BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20231011T190000Z
DTEND:20231011T200000Z
DTSTAMP:20260502T151510
CREATED:20230927T193739Z
LAST-MODIFIED:20230927T193739Z
UID:24797-1697032800-1697036400@hdpusergroup.org
SUMMARY:Non-glass Microvias
DESCRIPTION:Look at Bob's latest drawings \nHopefully have defintive build decisions from TTM and Sanmina 
URL:https://hdpusergroup.org/event/non-glass-microvias-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231011T150000Z
DTEND:20231011T160000Z
DTSTAMP:20260502T151510
CREATED:20230924T220047Z
LAST-MODIFIED:20230924T220047Z
UID:24690-1697018400-1697022000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-12/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231005T150000Z
DTEND:20231005T160000Z
DTSTAMP:20260502T151510
CREATED:20230920T003343Z
LAST-MODIFIED:20230920T003343Z
UID:24689-1696500000-1696503600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-14/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231004T150000Z
DTEND:20231004T160000Z
DTSTAMP:20260502T151510
CREATED:20230913T160207Z
LAST-MODIFIED:20230913T160207Z
UID:24715-1696413600-1696417200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231004T140000Z
DTEND:20231004T150000Z
DTSTAMP:20260502T151510
CREATED:20230906T142815Z
LAST-MODIFIED:20230906T142815Z
UID:24688-1696410000-1696413600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Updates from Jason and Kevin \nWork on presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/microvia-rel-38/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231003T160000Z
DTEND:20231003T170000Z
DTSTAMP:20260502T151510
CREATED:20230919T162050Z
LAST-MODIFIED:20230919T162050Z
UID:24750-1696330800-1696334400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Surface roughness modeling of copper surface treatments as a prelude to SI. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-7/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231002T150000Z
DTEND:20231002T160000Z
DTSTAMP:20260502T151510
CREATED:20230911T152938Z
LAST-MODIFIED:20230911T152938Z
UID:24706-1696240800-1696244400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequemcy 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-33/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230929T140000Z
DTEND:20230929T150000Z
DTSTAMP:20260502T151510
CREATED:20230908T143036Z
LAST-MODIFIED:20230908T143036Z
UID:24696-1695978000-1695981600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230928T160000Z
DTEND:20230928T170000Z
DTSTAMP:20260502T151510
CREATED:20230911T040140Z
LAST-MODIFIED:20230911T040140Z
UID:24701-1695898800-1695902400@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic Project Review  
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-7/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230928T140000Z
DTEND:20230928T150000Z
DTSTAMP:20260502T151510
CREATED:20230825T150627Z
LAST-MODIFIED:20230825T150627Z
UID:24551-1695891600-1695895200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Testing progress + adress some project direction questions + work on presentation for virtual meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-31/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T190000Z
DTEND:20230927T200000Z
DTSTAMP:20260502T151510
CREATED:20230830T193556Z
LAST-MODIFIED:20230830T193556Z
UID:24565-1695823200-1695826800@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Review Bob's drawings and discuss October presentation 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-4/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T170000Z
DTEND:20230927T180000Z
DTSTAMP:20260502T151510
CREATED:20230913T173404Z
LAST-MODIFIED:20230913T173404Z
UID:24716-1695816000-1695819600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Presentations for BoD and Member Meeting \nAny word on acceptance of abstract for IPC APEX \nProgress on final report and paper 
URL:https://hdpusergroup.org/event/ta-method-18/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T160000Z
DTEND:20230927T170000Z
DTSTAMP:20260502T151510
CREATED:20230914T191046Z
LAST-MODIFIED:20230914T191046Z
UID:24719-1695812400-1695816000@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Reporting on the performance until temperatrue stress of different glass types 
URL:https://hdpusergroup.org/event/glass-type-comparison-6/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T150000Z
DTEND:20230927T160000Z
DTSTAMP:20260502T151510
CREATED:20230914T152847Z
LAST-MODIFIED:20230914T152847Z
UID:24718-1695808800-1695812400@hdpusergroup.org
SUMMARY:Single Surface Finish - Final Report Review
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-final-report-review/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T140000Z
DTEND:20230927T150000Z
DTSTAMP:20260502T151510
CREATED:20230908T141238Z
LAST-MODIFIED:20230908T141238Z
UID:24694-1695805200-1695808800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-3/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T020000Z
DTEND:20230927T030000Z
DTSTAMP:20260502T151510
CREATED:20230906T022536Z
LAST-MODIFIED:20230906T022536Z
UID:24683-1695762000-1695765600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-49/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T200000Z
DTEND:20230921T210000Z
DTSTAMP:20260502T151510
CREATED:20230907T210455Z
LAST-MODIFIED:20230907T210455Z
UID:24693-1695308400-1695312000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates from both Keysight sites 
URL:https://hdpusergroup.org/event/photonic-soldering-2-12/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T160000Z
DTEND:20230921T170000Z
DTSTAMP:20260502T151510
CREATED:20230909T152537Z
LAST-MODIFIED:20230909T152537Z
UID:24503-1695294000-1695297600@hdpusergroup.org
SUMMARY:Inner Layer Cu Balance Project call
DESCRIPTION:  \nRescheduled ….Gary Out on Business \nReview measurement data and discuss phase 2 progress.
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T150000Z
DTEND:20230921T160000Z
DTSTAMP:20260502T151510
CREATED:20230823T152756Z
LAST-MODIFIED:20230823T152756Z
UID:24542-1695290400-1695294000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-21/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230920T160000Z
DTEND:20230920T170000Z
DTSTAMP:20260502T151510
CREATED:20230829T141847Z
LAST-MODIFIED:20230829T141847Z
UID:24534-1695207600-1695211200@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage/Flatness Project
DESCRIPTION:Project Status Meeting - rescheduled due to a scheduling conflict \nThis project has been on hold since May 2023. It is time for us to move it forward or remove it from the roster of projects. 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage-flatness-project/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T170000Z
DTEND:20230919T180000Z
DTSTAMP:20260502T151510
CREATED:20230822T171410Z
LAST-MODIFIED:20230822T171410Z
UID:24541-1695124800-1695128400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T160000Z
DTEND:20230919T170000Z
DTSTAMP:20260502T151510
CREATED:20230830T012517Z
LAST-MODIFIED:20230830T012517Z
UID:24563-1695121200-1695124800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Modelingf SI with use of Hurray model 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-6/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T010000Z
DTEND:20230919T020000Z
DTSTAMP:20260502T151510
CREATED:20230829T035839Z
LAST-MODIFIED:20230829T035839Z
UID:24387-1695067200-1695070800@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-10/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230915T150000Z
DTEND:20230915T160000Z
DTSTAMP:20260502T151510
CREATED:20230908T204856Z
LAST-MODIFIED:20230908T204856Z
UID:24697-1694772000-1694775600@hdpusergroup.org
SUMMARY:Peremittivity of Cooling Liquids
DESCRIPTION:investigate cooling fluids 
URL:https://hdpusergroup.org/event/peremittivity-of-cooling-liquids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230914T150000Z
DTEND:20230914T160000Z
DTSTAMP:20260502T151510
CREATED:20230824T163754Z
LAST-MODIFIED:20230824T163754Z
UID:24547-1694685600-1694689200@hdpusergroup.org
SUMMARY:Single Surface Finish Final Report Reviw
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-final-report-reviw/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T170000Z
DTEND:20230913T180000Z
DTSTAMP:20260502T151510
CREATED:20230823T174154Z
LAST-MODIFIED:20230823T174154Z
UID:24545-1694606400-1694610000@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Review progress on final report and abstract for APEX paper 
URL:https://hdpusergroup.org/event/ta-method-17/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T160000Z
DTEND:20230913T170000Z
DTSTAMP:20260502T151510
CREATED:20230802T163318Z
LAST-MODIFIED:20230802T163318Z
UID:24439-1694602800-1694606400@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Continued report out on glass style performance under temperature stress. 
URL:https://hdpusergroup.org/event/glass-type-comparison-5/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230913T150000Z
DTEND:20230913T160000Z
DTSTAMP:20260502T151510
CREATED:20230817T200319Z
LAST-MODIFIED:20230817T200319Z
UID:24522-1694599200-1694602800@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230911T150000Z
DTEND:20230911T160000Z
DTSTAMP:20260502T151510
CREATED:20230821T152759Z
LAST-MODIFIED:20230821T152759Z
UID:24536-1694426400-1694430000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-32/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230908T140000Z
DTEND:20230908T150000Z
DTSTAMP:20260502T151510
CREATED:20230818T141229Z
LAST-MODIFIED:20230818T141229Z
UID:24525-1694163600-1694167200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-2/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR