BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230214T170000Z
DTEND:20230215T003000Z
DTSTAMP:20260505T040533
CREATED:20230206T162659Z
LAST-MODIFIED:20230206T162659Z
UID:23638-1676372400-1676399400@hdpusergroup.org
SUMMARY:HDP Board of Directors  Feb 14 2023
DESCRIPTION:Annual meeting – Op Plan and Budget approval – Project moves \nCall Information \n \nWhen it’s time\, join the Webex meeting hereJoin meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m8158e26407a1b6e91db397544c6040a9 \nJoin by meeting numberMeeting number (access code): 2550 229 1773Meeting password: HDPFebBoD (43733226 from video systems)Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-feb-14-2023/
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230213T160000Z
DTEND:20230213T170000Z
DTSTAMP:20260505T040533
CREATED:20230227T163915Z
LAST-MODIFIED:20230227T163915Z
UID:23831-1676282400-1676286000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-18/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T190000Z
DTEND:20230209T200000Z
DTSTAMP:20260505T040533
CREATED:20230202T202515Z
LAST-MODIFIED:20230202T202515Z
UID:23731-1675947600-1675951200@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:update on CAF Testing quotes. \nFurther define project/Test vehicles \nDiscuss resources required 
URL:https://hdpusergroup.org/event/reduced-cost-caf-8/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T170000Z
DTEND:20230209T180000Z
DTSTAMP:20260505T040533
CREATED:20230112T175019Z
LAST-MODIFIED:20230112T175019Z
UID:23649-1675940400-1675944000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-9/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T160000Z
DTEND:20230209T170000Z
DTSTAMP:20260505T040533
CREATED:20230115T032550Z
LAST-MODIFIED:20230115T032550Z
UID:23657-1675936800-1675940400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-13/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T140000Z
DTEND:20230209T150000Z
DTSTAMP:20260505T040533
CREATED:20230112T140825Z
LAST-MODIFIED:20230112T140825Z
UID:23647-1675929600-1675933200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-26/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230208T190000Z
DTEND:20230208T200000Z
DTSTAMP:20260505T040533
CREATED:20230202T192735Z
LAST-MODIFIED:20230202T192735Z
UID:23730-1675861200-1675864800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Last review of Closeout presentation 
URL:https://hdpusergroup.org/event/pcb-feature-min-32/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230208T170000Z
DTEND:20230208T180000Z
DTSTAMP:20260505T040533
CREATED:20230111T180911Z
LAST-MODIFIED:20230111T180911Z
UID:23640-1675854000-1675857600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:More discussion\, plus presentation for meeting 
URL:https://hdpusergroup.org/event/ta-method-9/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T180000Z
DTEND:20230207T190000Z
DTSTAMP:20260505T040533
CREATED:20230125T154711Z
LAST-MODIFIED:20230125T154711Z
UID:23686-1675771200-1675774800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T160000Z
DTEND:20230207T170000Z
DTSTAMP:20260505T040533
CREATED:20230206T151230Z
LAST-MODIFIED:20230206T151230Z
UID:23736-1675764000-1675767600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-4/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T010000Z
DTEND:20230207T020000Z
DTSTAMP:20260505T040533
CREATED:20230110T020707Z
LAST-MODIFIED:20230110T020707Z
UID:23596-1675710000-1675713600@hdpusergroup.org
SUMMARY:Non-contact CF Profile Project Call
DESCRIPTION:Non-contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-3/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T000000Z
DTEND:20230207T010000Z
DTSTAMP:20260505T040533
CREATED:20230110T110522Z
LAST-MODIFIED:20230110T110522Z
UID:23519-1675706400-1675710000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-16/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230203T150000Z
DTEND:20230203T160000Z
DTSTAMP:20260505T040533
CREATED:20230113T153735Z
LAST-MODIFIED:20230113T153735Z
UID:23654-1675414800-1675418400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-21/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T210000Z
DTEND:20230202T220000Z
DTSTAMP:20260505T040533
CREATED:20230113T164240Z
LAST-MODIFIED:20230113T164240Z
UID:23655-1675350000-1675353600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:·       Discuss follow-on test to determine why Arsenic affects loss \n \n·       Discuss the final report
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-4/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T190000Z
DTEND:20230202T200000Z
DTSTAMP:20260505T040533
CREATED:20230119T192353Z
LAST-MODIFIED:20230119T192353Z
UID:23677-1675342800-1675346400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Complete Closeout presentation and work on Final Report 
URL:https://hdpusergroup.org/event/pcb-feature-min-31/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T170000Z
DTEND:20230202T180000Z
DTSTAMP:20260505T040533
CREATED:20230113T213845Z
LAST-MODIFIED:20230113T213845Z
UID:23656-1675335600-1675339200@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Present stack up for test vehicle. \nAnd resources moving forward. \ndevelop slides to move to implementation stage \n  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-5/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T160000Z
DTEND:20230202T180000Z
DTSTAMP:20260505T040533
CREATED:20230119T173758Z
LAST-MODIFIED:20230119T173758Z
UID:23675-1675332000-1675339200@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-7/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T200000Z
DTEND:20230201T210000Z
DTSTAMP:20260505T040533
CREATED:20230111T201242Z
LAST-MODIFIED:20230111T201242Z
UID:23641-1675260000-1675263600@hdpusergroup.org
SUMMARY:Photo Solder II
DESCRIPTION:Status on new boards \nStatus on x-sections \nFirst drop results \nMeeting presentation 
URL:https://hdpusergroup.org/event/photo-solder-ii-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T180000Z
DTEND:20230201T190000Z
DTSTAMP:20260505T040533
CREATED:20230112T201743Z
LAST-MODIFIED:20230112T201743Z
UID:23651-1675252800-1675256400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Work on members' meeting presentation \nSee if our design guys have anything to show 
URL:https://hdpusergroup.org/event/microvia-rel-26/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T170000Z
DTEND:20230201T180000Z
DTSTAMP:20260505T040533
CREATED:20230118T173758Z
LAST-MODIFIED:20230118T173758Z
UID:23668-1675249200-1675252800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review progress on peel strenghts\, IST\, microsections and SI 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-8/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230130T160000Z
DTEND:20230130T170000Z
DTSTAMP:20260505T040533
CREATED:20230109T165354Z
LAST-MODIFIED:20230109T165354Z
UID:23592-1675072800-1675076400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-16/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230126T170000Z
DTEND:20230126T180000Z
DTSTAMP:20260505T040533
CREATED:20230118T003927Z
LAST-MODIFIED:20230118T003927Z
UID:23599-1674730800-1674734400@hdpusergroup.org
SUMMARY:Backdrill transition
DESCRIPTION:backdrill transition 
URL:https://hdpusergroup.org/event/backdrill-transition/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230125T150000Z
DTEND:20230125T160000Z
DTSTAMP:20260505T040533
CREATED:20230109T152825Z
LAST-MODIFIED:20230109T152825Z
UID:23581-1674637200-1674640800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230124T180000Z
DTEND:20230124T190000Z
DTSTAMP:20260505T040533
CREATED:20230118T160854Z
LAST-MODIFIED:20230118T160854Z
UID:23667-1674561600-1674565200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T190000Z
DTEND:20230119T200000Z
DTSTAMP:20260505T040533
CREATED:20230112T182719Z
LAST-MODIFIED:20230112T182719Z
UID:23650-1674133200-1674136800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Writing report 
URL:https://hdpusergroup.org/event/pcb-feature-min-30/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T170000Z
DTEND:20230119T180000Z
DTSTAMP:20260505T040533
CREATED:20230109T173633Z
LAST-MODIFIED:20230109T173633Z
UID:23594-1674126000-1674129600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Redduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-6/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T160000Z
DTEND:20230119T170000Z
DTSTAMP:20260505T040533
CREATED:20221208T162331Z
LAST-MODIFIED:20221208T162331Z
UID:23505-1674122400-1674126000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-20/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T140000Z
DTEND:20230119T150000Z
DTSTAMP:20260505T040533
CREATED:20230117T150334Z
LAST-MODIFIED:20230117T150334Z
UID:23661-1674115200-1674118800@hdpusergroup.org
SUMMARY:A meeting with NXTEC
DESCRIPTION:HDP Value & Technical Direction 
URL:https://hdpusergroup.org/event/a-meeting-with-nxtec/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T180000Z
DTEND:20230118T190000Z
DTSTAMP:20260505T040533
CREATED:20221201T145251Z
LAST-MODIFIED:20221201T145251Z
UID:23475-1674043200-1674046800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting-2/2023-01-18/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T170000Z
DTEND:20230118T180000Z
DTSTAMP:20260505T040533
CREATED:20221218T061904Z
LAST-MODIFIED:20221218T061904Z
UID:23525-1674039600-1674043200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Deternining if peel strengths less that 4 lbs/inch will be reliable 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-7/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR