BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20231025T150000Z
DTEND:20231025T160000Z
DTSTAMP:20260502T130352
CREATED:20230927T161110Z
LAST-MODIFIED:20230927T161110Z
UID:24795-1698228000-1698231600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231023T190000Z
DTEND:20231023T200000Z
DTSTAMP:20260502T130352
CREATED:20231020T183851Z
LAST-MODIFIED:20231020T183851Z
UID:24892-1698069600-1698073200@hdpusergroup.org
SUMMARY:Karl Training session
DESCRIPTION:Facilitator training session 
URL:https://hdpusergroup.org/event/karl-training-session/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231018T130000Z
DTEND:20231018T220000Z
DTSTAMP:20260502T130352
CREATED:20231019T130753Z
LAST-MODIFIED:20231019T130753Z
UID:24381-1697616000-1697648400@hdpusergroup.org
SUMMARY:HDP October 2023 Fall Virtual Meeting
DESCRIPTION: \nThe HDP Fall Member Meeting is scheduled for October 18 and 19\, 2023.\nThis will be a virtual meeting via Webex.  To register\, click the register button on this page.  \nDay 1 is open to members and potential members. Day 2 is members only. \nIn order to assist with identifying non-member and member attendees\, HDP requests that participants join the call by entering first name\, last name\, and company name when prompted by WebEx. \nCall Ics files can be downloaded at the bottom of this page. \nDay 1 Call Infomation Meeting link:https://hdpug.webex.com/hdpug/j.php?MTID=me144e516c448611997e4ed87b200ae8b Meeting number: 2557 669 2955Password: HDPFall1 Join by phone: 1-650-479-3208 Call-in number (US/Canada)Access code: 2557 669 2955Global call-in numbers  \nDay 2 Call Infomation Meeting link:https://hdpug.webex.com/hdpug/j.php?MTID=m9b276b50149fe98e93ab430fde35a0c7 Meeting number: 2552 524 2828Password: HDPFall2  Join by phone:1-650-479-3208 Call-in number (US/Canada)Access code: 2552 524 2828Global call-in numbers  
URL:https://hdpusergroup.org/event/hdp-october-2023-fall-virtual-meeting/2023-10-18/
LOCATION:Virtual
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231017T140000Z
DTEND:20231017T190000Z
DTSTAMP:20260502T130352
CREATED:20231010T135927Z
LAST-MODIFIED:20231010T135927Z
UID:24676-1697533200-1697551200@hdpusergroup.org
SUMMARY:HDP Board of Directors Virtual Fall Meeting
DESCRIPTION:HDP Board of Directors Fall Meeting.  To be held virtually via WebEx. Presentations and meeting ics file are available for download at the bottom of this page. \n\n\n\nCall information\n\n\n\n\n\nMeeting link:\nhttps://hdpug.webex.com/hdpug/j.php?MTID=m6b64f09b58120649b0853b80c5c1bc9b\nMeeting number:\n2554 675 0178\nPassword:\nHDPOctBod (43762826 from video systems)\n\n\n\n\n\nJoin by phone\n\n\n\n\n1-650-479-3208 Call-in number (US/Canada)\n\n\nAccess code: 2554 675 0178\n\n\n\n Global call-in numbers  \n\n\n\n\n  
URL:https://hdpusergroup.org/event/hdp-board-of-directors-virtual-fall-meeting/
LOCATION:Virtual
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231016T160000Z
DTEND:20231016T170000Z
DTSTAMP:20260502T130352
CREATED:20231012T180131Z
LAST-MODIFIED:20231012T180131Z
UID:24872-1697454000-1697457600@hdpusergroup.org
SUMMARY:Transition meeting
DESCRIPTION:Discuss project transition 
URL:https://hdpusergroup.org/event/transition-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231016T150000Z
DTEND:20231016T160000Z
DTSTAMP:20260502T130352
CREATED:20231002T154806Z
LAST-MODIFIED:20231002T154806Z
UID:24805-1697450400-1697454000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-34/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231013T150000Z
DTEND:20231013T160000Z
DTSTAMP:20260502T130352
CREATED:20230919T162629Z
LAST-MODIFIED:20230919T162629Z
UID:24751-1697191200-1697194800@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:Finalize DOE and methodolgy. \nOrder TV build from WUS. \nASk for Implementation 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-3/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231012T010000Z
DTEND:20231012T020000Z
DTSTAMP:20260502T130352
CREATED:20230919T012135Z
LAST-MODIFIED:20230919T012135Z
UID:24744-1697054400-1697058000@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-11/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231011T190000Z
DTEND:20231011T200000Z
DTSTAMP:20260502T130352
CREATED:20230927T193739Z
LAST-MODIFIED:20230927T193739Z
UID:24797-1697032800-1697036400@hdpusergroup.org
SUMMARY:Non-glass Microvias
DESCRIPTION:Look at Bob's latest drawings \nHopefully have defintive build decisions from TTM and Sanmina 
URL:https://hdpusergroup.org/event/non-glass-microvias-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231011T150000Z
DTEND:20231011T160000Z
DTSTAMP:20260502T130352
CREATED:20230924T220047Z
LAST-MODIFIED:20230924T220047Z
UID:24690-1697018400-1697022000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-12/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231005T150000Z
DTEND:20231005T160000Z
DTSTAMP:20260502T130352
CREATED:20230920T003343Z
LAST-MODIFIED:20230920T003343Z
UID:24689-1696500000-1696503600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-14/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231004T150000Z
DTEND:20231004T160000Z
DTSTAMP:20260502T130352
CREATED:20230913T160207Z
LAST-MODIFIED:20230913T160207Z
UID:24715-1696413600-1696417200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231004T140000Z
DTEND:20231004T150000Z
DTSTAMP:20260502T130352
CREATED:20230906T142815Z
LAST-MODIFIED:20230906T142815Z
UID:24688-1696410000-1696413600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Updates from Jason and Kevin \nWork on presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/microvia-rel-38/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231003T160000Z
DTEND:20231003T170000Z
DTSTAMP:20260502T130352
CREATED:20230919T162050Z
LAST-MODIFIED:20230919T162050Z
UID:24750-1696330800-1696334400@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Surface roughness modeling of copper surface treatments as a prelude to SI. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-7/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20231002T150000Z
DTEND:20231002T160000Z
DTSTAMP:20260502T130352
CREATED:20230911T152938Z
LAST-MODIFIED:20230911T152938Z
UID:24706-1696240800-1696244400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequemcy 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-33/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230929T140000Z
DTEND:20230929T150000Z
DTSTAMP:20260502T130352
CREATED:20230908T143036Z
LAST-MODIFIED:20230908T143036Z
UID:24696-1695978000-1695981600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230928T160000Z
DTEND:20230928T170000Z
DTSTAMP:20260502T130352
CREATED:20230911T040140Z
LAST-MODIFIED:20230911T040140Z
UID:24701-1695898800-1695902400@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic Project Review  
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-7/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230928T140000Z
DTEND:20230928T150000Z
DTSTAMP:20260502T130352
CREATED:20230825T150627Z
LAST-MODIFIED:20230825T150627Z
UID:24551-1695891600-1695895200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Testing progress + adress some project direction questions + work on presentation for virtual meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-31/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T190000Z
DTEND:20230927T200000Z
DTSTAMP:20260502T130352
CREATED:20230830T193556Z
LAST-MODIFIED:20230830T193556Z
UID:24565-1695823200-1695826800@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Review Bob's drawings and discuss October presentation 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-4/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T170000Z
DTEND:20230927T180000Z
DTSTAMP:20260502T130352
CREATED:20230913T173404Z
LAST-MODIFIED:20230913T173404Z
UID:24716-1695816000-1695819600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Presentations for BoD and Member Meeting \nAny word on acceptance of abstract for IPC APEX \nProgress on final report and paper 
URL:https://hdpusergroup.org/event/ta-method-18/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T160000Z
DTEND:20230927T170000Z
DTSTAMP:20260502T130352
CREATED:20230914T191046Z
LAST-MODIFIED:20230914T191046Z
UID:24719-1695812400-1695816000@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Reporting on the performance until temperatrue stress of different glass types 
URL:https://hdpusergroup.org/event/glass-type-comparison-6/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T150000Z
DTEND:20230927T160000Z
DTSTAMP:20260502T130352
CREATED:20230914T152847Z
LAST-MODIFIED:20230914T152847Z
UID:24718-1695808800-1695812400@hdpusergroup.org
SUMMARY:Single Surface Finish - Final Report Review
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-final-report-review/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T140000Z
DTEND:20230927T150000Z
DTSTAMP:20260502T130352
CREATED:20230908T141238Z
LAST-MODIFIED:20230908T141238Z
UID:24694-1695805200-1695808800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-3/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230927T020000Z
DTEND:20230927T030000Z
DTSTAMP:20260502T130352
CREATED:20230906T022536Z
LAST-MODIFIED:20230906T022536Z
UID:24683-1695762000-1695765600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-49/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T200000Z
DTEND:20230921T210000Z
DTSTAMP:20260502T130352
CREATED:20230907T210455Z
LAST-MODIFIED:20230907T210455Z
UID:24693-1695308400-1695312000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates from both Keysight sites 
URL:https://hdpusergroup.org/event/photonic-soldering-2-12/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T160000Z
DTEND:20230921T170000Z
DTSTAMP:20260502T130352
CREATED:20230909T152537Z
LAST-MODIFIED:20230909T152537Z
UID:24503-1695294000-1695297600@hdpusergroup.org
SUMMARY:Inner Layer Cu Balance Project call
DESCRIPTION:  \nRescheduled ….Gary Out on Business \nReview measurement data and discuss phase 2 progress.
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T150000Z
DTEND:20230921T160000Z
DTSTAMP:20260502T130352
CREATED:20230823T152756Z
LAST-MODIFIED:20230823T152756Z
UID:24542-1695290400-1695294000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-21/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230920T160000Z
DTEND:20230920T170000Z
DTSTAMP:20260502T130352
CREATED:20230829T141847Z
LAST-MODIFIED:20230829T141847Z
UID:24534-1695207600-1695211200@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage/Flatness Project
DESCRIPTION:Project Status Meeting - rescheduled due to a scheduling conflict \nThis project has been on hold since May 2023. It is time for us to move it forward or remove it from the roster of projects. 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage-flatness-project/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T170000Z
DTEND:20230919T180000Z
DTSTAMP:20260502T130352
CREATED:20230822T171410Z
LAST-MODIFIED:20230822T171410Z
UID:24541-1695124800-1695128400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T160000Z
DTEND:20230919T170000Z
DTSTAMP:20260502T130352
CREATED:20230830T012517Z
LAST-MODIFIED:20230830T012517Z
UID:24563-1695121200-1695124800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Modelingf SI with use of Hurray model 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-6/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR