BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230712T150000Z
DTEND:20230712T160000Z
DTSTAMP:20260503T125500
CREATED:20230615T155559Z
LAST-MODIFIED:20230615T155559Z
UID:24265-1689156000-1689159600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-27/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230707T140000Z
DTEND:20230707T150000Z
DTSTAMP:20260503T125500
CREATED:20230617T135655Z
LAST-MODIFIED:20230617T135655Z
UID:24268-1688720400-1688724000@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:Use of cooling fluids and measuring effectiveness of these fluids. Develope a model to predict performance of thwese fluids in terms of signal integrity and cooling performance. \nIn an immersion cooling system\, infrastructure equipment can be submerged in a non-conductive cooling liqui \nIdea is to develop a model to predict permittivity of different cooling liquids for improved reliability and energy efficiency \nCompare costs of each fluid vs other properties to determine best options. \nWhen using colling liquids for this application\, there is little understanding of the complex permittivity properties of these liquids \nThere are technical challenges that pose risks when trying to accurately model electrical performance of high-speed buses immersed in cooling liquids vs air \nWhat issues arise with permittivity when using different cooling liquids? \n  
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-2/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230706T150000Z
DTEND:20230706T160000Z
DTSTAMP:20260503T125500
CREATED:20230703T133450Z
LAST-MODIFIED:20230703T133450Z
UID:24355-1688637600-1688641200@hdpusergroup.org
SUMMARY:Call with Mike to discuss new microvia project
DESCRIPTION:Call to discuss Julie's idea 
URL:https://hdpusergroup.org/event/call-with-mike-to-discuss-new-microvia-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230629T150000Z
DTEND:20230629T160000Z
DTSTAMP:20260503T125500
CREATED:20230626T134800Z
LAST-MODIFIED:20230626T134800Z
UID:24309-1688032800-1688036400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Progress on Build 
URL:https://hdpusergroup.org/event/microvia-rel-34/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T190000Z
DTEND:20230628T200000Z
DTSTAMP:20260503T125500
CREATED:20230531T204722Z
LAST-MODIFIED:20230531T204722Z
UID:24218-1687960800-1687964400@hdpusergroup.org
SUMMARY:Photosolder II
DESCRIPTION:Update on master document\, thermocoupling\, ATC and drop testing  
URL:https://hdpusergroup.org/event/photosolder-ii/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T160000Z
DTEND:20230628T170000Z
DTSTAMP:20260503T125500
CREATED:20230531T163127Z
LAST-MODIFIED:20230531T163127Z
UID:24214-1687950000-1687953600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Reviewing results of different glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-3/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T150000Z
DTEND:20230628T160000Z
DTSTAMP:20260503T125500
CREATED:20230531T191740Z
LAST-MODIFIED:20230531T191740Z
UID:24217-1687946400-1687950000@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-4/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T030000Z
DTEND:20230628T040000Z
DTSTAMP:20260503T125500
CREATED:20230627T061947Z
LAST-MODIFIED:20230627T061947Z
UID:24079-1687903200-1687906800@hdpusergroup.org
SUMMARY:IST-HDP Meeting
DESCRIPTION:IST-HDP Meeting 
URL:https://hdpusergroup.org/event/ist-hdp-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T190000Z
DTEND:20230627T200000Z
DTSTAMP:20260503T125500
CREATED:20230626T140742Z
LAST-MODIFIED:20230626T140742Z
UID:24311-1687874400-1687878000@hdpusergroup.org
SUMMARY:Nonglass Buildups
DESCRIPTION:Continue fleshing out the basic ideas of the project. 
URL:https://hdpusergroup.org/event/nonglass-buildups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T180000Z
DTEND:20230627T190000Z
DTSTAMP:20260503T125500
CREATED:20230621T175358Z
LAST-MODIFIED:20230621T175358Z
UID:24291-1687870800-1687874400@hdpusergroup.org
SUMMARY:Meeting with Mark Shields
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-mark-shields/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T170000Z
DTEND:20230627T180000Z
DTSTAMP:20260503T125500
CREATED:20230605T090411Z
LAST-MODIFIED:20230605T090411Z
UID:24225-1687867200-1687870800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T160000Z
DTEND:20230627T170000Z
DTSTAMP:20260503T125500
CREATED:20230606T170730Z
LAST-MODIFIED:20230606T170730Z
UID:24229-1687863600-1687867200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Hurray Model for roughness effect on signal integrity.  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-4/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T140000Z
DTEND:20230627T150000Z
DTSTAMP:20260503T125500
CREATED:20230627T141442Z
LAST-MODIFIED:20230627T141442Z
UID:24339-1687856400-1687860000@hdpusergroup.org
SUMMARY:Test call
DESCRIPTION:Test meeting 
URL:https://hdpusergroup.org/event/test-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230626T150000Z
DTEND:20230626T160000Z
DTSTAMP:20260503T125500
CREATED:20230612T153342Z
LAST-MODIFIED:20230612T153342Z
UID:24246-1687773600-1687777200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-25/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230625T133000Z
DTEND:20230625T140000Z
DTSTAMP:20260503T125500
CREATED:20230625T121134Z
LAST-MODIFIED:20230625T121134Z
UID:24303-1687681800-1687683600@hdpusergroup.org
SUMMARY:Testing
DESCRIPTION:Testing connection between website and WebEx. 
URL:https://hdpusergroup.org/event/testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230622T190000Z
DTEND:20230622T200000Z
DTSTAMP:20260503T125500
CREATED:20230525T193814Z
LAST-MODIFIED:20230525T193814Z
UID:24203-1687442400-1687446000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Latest project status 
URL:https://hdpusergroup.org/event/microvia-rel-33/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230622T160000Z
DTEND:20230622T170000Z
DTSTAMP:20260503T125500
CREATED:20230605T091435Z
LAST-MODIFIED:20230605T091435Z
UID:24226-1687431600-1687435200@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Period project review 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-5/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230622T150000Z
DTEND:20230622T160000Z
DTSTAMP:20260503T125500
CREATED:20230531T152915Z
LAST-MODIFIED:20230531T152915Z
UID:24212-1687428000-1687431600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-10/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230622T010000Z
DTEND:20230622T020000Z
DTSTAMP:20260503T125500
CREATED:20230524T012449Z
LAST-MODIFIED:20230524T012449Z
UID:24194-1687377600-1687381200@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-8/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230621T180000Z
DTEND:20230621T190000Z
DTSTAMP:20260503T125500
CREATED:20230606T190838Z
LAST-MODIFIED:20230606T190838Z
UID:24231-1687352400-1687356000@hdpusergroup.org
SUMMARY:New Microvia Project
DESCRIPTION:Further fleshing out the new project 
URL:https://hdpusergroup.org/event/new-microvia-project/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230621T170000Z
DTEND:20230621T180000Z
DTSTAMP:20260503T125500
CREATED:20230619T144601Z
LAST-MODIFIED:20230619T144601Z
UID:24277-1687348800-1687352400@hdpusergroup.org
SUMMARY:Meet with New Team Leader
DESCRIPTION:Team leader meeting 
URL:https://hdpusergroup.org/event/meet-with-new-team-leader/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230621T150000Z
DTEND:20230621T160000Z
DTSTAMP:20260503T125500
CREATED:20230524T152919Z
LAST-MODIFIED:20230524T152919Z
UID:24196-1687341600-1687345200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-18/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230620T170000Z
DTEND:20230620T180000Z
DTSTAMP:20260503T125500
CREATED:20230523T174910Z
LAST-MODIFIED:20230523T174910Z
UID:24192-1687262400-1687266000@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/ta-method-15/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230616T150000Z
DTEND:20230616T160000Z
DTSTAMP:20260503T125500
CREATED:20230606T171210Z
LAST-MODIFIED:20230606T171210Z
UID:24230-1686909600-1686913200@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:In an immersion cooling system\, infrastructure equipment can be submerged in a non-conductive cooling liqui \nIdea is to develop a model to predict permittivity of different cooling liquids for improved reliability and energy efficiency \nCompare costs of each fluid vs other properties to determine best options. \nWhen using colling liquids for this application\, there is little understanding of the complex permittivity properties of these liquids \nThere are technical challenges that pose risks when trying to accurately model electrical performance of high-speed buses immersed in cooling liquids vs air \nWhat issues arise with permittivity when using different cooling liquids? 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230616T140000Z
DTEND:20230616T150000Z
DTSTAMP:20260503T125500
CREATED:20230602T143121Z
LAST-MODIFIED:20230602T143121Z
UID:24221-1686906000-1686909600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF as IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF as IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-as-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230615T150000Z
DTEND:20230615T160000Z
DTSTAMP:20260503T125500
CREATED:20230523T153809Z
LAST-MODIFIED:20230523T153809Z
UID:24191-1686823200-1686826800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-26/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T160000Z
DTEND:20230614T170000Z
DTSTAMP:20260503T125500
CREATED:20230525T144229Z
LAST-MODIFIED:20230525T144229Z
UID:24199-1686740400-1686744000@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Determining reliability of materials based on peel strengths. And different copper foil types. 
URL:https://hdpusergroup.org/event/copper-peel-strength-2-4/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T150000Z
DTEND:20230614T160000Z
DTSTAMP:20260503T125500
CREATED:20230530T162101Z
LAST-MODIFIED:20230530T162101Z
UID:24209-1686736800-1686740400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230612T150000Z
DTEND:20230612T160000Z
DTSTAMP:20260503T125500
CREATED:20230515T154238Z
LAST-MODIFIED:20230515T154238Z
UID:24156-1686564000-1686567600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-24/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230606T230000Z
DTEND:20230607T080000Z
DTSTAMP:20260503T125500
CREATED:20230602T130612Z
LAST-MODIFIED:20230602T130612Z
UID:23792-1686074400-1686106800@hdpusergroup.org
SUMMARY:HDP June 2023 Asia Meeting
DESCRIPTION:The HDP June 2023 Asia Meeting will be held June 7 & 8\, 2023 (Japan Time) / June 6 & 7 (US Time) in Omiya\, Japan.  The meeting will be hosted by Mitsui Kinzoku.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  \nMeeting Location: \n \nSonic City Building \n1-7-5\, Sakuragi-cho\,  \nOmiya-ku\, Saitama-shi\, \nSaitama 330-8669\, Japan  \n \nHotel \nPalace Hotel OMIYA \n1-7-5\, Sakuragi-cho\,  \nOmiya-ku\, Saitama-shi\,  \nSaitama 330-0854\, Japan \nTEL: +81-48-647-3300  \nFAX: +81-48-647-0430  \nEMAIL: front@palace-omiya.co.jp \n \nDay 1 Call Information \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting link https://hdpug.webex.com/hdpug/j.php?MTID=mf668f1fda65bdd1c8dfec8a0c8d4663cJoin by meeting number Meeting number (access code): 2559 246 7238Meeting password: HDPAsia1Join by phone 1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n \nDay 2 Call Information \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m71c2e1939d4ddb219088b6ee0c8d9d42Join by meeting numberMeeting number (access code): 2552 999 8642Meeting password: HDPAsia2Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nCall ics files are available for download at the bottom of this page. 
URL:https://hdpusergroup.org/event/hdp-june-2023-asia-meeting/2023-06-07/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR