BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240207T150000Z
DTEND:20240207T160000Z
DTSTAMP:20260501T121141
CREATED:20240124T173045Z
LAST-MODIFIED:20240124T173045Z
UID:25352-1707296400-1707300000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-26/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T230000Z
DTEND:20240207T000000Z
DTSTAMP:20260501T121141
CREATED:20240130T204027Z
LAST-MODIFIED:20240130T204027Z
UID:25147-1707238800-1707242400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Look at test methods \nPass/fail criteria \nDown select finishes to test 
URL:https://hdpusergroup.org/event/porosity-testing/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T180000Z
DTEND:20240206T190000Z
DTSTAMP:20260501T121141
CREATED:20240116T152214Z
LAST-MODIFIED:20240116T152214Z
UID:25251-1707220800-1707224400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-5/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T170000Z
DTEND:20240206T180000Z
DTSTAMP:20260501T121141
CREATED:20240128T145531Z
LAST-MODIFIED:20240128T145531Z
UID:25404-1707217200-1707220800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness. \nThis new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T160000Z
DTEND:20240206T170000Z
DTSTAMP:20260501T121141
CREATED:20240205T175210Z
LAST-MODIFIED:20240205T175210Z
UID:25497-1707213600-1707217200@hdpusergroup.org
SUMMARY:Discussion on MM presentation
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/discussion-on-mm-presentation/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240205T160000Z
DTEND:20240205T170000Z
DTSTAMP:20260501T121141
CREATED:20240122T162740Z
LAST-MODIFIED:20240122T162740Z
UID:25314-1707127200-1707130800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-40/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240202T150000Z
DTEND:20240202T160000Z
DTSTAMP:20260501T121141
CREATED:20240112T152223Z
LAST-MODIFIED:20240112T152223Z
UID:25224-1706864400-1706868000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-7/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240201T190000Z
DTEND:20240201T200000Z
DTSTAMP:20260501T121141
CREATED:20240118T182211Z
LAST-MODIFIED:20240118T182211Z
UID:25305-1706792400-1706796000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:# of panels? \nPresenatation for BoD \nPresentation for Members’ meeting
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-9/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240201T160000Z
DTEND:20240201T170000Z
DTSTAMP:20260501T121141
CREATED:20240118T170316Z
LAST-MODIFIED:20240118T170316Z
UID:25304-1706781600-1706785200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-5/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T190000Z
DTEND:20240131T200000Z
DTSTAMP:20260501T121141
CREATED:20240122T210348Z
LAST-MODIFIED:20240122T210348Z
UID:25316-1706706000-1706709600@hdpusergroup.org
SUMMARY:Discussion on PFAS
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/discussion-on-pfas/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T150000Z
DTEND:20240131T160000Z
DTSTAMP:20260501T121141
CREATED:20240117T152120Z
LAST-MODIFIED:20240117T152120Z
UID:25299-1706691600-1706695200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-5/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T020000Z
DTEND:20240131T030000Z
DTSTAMP:20260501T121141
CREATED:20231220T022028Z
LAST-MODIFIED:20231220T022028Z
UID:25105-1706644800-1706648400@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-53/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T010000Z
DTEND:20240131T020000Z
DTSTAMP:20260501T121141
CREATED:20231130T012358Z
LAST-MODIFIED:20231130T012358Z
UID:25016-1706641200-1706644800@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-2/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240125T170000Z
DTEND:20240125T180000Z
DTSTAMP:20260501T121141
CREATED:20240119T234835Z
LAST-MODIFIED:20240119T234835Z
UID:25153-1706180400-1706184000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project 1 and 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240125T160000Z
DTEND:20240125T170000Z
DTSTAMP:20260501T121141
CREATED:20240110T165206Z
LAST-MODIFIED:20240110T165206Z
UID:25151-1706176800-1706180400@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240124T210000Z
DTEND:20240124T220000Z
DTSTAMP:20260501T121141
CREATED:20240123T152921Z
LAST-MODIFIED:20240123T152921Z
UID:25320-1706108400-1706112000@hdpusergroup.org
SUMMARY:IPC Discussion
DESCRIPTION:Call to discuss HDP project for standards data 
URL:https://hdpusergroup.org/event/ipc-discussion-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240124T180000Z
DTEND:20240124T190000Z
DTSTAMP:20260501T121141
CREATED:20240110T211815Z
LAST-MODIFIED:20240110T211815Z
UID:25156-1706097600-1706101200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Progress on drop testing \nStatus on ATC  
URL:https://hdpusergroup.org/event/photonic-soldering-2-17/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240124T170000Z
DTEND:20240124T180000Z
DTSTAMP:20260501T121141
CREATED:20240103T162750Z
LAST-MODIFIED:20240103T162750Z
UID:25116-1706094000-1706097600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-25/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240124T150000Z
DTEND:20240124T160000Z
DTSTAMP:20260501T121141
CREATED:20240111T152621Z
LAST-MODIFIED:20240111T152621Z
UID:25166-1706086800-1706090400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-19/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240122T160000Z
DTEND:20240122T170000Z
DTSTAMP:20260501T121141
CREATED:20240108T170326Z
LAST-MODIFIED:20240108T170326Z
UID:25122-1705917600-1705921200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-39/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240119T170000Z
DTEND:20240119T180000Z
DTSTAMP:20260501T121141
CREATED:20240109T135006Z
LAST-MODIFIED:20240109T135006Z
UID:25124-1705662000-1705665600@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Cooling fluid effectiveness-evaluate non-PFAS fluids 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-8/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240118T180000Z
DTEND:20240118T190000Z
DTSTAMP:20260501T121141
CREATED:20240111T210536Z
LAST-MODIFIED:20240111T210536Z
UID:25202-1705579200-1705582800@hdpusergroup.org
SUMMARY:IPC Discussion
DESCRIPTION:Discuss IPC collaboration 
URL:https://hdpusergroup.org/event/ipc-discussion-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240118T160000Z
DTEND:20240118T170000Z
DTSTAMP:20260501T121141
CREATED:20240104T170256Z
LAST-MODIFIED:20240104T170256Z
UID:25119-1705572000-1705575600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-4/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240117T203000Z
DTEND:20240117T210000Z
DTSTAMP:20260501T121141
CREATED:20240116T184339Z
LAST-MODIFIED:20240116T184339Z
UID:25252-1705501800-1705503600@hdpusergroup.org
SUMMARY:Op Plan Tech Section – Short call
DESCRIPTION:Call to discuss Tech Section –  
URL:https://hdpusergroup.org/event/op-plan-tech-section-short-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240117T160000Z
DTEND:20240117T170000Z
DTSTAMP:20260501T121141
CREATED:20231214T164514Z
LAST-MODIFIED:20231214T164514Z
UID:25100-1705485600-1705489200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-16/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240117T150000Z
DTEND:20240117T160000Z
DTSTAMP:20260501T121141
CREATED:20231213T162228Z
LAST-MODIFIED:20231213T162228Z
UID:25092-1705482000-1705485600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-4/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240112T150000Z
DTEND:20240112T160000Z
DTSTAMP:20260501T121141
CREATED:20231201T151133Z
LAST-MODIFIED:20231201T151133Z
UID:25040-1705050000-1705053600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-6/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240111T200000Z
DTEND:20240111T210000Z
DTSTAMP:20260501T121141
CREATED:20231130T201630Z
LAST-MODIFIED:20231130T201630Z
UID:25025-1704981600-1704985200@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Updates from the chemical suppliers. \nWork on presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/microvia-rel-41/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240111T190000Z
DTEND:20240111T200000Z
DTSTAMP:20260501T121141
CREATED:20231214T185410Z
LAST-MODIFIED:20231214T185410Z
UID:25103-1704978000-1704981600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Getting closer to the build 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-8/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240111T180000Z
DTEND:20240111T190000Z
DTSTAMP:20260501T121141
CREATED:20240108T143633Z
LAST-MODIFIED:20240108T143633Z
UID:25121-1704974400-1704978000@hdpusergroup.org
SUMMARY:IPC Discussion
DESCRIPTION:Idea collaboration project proposal 
URL:https://hdpusergroup.org/event/ipc-discussion-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR