BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230616T140000Z
DTEND:20230616T150000Z
DTSTAMP:20260503T182048
CREATED:20230602T143121Z
LAST-MODIFIED:20230602T143121Z
UID:24221-1686906000-1686909600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF as IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF as IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-as-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230615T150000Z
DTEND:20230615T160000Z
DTSTAMP:20260503T182048
CREATED:20230523T153809Z
LAST-MODIFIED:20230523T153809Z
UID:24191-1686823200-1686826800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-26/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T160000Z
DTEND:20230614T170000Z
DTSTAMP:20260503T182048
CREATED:20230525T144229Z
LAST-MODIFIED:20230525T144229Z
UID:24199-1686740400-1686744000@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Determining reliability of materials based on peel strengths. And different copper foil types. 
URL:https://hdpusergroup.org/event/copper-peel-strength-2-4/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T150000Z
DTEND:20230614T160000Z
DTSTAMP:20260503T182048
CREATED:20230530T162101Z
LAST-MODIFIED:20230530T162101Z
UID:24209-1686736800-1686740400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230612T150000Z
DTEND:20230612T160000Z
DTSTAMP:20260503T182048
CREATED:20230515T154238Z
LAST-MODIFIED:20230515T154238Z
UID:24156-1686564000-1686567600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-24/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230606T230000Z
DTEND:20230607T080000Z
DTSTAMP:20260503T182048
CREATED:20230602T130612Z
LAST-MODIFIED:20230602T130612Z
UID:23792-1686074400-1686106800@hdpusergroup.org
SUMMARY:HDP June 2023 Asia Meeting
DESCRIPTION:The HDP June 2023 Asia Meeting will be held June 7 & 8\, 2023 (Japan Time) / June 6 & 7 (US Time) in Omiya\, Japan.  The meeting will be hosted by Mitsui Kinzoku.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  \nMeeting Location: \n \nSonic City Building \n1-7-5\, Sakuragi-cho\,  \nOmiya-ku\, Saitama-shi\, \nSaitama 330-8669\, Japan  \n \nHotel \nPalace Hotel OMIYA \n1-7-5\, Sakuragi-cho\,  \nOmiya-ku\, Saitama-shi\,  \nSaitama 330-0854\, Japan \nTEL: +81-48-647-3300  \nFAX: +81-48-647-0430  \nEMAIL: front@palace-omiya.co.jp \n \nDay 1 Call Information \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting link https://hdpug.webex.com/hdpug/j.php?MTID=mf668f1fda65bdd1c8dfec8a0c8d4663cJoin by meeting number Meeting number (access code): 2559 246 7238Meeting password: HDPAsia1Join by phone 1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n \nDay 2 Call Information \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m71c2e1939d4ddb219088b6ee0c8d9d42Join by meeting numberMeeting number (access code): 2552 999 8642Meeting password: HDPAsia2Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nCall ics files are available for download at the bottom of this page. 
URL:https://hdpusergroup.org/event/hdp-june-2023-asia-meeting/2023-06-07/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230606T180000Z
DTEND:20230606T190000Z
DTSTAMP:20260503T182048
CREATED:20230511T190304Z
LAST-MODIFIED:20230511T190304Z
UID:24145-1686056400-1686060000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:New name for project \nFurther flesh out project 
URL:https://hdpusergroup.org/event/pcb-feature-min-39/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230606T160000Z
DTEND:20230606T170000Z
DTSTAMP:20260503T182048
CREATED:20230517T153341Z
LAST-MODIFIED:20230517T153341Z
UID:24166-1686049200-1686052800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discuss latest results from roughness profile from TUC mass lam 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-3/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230606T040000Z
DTEND:20230606T070000Z
DTSTAMP:20260503T182048
CREATED:20230605T085925Z
LAST-MODIFIED:20230605T085925Z
UID:24224-1686006000-1686016800@hdpusergroup.org
SUMMARY:Member Meeting Pre-meeting AV Setup
DESCRIPTION:Member Meeting AV pre-meeting check. 
URL:https://hdpusergroup.org/event/member-meeting-pre-meeting-av-setup/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230602T150000Z
DTEND:20230602T160000Z
DTSTAMP:20260503T182048
CREATED:20230520T023655Z
LAST-MODIFIED:20230520T023655Z
UID:24176-1685700000-1685703600@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Cooling liquids are needed for certain electronic systems. what is not know is what liquids are more effective than others in terms of signal integrity and cost effectiveness. Additional concerns relate to degradation of the cabling and connectors used in these systems. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-4/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230602T140000Z
DTEND:20230602T150000Z
DTSTAMP:20260503T182048
CREATED:20230512T150548Z
LAST-MODIFIED:20230512T150548Z
UID:24148-1685696400-1685700000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-27/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230601T180000Z
DTEND:20230601T190000Z
DTSTAMP:20260503T182048
CREATED:20230530T005210Z
LAST-MODIFIED:20230530T005210Z
UID:24116-1685624400-1685628000@hdpusergroup.org
SUMMARY:Inner layer Cu Balance Project Call
DESCRIPTION:  \nReview latest data
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call-4/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230601T160000Z
DTEND:20230601T170000Z
DTSTAMP:20260503T182048
CREATED:20230518T161548Z
LAST-MODIFIED:20230518T161548Z
UID:24169-1685617200-1685620800@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T200000Z
DTEND:20230531T210000Z
DTSTAMP:20260503T182048
CREATED:20230503T202855Z
LAST-MODIFIED:20230503T202855Z
UID:24110-1685545200-1685548800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:% Au in solder joints. \nDrop test results\, if any. \nPresentation for Japan.
URL:https://hdpusergroup.org/event/photonic-soldering-ii-20/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T170000Z
DTEND:20230531T180000Z
DTSTAMP:20260503T182048
CREATED:20230516T160806Z
LAST-MODIFIED:20230516T160806Z
UID:24163-1685534400-1685538000@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-3/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T160000Z
DTEND:20230531T170000Z
DTSTAMP:20260503T182048
CREATED:20230504T160115Z
LAST-MODIFIED:20230504T160115Z
UID:24113-1685530800-1685534400@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Review status/results in progress for Phase 3 
URL:https://hdpusergroup.org/event/glass-type-comparison-2/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T150000Z
DTEND:20230531T160000Z
DTSTAMP:20260503T182048
CREATED:20230510T155504Z
LAST-MODIFIED:20230510T155504Z
UID:24139-1685527200-1685530800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-9/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230530T170000Z
DTEND:20230530T180000Z
DTSTAMP:20260503T182048
CREATED:20230504T132225Z
LAST-MODIFIED:20230504T132225Z
UID:24112-1685448000-1685451600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Periodic project review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-4/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230530T160000Z
DTEND:20230530T170000Z
DTSTAMP:20260503T182048
CREATED:20230506T172408Z
LAST-MODIFIED:20230506T172408Z
UID:24106-1685444400-1685448000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-7/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230525T190000Z
DTEND:20230525T200000Z
DTSTAMP:20260503T182048
CREATED:20230511T202819Z
LAST-MODIFIED:20230511T202819Z
UID:24146-1685023200-1685026800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Status on preparing for build \nReview of presentation for Japan 
URL:https://hdpusergroup.org/event/microvia-rel-32/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230525T150000Z
DTEND:20230525T160000Z
DTSTAMP:20260503T182048
CREATED:20230420T151338Z
LAST-MODIFIED:20230420T151338Z
UID:24057-1685008800-1685012400@hdpusergroup.org
SUMMARY:Better CAF eq
DESCRIPTION:Updates from Jason and Hubert \nComplete presentation for Japan meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-30/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230525T010000Z
DTEND:20230525T020000Z
DTSTAMP:20260503T182048
CREATED:20230524T055340Z
LAST-MODIFIED:20230524T055340Z
UID:24164-1684958400-1684962000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-18/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230524T200000Z
DTEND:20230524T210000Z
DTSTAMP:20260503T182048
CREATED:20230519T012650Z
LAST-MODIFIED:20230519T012650Z
UID:24168-1684940400-1684944000@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Reviewing data related to peel strength with different materials and copper foil types 
URL:https://hdpusergroup.org/event/copper-peel-strength-2-3/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230524T150000Z
DTEND:20230524T160000Z
DTSTAMP:20260503T182048
CREATED:20230428T170433Z
LAST-MODIFIED:20230428T170433Z
UID:24033-1684922400-1684926000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-17/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230524T010000Z
DTEND:20230524T020000Z
DTSTAMP:20260503T182048
CREATED:20230523T043822Z
LAST-MODIFIED:20230523T043822Z
UID:24070-1684872000-1684875600@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-7/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230523T170000Z
DTEND:20230523T180000Z
DTSTAMP:20260503T182048
CREATED:20230503T180732Z
LAST-MODIFIED:20230503T180732Z
UID:24109-1684843200-1684846800@hdpusergroup.org
SUMMARY:TA Eval
DESCRIPTION:Look at the data Tony has crunched. \nPrepare presentation for the Japan meeting. 
URL:https://hdpusergroup.org/event/ta-eval/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230523T150000Z
DTEND:20230523T160000Z
DTSTAMP:20260503T182048
CREATED:20230511T160308Z
LAST-MODIFIED:20230511T160308Z
UID:24144-1684836000-1684839600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-25/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230519T150000Z
DTEND:20230519T160000Z
DTSTAMP:20260503T182048
CREATED:20230429T145619Z
LAST-MODIFIED:20230429T145619Z
UID:24088-1684490400-1684494000@hdpusergroup.org
SUMMARY:Permittivity of cooling liquids
DESCRIPTION:discuss moving project to definition stage and lining up resources 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-3/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230518T160000Z
DTEND:20230518T170000Z
DTSTAMP:20260503T182048
CREATED:20230427T165554Z
LAST-MODIFIED:20230427T165554Z
UID:24076-1684407600-1684411200@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-3/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230517T180000Z
DTEND:20230517T190000Z
DTSTAMP:20260503T182048
CREATED:20230510T134939Z
LAST-MODIFIED:20230510T134939Z
UID:24127-1684328400-1684332000@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review data -prepare disussion for close-out 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-13/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR