BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230919T170000Z
DTEND:20230919T180000Z
DTSTAMP:20260502T200514
CREATED:20230822T171410Z
LAST-MODIFIED:20230822T171410Z
UID:24541-1695124800-1695128400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T160000Z
DTEND:20230919T170000Z
DTSTAMP:20260502T200514
CREATED:20230830T012517Z
LAST-MODIFIED:20230830T012517Z
UID:24563-1695121200-1695124800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Modelingf SI with use of Hurray model 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-6/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T010000Z
DTEND:20230919T020000Z
DTSTAMP:20260502T200514
CREATED:20230829T035839Z
LAST-MODIFIED:20230829T035839Z
UID:24387-1695067200-1695070800@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-10/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230915T150000Z
DTEND:20230915T160000Z
DTSTAMP:20260502T200514
CREATED:20230908T204856Z
LAST-MODIFIED:20230908T204856Z
UID:24697-1694772000-1694775600@hdpusergroup.org
SUMMARY:Peremittivity of Cooling Liquids
DESCRIPTION:investigate cooling fluids 
URL:https://hdpusergroup.org/event/peremittivity-of-cooling-liquids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230914T150000Z
DTEND:20230914T160000Z
DTSTAMP:20260502T200514
CREATED:20230824T163754Z
LAST-MODIFIED:20230824T163754Z
UID:24547-1694685600-1694689200@hdpusergroup.org
SUMMARY:Single Surface Finish Final Report Reviw
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-final-report-reviw/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T170000Z
DTEND:20230913T180000Z
DTSTAMP:20260502T200514
CREATED:20230823T174154Z
LAST-MODIFIED:20230823T174154Z
UID:24545-1694606400-1694610000@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Review progress on final report and abstract for APEX paper 
URL:https://hdpusergroup.org/event/ta-method-17/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T160000Z
DTEND:20230913T170000Z
DTSTAMP:20260502T200514
CREATED:20230802T163318Z
LAST-MODIFIED:20230802T163318Z
UID:24439-1694602800-1694606400@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Continued report out on glass style performance under temperature stress. 
URL:https://hdpusergroup.org/event/glass-type-comparison-5/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T150000Z
DTEND:20230913T160000Z
DTSTAMP:20260502T200514
CREATED:20230817T200319Z
LAST-MODIFIED:20230817T200319Z
UID:24522-1694599200-1694602800@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230911T150000Z
DTEND:20230911T160000Z
DTSTAMP:20260502T200514
CREATED:20230821T152759Z
LAST-MODIFIED:20230821T152759Z
UID:24536-1694426400-1694430000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-32/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230908T140000Z
DTEND:20230908T150000Z
DTSTAMP:20260502T200514
CREATED:20230818T141229Z
LAST-MODIFIED:20230818T141229Z
UID:24525-1694163600-1694167200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-2/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230907T200000Z
DTEND:20230907T210000Z
DTSTAMP:20260502T200514
CREATED:20230824T205136Z
LAST-MODIFIED:20230824T205136Z
UID:24548-1694098800-1694102400@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Progresss on master doc\, ATC and drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-11/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230907T160000Z
DTEND:20230907T170000Z
DTSTAMP:20260502T200514
CREATED:20230808T142150Z
LAST-MODIFIED:20230808T142150Z
UID:24454-1694084400-1694088000@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-call-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230907T150000Z
DTEND:20230907T160000Z
DTSTAMP:20260502T200514
CREATED:20230809T154609Z
LAST-MODIFIED:20230809T154609Z
UID:24459-1694080800-1694084400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-11/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230906T150000Z
DTEND:20230906T160000Z
DTSTAMP:20260502T200514
CREATED:20230901T124505Z
LAST-MODIFIED:20230901T124505Z
UID:24571-1693994400-1693998000@hdpusergroup.org
SUMMARY:HDP-IPC cooperation
DESCRIPTION:IPC and HDP to disucss cooperation on projects in order to advance stnadards development and help solve critical industry problems. 
URL:https://hdpusergroup.org/event/hdp-ipc-cooperation/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230906T150000Z
DTEND:20230906T160000Z
DTSTAMP:20260502T200514
CREATED:20230810T151216Z
LAST-MODIFIED:20230810T151216Z
UID:24462-1693994400-1693998000@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-13/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230906T140000Z
DTEND:20230906T150000Z
DTSTAMP:20260502T200514
CREATED:20230816T154218Z
LAST-MODIFIED:20230816T154218Z
UID:24504-1693990800-1693994400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Status on panels shipped to Jason 
URL:https://hdpusergroup.org/event/microvia-rel-37/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230906T020000Z
DTEND:20230906T030000Z
DTSTAMP:20260502T200514
CREATED:20230816T021723Z
LAST-MODIFIED:20230816T021723Z
UID:24502-1693947600-1693951200@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-48/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230901T140000Z
DTEND:20230901T150000Z
DTSTAMP:20260502T200514
CREATED:20230811T063034Z
LAST-MODIFIED:20230811T063034Z
UID:24400-1693558800-1693562400@hdpusergroup.org
SUMMARY:Quantify Changes in Reflow Cycles with Reliability Performance New Idea Project Call
DESCRIPTION:Quantify Changes in Reflow Cycles with Reliability Peformance – New Idea Project Call 
URL:https://hdpusergroup.org/event/quantify-changes-in-reflow-cycles-with-reliability-peformance-new-idea-project-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230830T190000Z
DTEND:20230830T200000Z
DTSTAMP:20260502T200514
CREATED:20230816T194557Z
LAST-MODIFIED:20230816T194557Z
UID:24509-1693404000-1693407600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Review stackup and layout \nPotentially hear back from PCB suppliers 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230830T180000Z
DTEND:20230830T190000Z
DTSTAMP:20260502T200514
CREATED:20230817T153042Z
LAST-MODIFIED:20230817T153042Z
UID:24521-1693400400-1693404000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-30/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230830T150000Z
DTEND:20230830T160000Z
DTSTAMP:20260502T200514
CREATED:20230829T133223Z
LAST-MODIFIED:20230829T133223Z
UID:24556-1693389600-1693393200@hdpusergroup.org
SUMMARY:Discussion on external presentations - Inner Layer Cu Balance - IPC Expo
DESCRIPTION:Review abstract details  and discussion on external papers 
URL:https://hdpusergroup.org/event/discussion-on-external-presentations-inner-layer-cu-balance-ipc-expo/
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230829T160000Z
DTEND:20230829T170000Z
DTSTAMP:20260502T200514
CREATED:20230808T164127Z
LAST-MODIFIED:20230808T164127Z
UID:24457-1693306800-1693310400@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Continue review of the roughness for copper surface treatments. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-11/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230829T150000Z
DTEND:20230829T160000Z
DTSTAMP:20260502T200514
CREATED:20230825T141424Z
LAST-MODIFIED:20230825T141424Z
UID:24550-1693303200-1693306800@hdpusergroup.org
SUMMARY:Call with Matt
DESCRIPTION:Call to discuss HDP 
URL:https://hdpusergroup.org/event/call-with-matt-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230825T140000Z
DTEND:20230825T150000Z
DTSTAMP:20260502T200514
CREATED:20230818T145711Z
LAST-MODIFIED:20230818T145711Z
UID:24520-1692954000-1692957600@hdpusergroup.org
SUMMARY:CAF Eq
DESCRIPTION:Testing update \nTalk about possiblity of additional testing 
URL:https://hdpusergroup.org/event/caf-eq-5/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230824T200000Z
DTEND:20230824T210000Z
DTSTAMP:20260502T200514
CREATED:20230810T204750Z
LAST-MODIFIED:20230810T204750Z
UID:24466-1692889200-1692892800@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Progress on rel testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-10/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230823T170000Z
DTEND:20230823T180000Z
DTSTAMP:20260502T200514
CREATED:20230814T181934Z
LAST-MODIFIED:20230814T181934Z
UID:24384-1692792000-1692795600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Review progress on final report. \nReview proposed abstract for IPC APEX 2024 \nCritique Bev’s proposed mini-presentation on the project to be given at a one day SMTA Toronto event Oct 16th. 
URL:https://hdpusergroup.org/event/ta-method-16/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230823T150000Z
DTEND:20230823T160000Z
DTSTAMP:20260502T200514
CREATED:20230726T153115Z
LAST-MODIFIED:20230726T153115Z
UID:24412-1692784800-1692788400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-20/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230822T170000Z
DTEND:20230822T180000Z
DTSTAMP:20260502T200514
CREATED:20230731T195715Z
LAST-MODIFIED:20230731T195715Z
UID:24431-1692705600-1692709200@hdpusergroup.org
SUMMARY:HDP Harsh USe Alloy Projects Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-projects-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260502T200514
CREATED:20230808T133856Z
LAST-MODIFIED:20230808T133856Z
UID:24453-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-31/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260502T200514
CREATED:20230808T020423Z
LAST-MODIFIED:20230808T020423Z
UID:24448-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-30/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR