BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260812T160000Z
DTEND:20260812T170000Z
DTSTAMP:20261019T033331
CREATED:20260715T163720Z
LAST-MODIFIED:20260715T163720Z
UID:40951-1786532400-1786536000@hdpusergroup.org
SUMMARY:TCE Materials-CTE measurement validation
DESCRIPTION:Validation of improved TM for CTE measurements. ensure consistency across the supply chain.  
URL:https://hdpusergroup.org/event/tce-materials-cte-measurement-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260811T170000Z
DTEND:20260811T180000Z
DTSTAMP:20261019T033331
CREATED:20260724T174743Z
LAST-MODIFIED:20260724T174743Z
UID:41166-1786449600-1786453200@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-6/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260811T160000Z
DTEND:20260811T170000Z
DTSTAMP:20261019T033331
CREATED:20260804T164016Z
LAST-MODIFIED:20260804T164016Z
UID:41241-1786446000-1786449600@hdpusergroup.org
SUMMARY:Call with Cisco
DESCRIPTION:Call with Vy at Cisco 
URL:https://hdpusergroup.org/event/call-with-cisco/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260807T010000Z
DTEND:20260807T020000Z
DTSTAMP:20261019T033331
CREATED:20260717T013458Z
LAST-MODIFIED:20260717T013458Z
UID:41000-1786046400-1786050000@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Expand on method developed in Phase 1 with nickel free finishes for phase 2. 
URL:https://hdpusergroup.org/event/porosity-testing-2-3/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T210000Z
DTEND:20260806T220000Z
DTSTAMP:20261019T033331
CREATED:20260724T070752Z
LAST-MODIFIED:20260724T070752Z
UID:41164-1786032000-1786035600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-40/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T180000Z
DTEND:20260806T190000Z
DTSTAMP:20261019T033331
CREATED:20260723T153733Z
LAST-MODIFIED:20260723T153733Z
UID:41156-1786021200-1786024800@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T160000Z
DTEND:20260806T170000Z
DTSTAMP:20261019T033331
CREATED:20260714T170302Z
LAST-MODIFIED:20260714T170302Z
UID:40890-1786014000-1786017600@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T140000Z
DTEND:20260806T150000Z
DTSTAMP:20261019T033331
CREATED:20260728T184406Z
LAST-MODIFIED:20260728T184406Z
UID:40950-1786006800-1786010400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-20/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T150000Z
DTEND:20260805T160000Z
DTSTAMP:20261019T033331
CREATED:20260722T151527Z
LAST-MODIFIED:20260722T151527Z
UID:41148-1785924000-1785927600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-25/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T140000Z
DTEND:20260805T150000Z
DTSTAMP:20261019T033331
CREATED:20260716T143920Z
LAST-MODIFIED:20260716T143920Z
UID:40984-1785920400-1785924000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-11/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T130000Z
DTEND:20260805T140000Z
DTSTAMP:20261019T033331
CREATED:20260722T153008Z
LAST-MODIFIED:20260722T153008Z
UID:41151-1785916800-1785920400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-49/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T170000Z
DTEND:20260804T180000Z
DTSTAMP:20261019T033331
CREATED:20260724T174302Z
LAST-MODIFIED:20260724T174302Z
UID:41165-1785844800-1785848400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-13/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T150000Z
DTEND:20260804T160000Z
DTSTAMP:20261019T033331
CREATED:20260722T140430Z
LAST-MODIFIED:20260722T140430Z
UID:41146-1785837600-1785841200@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-18/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T010000Z
DTEND:20260804T020000Z
DTSTAMP:20261019T033331
CREATED:20260716T065335Z
LAST-MODIFIED:20260716T065335Z
UID:40943-1785787200-1785790800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-3/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260730T160000Z
DTEND:20260730T170000Z
DTSTAMP:20261019T033331
CREATED:20260716T164729Z
LAST-MODIFIED:20260716T164729Z
UID:40988-1785409200-1785412800@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-Ups
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-22/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260730T010000Z
DTEND:20260730T020000Z
DTSTAMP:20261019T033331
CREATED:20260709T012754Z
LAST-MODIFIED:20260709T012754Z
UID:40848-1785355200-1785358800@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-39/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260727T150000Z
DTEND:20260727T160000Z
DTSTAMP:20261019T033331
CREATED:20260629T160945Z
LAST-MODIFIED:20260629T160945Z
UID:40797-1785146400-1785150000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-9/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260724T140000Z
DTEND:20260724T150000Z
DTSTAMP:20261019T033331
CREATED:20260713T165428Z
LAST-MODIFIED:20260713T165428Z
UID:40820-1784883600-1784887200@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-18/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T210000Z
DTEND:20260723T220000Z
DTSTAMP:20261019T033331
CREATED:20260702T222018Z
LAST-MODIFIED:20260702T222018Z
UID:40827-1784822400-1784826000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-39/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T160000Z
DTEND:20260723T170000Z
DTSTAMP:20261019T033331
CREATED:20260714T114259Z
LAST-MODIFIED:20260714T114259Z
UID:40857-1784804400-1784808000@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T150000Z
DTEND:20260723T160000Z
DTSTAMP:20261019T033331
CREATED:20260708T160838Z
LAST-MODIFIED:20260708T160838Z
UID:40846-1784800800-1784804400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-15/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T160000Z
DTEND:20260722T170000Z
DTSTAMP:20261019T033331
CREATED:20260714T141859Z
LAST-MODIFIED:20260714T141859Z
UID:40553-1784718000-1784721600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-9/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T150000Z
DTEND:20260722T160000Z
DTSTAMP:20261019T033331
CREATED:20260624T153216Z
LAST-MODIFIED:20260624T153216Z
UID:40787-1784714400-1784718000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-48/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T140000Z
DTEND:20260722T150000Z
DTSTAMP:20261019T033331
CREATED:20260708T141037Z
LAST-MODIFIED:20260708T141037Z
UID:40845-1784710800-1784714400@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-24/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260721T170000Z
DTEND:20260721T180000Z
DTSTAMP:20261019T033331
CREATED:20260707T141317Z
LAST-MODIFIED:20260707T141317Z
UID:40843-1784635200-1784638800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-5/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260721T150000Z
DTEND:20260721T160000Z
DTSTAMP:20261019T033331
CREATED:20260713T164759Z
LAST-MODIFIED:20260713T164759Z
UID:40821-1784628000-1784631600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-17/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260717T010000Z
DTEND:20260717T020000Z
DTSTAMP:20261019T033331
CREATED:20260715T030404Z
LAST-MODIFIED:20260715T030404Z
UID:40945-1784232000-1784235600@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Building on the procedure developed in phase 1 and will apply to a ndw set of solderable finishes. 
URL:https://hdpusergroup.org/event/porosity-testing-2-2/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T160000Z
DTEND:20260716T170000Z
DTSTAMP:20261019T033331
CREATED:20260707T110030Z
LAST-MODIFIED:20260707T110030Z
UID:40798-1784199600-1784203200@hdpusergroup.org
SUMMARY:Non-Glass Microvia
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T150000Z
DTEND:20260716T160000Z
DTSTAMP:20261019T033331
CREATED:20260618T152549Z
LAST-MODIFIED:20260618T152549Z
UID:40763-1784196000-1784199600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-8/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T140000Z
DTEND:20260716T150000Z
DTSTAMP:20261019T033331
CREATED:20260625T224759Z
LAST-MODIFIED:20260625T224759Z
UID:40793-1784192400-1784196000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-10/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR