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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20220313T080000
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DTSTART:20221106T070000
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DTSTART:20230312T080000
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230109T170000Z
DTEND:20230109T180000Z
DTSTAMP:20260505T132038
CREATED:20230103T161305Z
LAST-MODIFIED:20230103T161305Z
UID:23537-1673262000-1673265600@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-5/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230109T160000Z
DTEND:20230109T170000Z
DTSTAMP:20260505T132038
CREATED:20221219T163256Z
LAST-MODIFIED:20221219T163256Z
UID:23526-1673258400-1673262000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-15/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230109T150000Z
DTEND:20230109T160000Z
DTSTAMP:20260505T132038
CREATED:20221207T170744Z
LAST-MODIFIED:20221207T170744Z
UID:23502-1673254800-1673258400@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-6/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230105T210000Z
DTEND:20230105T220000Z
DTSTAMP:20260505T132038
CREATED:20221201T213955Z
LAST-MODIFIED:20221201T213955Z
UID:23484-1672930800-1672934400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Results of x-sectioning 
URL:https://hdpusergroup.org/event/pcb-feature-min-28/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230105T160000Z
DTEND:20230105T170000Z
DTSTAMP:20260505T132038
CREATED:20221206T182404Z
LAST-MODIFIED:20221206T182404Z
UID:23500-1672912800-1672916400@hdpusergroup.org
SUMMARY:Backdrill Transition telecom
DESCRIPTION:Backdrill Transition telecom 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230104T170000Z
DTEND:20230104T180000Z
DTSTAMP:20260505T132038
CREATED:20221208T175328Z
LAST-MODIFIED:20221208T175328Z
UID:23506-1672830000-1672833600@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ta-methods-3/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221221T200000Z
DTEND:20221221T210000Z
DTSTAMP:20260505T132038
CREATED:20221212T193051Z
LAST-MODIFIED:20221212T193051Z
UID:23482-1671631200-1671634800@hdpusergroup.org
SUMMARY:Cu surface treatment vs loss project call
DESCRIPTION:Need to move so Joe can schedule \nCall to discuss Joe’s analysis of base loss measurements 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-4/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221220T180000Z
DTEND:20221220T190000Z
DTSTAMP:20260505T132038
CREATED:20221212T172513Z
LAST-MODIFIED:20221212T172513Z
UID:23515-1671537600-1671541200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Harsh Use Alloy Evaluations Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221219T160000Z
DTEND:20221219T170000Z
DTSTAMP:20260505T132038
CREATED:20221205T165128Z
LAST-MODIFIED:20221205T165128Z
UID:23492-1671444000-1671447600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-14/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221219T123000Z
DTEND:20221219T130000Z
DTSTAMP:20260505T132038
CREATED:20221216T134314Z
LAST-MODIFIED:20221216T134314Z
UID:23521-1671431400-1671433200@hdpusergroup.org
SUMMARY:Call to discuss bonus distribution
DESCRIPTION:Call to discuss your 2022 bonus distribution 
URL:https://hdpusergroup.org/event/call-to-discuss-bonus-distribution-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221219T120000Z
DTEND:20221220T003000Z
DTSTAMP:20260505T132038
CREATED:20221216T134029Z
LAST-MODIFIED:20221216T134029Z
UID:23520-1671429600-1671474600@hdpusergroup.org
SUMMARY:Call to discuss bonus distribution
DESCRIPTION:Call to go over your 2022 bonus award 
URL:https://hdpusergroup.org/event/call-to-discuss-bonus-distribution/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221216T150000Z
DTEND:20221216T160000Z
DTSTAMP:20260505T132038
CREATED:20221201T145646Z
LAST-MODIFIED:20221201T145646Z
UID:23348-1671181200-1671184800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-20/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221215T200000Z
DTEND:20221215T220000Z
DTSTAMP:20260505T132038
CREATED:20221121T212608Z
LAST-MODIFIED:20221121T212608Z
UID:23456-1671112800-1671120000@hdpusergroup.org
SUMMARY:Board of Directors Operating Plan Performance Review
DESCRIPTION:Board of Directors call to review the HDP Operating Plan Performance and end of year budget projections. 
URL:https://hdpusergroup.org/event/board-of-directors-operating-plan-performance-review/
LOCATION:Virtual
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221215T000000Z
DTEND:20221215T010000Z
DTSTAMP:20260505T132038
CREATED:20221212T080328Z
LAST-MODIFIED:20221212T080328Z
UID:23302-1671040800-1671044400@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-15/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221214T170000Z
DTEND:20221214T180000Z
DTSTAMP:20260505T132038
CREATED:20221201T172401Z
LAST-MODIFIED:20221201T172401Z
UID:23481-1671015600-1671019200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review/updates on Test Vehicles 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-6/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221214T160000Z
DTEND:20221214T170000Z
DTSTAMP:20260505T132038
CREATED:20221208T193356Z
LAST-MODIFIED:20221208T193356Z
UID:23507-1671012000-1671015600@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Use and validation of Hurray Model to measure signal integrity from copper surface roughness profile 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-4/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221213T200000Z
DTEND:20221213T210000Z
DTSTAMP:20260505T132038
CREATED:20221122T204113Z
LAST-MODIFIED:20221122T204113Z
UID:23460-1670940000-1670943600@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Possibe new reflow board build \nFirst drop test results? 
URL:https://hdpusergroup.org/event/photo-solder-2-4/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221212T170000Z
DTEND:20221212T180000Z
DTSTAMP:20260505T132038
CREATED:20221206T160522Z
LAST-MODIFIED:20221206T160522Z
UID:23499-1670842800-1670846400@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Reduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-4/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T200000Z
DTEND:20221208T210000Z
DTSTAMP:20260505T132038
CREATED:20221201T202427Z
LAST-MODIFIED:20221201T202427Z
UID:23483-1670508000-1670511600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Do we have a Team Leader? 
URL:https://hdpusergroup.org/event/microvia-rel-23/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T170000Z
DTEND:20221208T180000Z
DTSTAMP:20260505T132038
CREATED:20221117T195222Z
LAST-MODIFIED:20221117T195222Z
UID:23454-1670497200-1670500800@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Update on testing 
URL:https://hdpusergroup.org/event/ta-methods-2/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T160000Z
DTEND:20221208T170000Z
DTSTAMP:20260505T132038
CREATED:20221027T172028Z
LAST-MODIFIED:20221027T172028Z
UID:23341-1670493600-1670497200@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-19/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T160000Z
DTEND:20221207T170000Z
DTSTAMP:20260505T132038
CREATED:20221109T165250Z
LAST-MODIFIED:20221109T165250Z
UID:23408-1670407200-1670410800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-2/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T150000Z
DTEND:20221207T160000Z
DTSTAMP:20260505T132038
CREATED:20221116T160610Z
LAST-MODIFIED:20221116T160610Z
UID:23441-1670403600-1670407200@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/sir-testing-5/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T203000Z
DTEND:20221206T213000Z
DTSTAMP:20260505T132038
CREATED:20221115T210554Z
LAST-MODIFIED:20221115T210554Z
UID:23439-1670337000-1670340600@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:Website redesign team call to discuss feedback and pricing from website contractor. 
URL:https://hdpusergroup.org/event/website-redesign-team-3/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T180000Z
DTEND:20221206T190000Z
DTSTAMP:20260505T132038
CREATED:20221128T143445Z
LAST-MODIFIED:20221128T143445Z
UID:23462-1670328000-1670331600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Harsh Use Alloy Evaluations project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T170000Z
DTEND:20221206T180000Z
DTSTAMP:20260505T132038
CREATED:20221206T150654Z
LAST-MODIFIED:20221206T150654Z
UID:23438-1670324400-1670328000@hdpusergroup.org
SUMMARY:innerlayer copper balancing telecom
DESCRIPTION:innerlayer copper balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-19/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T010000Z
DTEND:20221206T020000Z
DTSTAMP:20260505T132038
CREATED:20221117T015524Z
LAST-MODIFIED:20221117T015524Z
UID:23449-1670266800-1670270400@hdpusergroup.org
SUMMARY:Non-Contact CF Profile Project Call
DESCRIPTION:Non-Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221205T160000Z
DTEND:20221205T170000Z
DTSTAMP:20260505T132038
CREATED:20221115T150101Z
LAST-MODIFIED:20221115T150101Z
UID:23431-1670234400-1670238000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-20/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T210000Z
DTEND:20221201T220000Z
DTSTAMP:20260505T132038
CREATED:20221116T213558Z
LAST-MODIFIED:20221116T213558Z
UID:23347-1669906800-1669910400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Update from Kevin 
URL:https://hdpusergroup.org/event/pcb-feature-min-27/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221201T200000Z
DTEND:20221201T210000Z
DTSTAMP:20260505T132038
CREATED:20221128T142112Z
LAST-MODIFIED:20221128T142112Z
UID:23461-1669903200-1669906800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:The future of the project 
URL:https://hdpusergroup.org/event/microvia-rel-22/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR