3/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T180000Z
DTEND:20221206T190000Z
DTSTAMP:20260505T165109
CREATED:20221128T143445Z
LAST-MODIFIED:20221128T143445Z
UID:23462-1670328000-1670331600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Harsh Use Alloy Evaluations project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T170000Z
DTEND:20221206T180000Z
DTSTAMP:20260505T165109
CREATED:20221206T150654Z
LAST-MODIFIED:20221206T150654Z
UID:23438-1670324400-1670328000@hdpusergroup.org
SUMMARY:innerlayer copper balancing telecom
DESCRIPTION:innerlayer copper balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-19/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T010000Z
DTEND:20221206T020000Z
DTSTAMP:20260505T165109
CREATED:20221117T015524Z
LAST-MODIFIED:20221117T015524Z
UID:23449-1670266800-1670270400@hdpusergroup.org
SUMMARY:Non-Contact CF Profile Project Call
DESCRIPTION:Non-Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221205T160000Z
DTEND:20221205T170000Z
DTSTAMP:20260505T165109
CREATED:20221115T150101Z
LAST-MODIFIED:20221115T150101Z
UID:23431-1670234400-1670238000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-20/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T210000Z
DTEND:20221201T220000Z
DTSTAMP:20260505T165109
CREATED:20221116T213558Z
LAST-MODIFIED:20221116T213558Z
UID:23347-1669906800-1669910400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Update from Kevin 
URL:https://hdpusergroup.org/event/pcb-feature-min-27/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T200000Z
DTEND:20221201T210000Z
DTSTAMP:20260505T165109
CREATED:20221128T142112Z
LAST-MODIFIED:20221128T142112Z
UID:23461-1669903200-1669906800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:The future of the project 
URL:https://hdpusergroup.org/event/microvia-rel-22/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T170000Z
DTEND:20221201T180000Z
DTSTAMP:20260505T165109
CREATED:20221117T155755Z
LAST-MODIFIED:20221117T155755Z
UID:23451-1669892400-1669896000@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Peel strength data for higher layer counts and today's new . \nTest samples have been completed and sent to those that will be conducting the testing and evaluation 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-5/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T160000Z
DTEND:20221201T170000Z
DTSTAMP:20260505T165109
CREATED:20221117T165447Z
LAST-MODIFIED:20221117T165447Z
UID:23453-1669888800-1669892400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-11/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T150000Z
DTEND:20221201T160000Z
DTSTAMP:20260505T165109
CREATED:20221101T151453Z
LAST-MODIFIED:20221101T151453Z
UID:23357-1669885200-1669888800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/better-caf-eq-24/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221130T210000Z
DTEND:20221130T220000Z
DTSTAMP:20260505T165109
CREATED:20221128T222629Z
LAST-MODIFIED:20221128T222629Z
UID:23464-1669820400-1669824000@hdpusergroup.org
SUMMARY:Copper Surface Treatment vs Loss Project call
DESCRIPTION:Scott has remeasured data on some of the samples. 
URL:https://hdpusergroup.org/event/copper-surface-treatment-vs-loss-project-call-2/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221122T200000Z
DTEND:20221122T210000Z
DTSTAMP:20260505T165109
CREATED:20221110T194738Z
LAST-MODIFIED:20221110T194738Z
UID:23412-1669125600-1669129200@hdpusergroup.org
SUMMARY:Photo Soldering 2
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/photo-soldering-2-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221122T180000Z
DTEND:20221122T190000Z
DTSTAMP:20260505T165109
CREATED:20221020T131049Z
LAST-MODIFIED:20221020T131049Z
UID:23258-1669118400-1669122000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Periodic Project Call \n  
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221121T170000Z
DTEND:20221121T180000Z
DTSTAMP:20260505T165109
CREATED:20221107T174147Z
LAST-MODIFIED:20221107T174147Z
UID:23393-1669028400-1669032000@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-3/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221118T180000Z
DTEND:20221118T190000Z
DTSTAMP:20260505T165109
CREATED:20221108T202047Z
LAST-MODIFIED:20221108T202047Z
UID:23402-1668772800-1668776400@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Closure Call
DESCRIPTION:This is a project closure meeting. Scott presented the closeout report in October and the final report has been submitted to the BoD for approval. The objectives of this meeting are to discuss lessons learned and potential future ULDK evaluations. 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-closure-call/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T200000Z
DTEND:20221117T210000Z
DTSTAMP:20260505T165109
CREATED:20221027T195343Z
LAST-MODIFIED:20221027T195343Z
UID:23346-1668693600-1668697200@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Status wrt going to Implementation 
URL:https://hdpusergroup.org/event/microvia-rel-21/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T170000Z
DTEND:20221117T180000Z
DTSTAMP:20260505T165109
CREATED:20221103T164619Z
LAST-MODIFIED:20221103T164619Z
UID:23366-1668682800-1668686400@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Next Update 
URL:https://hdpusergroup.org/event/ta-method-8/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T160000Z
DTEND:20221117T170000Z
DTSTAMP:20260505T165109
CREATED:20221103T153041Z
LAST-MODIFIED:20221103T153041Z
UID:23363-1668679200-1668682800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-10/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221117T010000Z
DTEND:20221117T020000Z
DTSTAMP:20260505T165109
CREATED:20221109T130722Z
LAST-MODIFIED:20221109T130722Z
UID:23405-1668625200-1668628800@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221116T170000Z
DTEND:20221116T180000Z
DTSTAMP:20260505T165109
CREATED:20221031T160636Z
LAST-MODIFIED:20221031T160636Z
UID:23246-1668596400-1668600000@hdpusergroup.org
SUMMARY:Backdrill Transition telecom
DESCRIPTION:Backdrill Transition telecom change 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom-3/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221116T150000Z
DTEND:20221116T160000Z
DTSTAMP:20260505T165109
CREATED:20221102T145344Z
LAST-MODIFIED:20221102T145344Z
UID:23361-1668589200-1668592800@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-4/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221115T203000Z
DTEND:20221115T213000Z
DTSTAMP:20260505T165109
CREATED:20221101T204009Z
LAST-MODIFIED:20221101T204009Z
UID:23358-1668522600-1668526200@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:Second meeting of website redesign team 
URL:https://hdpusergroup.org/event/website-redesign-team-2/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR