BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230414T150000Z
DTEND:20230414T160000Z
DTSTAMP:20260504T120852
CREATED:20230405T035720Z
LAST-MODIFIED:20230405T035720Z
UID:23990-1681466400-1681470000@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Develop the idea stage of this project. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230414T140000Z
DTEND:20230414T150000Z
DTSTAMP:20260504T120852
CREATED:20230324T143056Z
LAST-MODIFIED:20230324T143056Z
UID:23958-1681462800-1681466400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-24/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T200000Z
DTEND:20230413T210000Z
DTSTAMP:20260504T120852
CREATED:20230323T130347Z
LAST-MODIFIED:20230323T130347Z
UID:23946-1681398000-1681401600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss - Project Call
DESCRIPTION:Review Final report draft 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-7/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T190000Z
DTEND:20230413T200000Z
DTSTAMP:20260504T120852
CREATED:20230330T192235Z
LAST-MODIFIED:20230330T192235Z
UID:23974-1681394400-1681398000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Final look at project report? 
URL:https://hdpusergroup.org/event/pcb-feature-min-36/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T160000Z
DTEND:20230413T170000Z
DTSTAMP:20260504T120852
CREATED:20230323T162937Z
LAST-MODIFIED:20230323T162937Z
UID:23950-1681383600-1681387200@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T150000Z
DTEND:20230413T160000Z
DTSTAMP:20260504T120852
CREATED:20230323T153913Z
LAST-MODIFIED:20230323T153913Z
UID:23949-1681380000-1681383600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T200000Z
DTEND:20230412T210000Z
DTSTAMP:20260504T120852
CREATED:20230315T201721Z
LAST-MODIFIED:20230315T201721Z
UID:23912-1681311600-1681315200@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Ptrogress on: second reflow batch manufacture\, x-sectioing of same and drop testing 
URL:https://hdpusergroup.org/event/photo-solder-2-6/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T160000Z
DTEND:20230412T170000Z
DTSTAMP:20260504T120852
CREATED:20230330T135719Z
LAST-MODIFIED:20230330T135719Z
UID:23972-1681297200-1681300800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Continued vetting of the results for peel strength  
URL:https://hdpusergroup.org/event/cu-peel-strength-2-11/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230411T160000Z
DTEND:20230411T170000Z
DTSTAMP:20260504T120852
CREATED:20230327T143854Z
LAST-MODIFIED:20230327T143854Z
UID:23962-1681210800-1681214400@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Copper surface roughness modeling valiadation. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-7/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230406T160000Z
DTEND:20230406T170000Z
DTSTAMP:20260504T120852
CREATED:20230329T154811Z
LAST-MODIFIED:20230329T154811Z
UID:23970-1680778800-1680782400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:More discussion on coupons\, subpanels and panel layouts. 
URL:https://hdpusergroup.org/event/microvia-rel-29/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230406T150000Z
DTEND:20230406T160000Z
DTSTAMP:20260504T120852
CREATED:20230315T220343Z
LAST-MODIFIED:20230315T220343Z
UID:23914-1680775200-1680778800@hdpusergroup.org
SUMMARY:Kick-Off meeting for Sequential Lamination -  Stress Factors and Failure Modes
DESCRIPTION:Kick Off 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-sequential-lamination-stress-factors-and-failure-modes/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T160000Z
DTEND:20230405T170000Z
DTSTAMP:20260504T120852
CREATED:20230327T172233Z
LAST-MODIFIED:20230327T172233Z
UID:23965-1680692400-1680696000@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage Project Call
DESCRIPTION:Project Planning Call 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage-project-call/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T150000Z
DTEND:20230405T160000Z
DTSTAMP:20260504T120852
CREATED:20230308T163448Z
LAST-MODIFIED:20230308T163448Z
UID:23887-1680688800-1680692400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-6/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T140000Z
DTEND:20230405T150000Z
DTSTAMP:20260504T120852
CREATED:20230308T163005Z
LAST-MODIFIED:20230308T163005Z
UID:23886-1680685200-1680688800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-4/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230404T170000Z
DTEND:20230404T180000Z
DTSTAMP:20260504T120852
CREATED:20230314T144255Z
LAST-MODIFIED:20230314T144255Z
UID:23905-1680609600-1680613200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-4/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230403T150000Z
DTEND:20230403T160000Z
DTSTAMP:20260504T120852
CREATED:20230313T160700Z
LAST-MODIFIED:20230313T160700Z
UID:23902-1680516000-1680519600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-21/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230331T160000Z
DTEND:20230331T170000Z
DTSTAMP:20260504T120852
CREATED:20230330T150759Z
LAST-MODIFIED:20230330T150759Z
UID:23923-1680260400-1680264000@hdpusergroup.org
SUMMARY:Kick -off meeting-Permitivity of Cooling Liquids
DESCRIPTION:•In an immersion cooling system\, infrastructure equipment can be submerged in a non-conductive cooling liquid\n•Idea is to develop a model to predict permittivity of different cooling liquids for improved reliability and energy efficiency\n•Compare costs of each fluid vs other properties to determine best options
URL:https://hdpusergroup.org/event/kick-off-meeting-permitivity-of-cooling-liquids/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230331T010000Z
DTEND:20230331T020000Z
DTSTAMP:20260504T120852
CREATED:20230307T014717Z
LAST-MODIFIED:20230307T014717Z
UID:23878-1680206400-1680210000@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-5/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230330T190000Z
DTEND:20230330T200000Z
DTSTAMP:20260504T120852
CREATED:20230316T194455Z
LAST-MODIFIED:20230316T194455Z
UID:23919-1680184800-1680188400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Updates for final report\, if not already nailed down via email. If done\, move on to next project. 
URL:https://hdpusergroup.org/event/pcb-feature-min-35/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230330T160000Z
DTEND:20230330T170000Z
DTSTAMP:20260504T120852
CREATED:20230316T172923Z
LAST-MODIFIED:20230316T172923Z
UID:23918-1680174000-1680177600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Finalize project deliverables. Review quotes for CAF testing \n  
URL:https://hdpusergroup.org/event/reduced-cost-caf-12/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230329T170000Z
DTEND:20230329T180000Z
DTSTAMP:20260504T120852
CREATED:20230322T200232Z
LAST-MODIFIED:20230322T200232Z
UID:23945-1680091200-1680094800@hdpusergroup.org
SUMMARY:Ta Method
DESCRIPTION:Any additional expts or analysis 
URL:https://hdpusergroup.org/event/ta-method-12/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230329T160000Z
DTEND:20230329T170000Z
DTSTAMP:20260504T120852
CREATED:20230323T150510Z
LAST-MODIFIED:20230323T150510Z
UID:23911-1680087600-1680091200@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Follow up on data collected thus far. 
URL:https://hdpusergroup.org/event/copper-peel-strength-2-2/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230329T150000Z
DTEND:20230329T160000Z
DTSTAMP:20260504T120852
CREATED:20230314T164445Z
LAST-MODIFIED:20230314T164445Z
UID:23907-1680084000-1680087600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Progress on panel and coupon designs 
URL:https://hdpusergroup.org/event/microvia-rel-28/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230324T140000Z
DTEND:20230324T150000Z
DTSTAMP:20260504T120852
CREATED:20230306T060517Z
LAST-MODIFIED:20230306T060517Z
UID:23856-1679648400-1679652000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-23/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230323T170000Z
DTEND:20230323T180000Z
DTSTAMP:20260504T120852
CREATED:20230306T184210Z
LAST-MODIFIED:20230306T184210Z
UID:23759-1679572800-1679576400@hdpusergroup.org
SUMMARY:Inner Layer Cu Balance Project Call
DESCRIPTION:Call to discuss measurement results 
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230323T160000Z
DTEND:20230323T170000Z
DTSTAMP:20260504T120852
CREATED:20230302T172011Z
LAST-MODIFIED:20230302T172011Z
UID:23849-1679569200-1679572800@hdpusergroup.org
SUMMARY:Backdrill Transition Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/backdrill-transition-project-call/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230323T150000Z
DTEND:20230323T160000Z
DTSTAMP:20260504T120852
CREATED:20230309T164913Z
LAST-MODIFIED:20230309T164913Z
UID:23896-1679565600-1679569200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-15/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230323T140000Z
DTEND:20230323T150000Z
DTSTAMP:20260504T120852
CREATED:20230322T135754Z
LAST-MODIFIED:20230322T135754Z
UID:23942-1679562000-1679565600@hdpusergroup.org
SUMMARY:IPC precall
DESCRIPTION:Call to discuss IPC projects 
URL:https://hdpusergroup.org/event/ipc-precall/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230322T200000Z
DTEND:20230322T210000Z
DTSTAMP:20260504T120852
CREATED:20230311T183015Z
LAST-MODIFIED:20230311T183015Z
UID:23898-1679497200-1679500800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss – Project Call
DESCRIPTION:Yaw can't make the 23rd had to move to the 22nd. \nDiscuss Yaw Obeng Correlation and Michael Coll surface treatment plating info. 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-6/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230322T190000Z
DTEND:20230322T200000Z
DTSTAMP:20260504T120852
CREATED:20230321T125214Z
LAST-MODIFIED:20230321T125214Z
UID:23926-1679493600-1679497200@hdpusergroup.org
SUMMARY:Website Redesign Kick-Off Call
DESCRIPTION:Kick-Off call for website redesign team. 
URL:https://hdpusergroup.org/event/website-redesign-kick-off-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR