BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240215T200000Z
DTEND:20240215T210000Z
DTSTAMP:20260501T072932
CREATED:20240213T211054Z
LAST-MODIFIED:20240213T211054Z
UID:25658-1708005600-1708009200@hdpusergroup.org
SUMMARY:VeCS discussion
DESCRIPTION:Call to discuss unauthorized data release 
URL:https://hdpusergroup.org/event/vecs-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T190000Z
DTEND:20240215T200000Z
DTSTAMP:20260501T072932
CREATED:20240131T200329Z
LAST-MODIFIED:20240131T200329Z
UID:25417-1708002000-1708005600@hdpusergroup.org
SUMMARY:PFAS Discussion
DESCRIPTION:Discussion of PFAS project 
URL:https://hdpusergroup.org/event/pfas-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T180000Z
DTEND:20240215T190000Z
DTSTAMP:20260501T072932
CREATED:20240124T183217Z
LAST-MODIFIED:20240124T183217Z
UID:25359-1707998400-1708002000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Keysight status on drop testing and ATC \nWork on presentation for annual meeting 
URL:https://hdpusergroup.org/event/photonic-soldering-2-18/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T170000Z
DTEND:20240215T180000Z
DTSTAMP:20260501T072932
CREATED:20240208T205258Z
LAST-MODIFIED:20240208T205258Z
UID:25597-1707994800-1707998400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review draft presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/microvia-rel-42/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T080000Z
DTEND:20240215T090000Z
DTSTAMP:20260501T072932
CREATED:20240215T052834Z
LAST-MODIFIED:20240215T052834Z
UID:25665-1707962400-1707966000@hdpusergroup.org
SUMMARY:CoTech New Project Idea Discussion
DESCRIPTION:CoTech New Project Idea Discussion 
URL:https://hdpusergroup.org/event/cotech-new-project-idea-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240214T170000Z
DTEND:20240214T180000Z
DTSTAMP:20260501T072932
CREATED:20240110T183102Z
LAST-MODIFIED:20240110T183102Z
UID:25155-1707908400-1707912000@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Data collection complete. discuss final report. 
URL:https://hdpusergroup.org/event/glass-type-comparison-9/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240214T160000Z
DTEND:20240214T170000Z
DTSTAMP:20260501T072932
CREATED:20240124T153134Z
LAST-MODIFIED:20240124T153134Z
UID:25343-1707904800-1707908400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-20/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240213T230000Z
DTEND:20240214T000000Z
DTSTAMP:20260501T072932
CREATED:20240207T170119Z
LAST-MODIFIED:20240207T170119Z
UID:25572-1707843600-1707847200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Do we proceed or not? 
URL:https://hdpusergroup.org/event/porosity-2/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240213T170000Z
DTEND:20240213T180000Z
DTSTAMP:20260501T072932
CREATED:20240213T165747Z
LAST-MODIFIED:20240213T165747Z
UID:25061-1707822000-1707825600@hdpusergroup.org
SUMMARY:New Project idea High Speed Coupon
DESCRIPTION:An HDP member proposed this new HDP project idea at HDP Member Meeting in October\, and other members have expressed interest. After two HDP “New Idea” meetings\, the status of the now revised new project idea as of the January 16 Webex call is as follows: \n\nThe Team has discussed two different purposes for this kind of testing; DVT for design verification/validation testing and for ongoing volume production control. There are many different DVT test methods being used and for a variety of reasons. As frustrating as this is for the laminate manufacturers who are developing new materials\, the concensus appears that it is unrealistic to think that HDP can come up with a very high frequency test coupon that everyone in the industry would agree to use beyond requiring a general higher speed 4-wire test method.\n \n \nThere is some interest by the participants in this new project undertaking to learn the ability of more practical volume production signal integrity test methods (ex: Delta-L V4\, Cisco’s S-3) to detect certain “minor” PCB Fab manufacturing variations which would not be acceptable in higher speed applications. Possible factors of interest include:\n* Resin Content 65% versus 75%\n* Nominal trace width change of more than 10 percent\n* Change of alternate oxide treatment and/or significant change in the depth of etch\n* Copper foil change from HVLP-2 to HVLP-1 or to RTF-2\nNote these changes may be combined and not significantly affect the standard board impedance test results.\n \nThe goals for the meeting on Feb 13 are for the team to discuss further and better define this new project\, then to select a project technical content leader.\nNote HDP Facilitator (Karl Sauter) does the project admin and work on resources.\n \nTo participate in this project\, send email to: Karls@hdpug.org\n\n  
URL:https://hdpusergroup.org/event/new-project-idea-high-speed-coupon/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240213T160000Z
DTEND:20240213T170000Z
DTSTAMP:20260501T072932
CREATED:20240201T230020Z
LAST-MODIFIED:20240201T230020Z
UID:25420-1707818400-1707822000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-6/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T200000Z
DTEND:20240208T210000Z
DTSTAMP:20260501T072932
CREATED:20240111T205206Z
LAST-MODIFIED:20240111T205206Z
UID:25188-1707400800-1707404400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Updates from TMM\, Atotech and McDermid-Alpha 
URL:https://hdpusergroup.org/event/microvia-rel-43/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T170000Z
DTEND:20240208T180000Z
DTSTAMP:20260501T072932
CREATED:20240201T130247Z
LAST-MODIFIED:20240201T130247Z
UID:25418-1707390000-1707393600@hdpusergroup.org
SUMMARY:Permittivity of cooling Fluids
DESCRIPTION:Finalize dooling fluids project tasks as we ask for approval for Implementation 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-5/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T160000Z
DTEND:20240208T170000Z
DTSTAMP:20260501T072932
CREATED:20240125T170359Z
LAST-MODIFIED:20240125T170359Z
UID:25395-1707386400-1707390000@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-2/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T140000Z
DTEND:20240208T150000Z
DTSTAMP:20260501T072932
CREATED:20240112T191712Z
LAST-MODIFIED:20240112T191712Z
UID:25226-1707379200-1707382800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert \nPresentation for members; Meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-35/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T170000Z
DTEND:20240207T180000Z
DTSTAMP:20260501T072932
CREATED:20240103T220005Z
LAST-MODIFIED:20240103T220005Z
UID:25118-1707303600-1707307200@hdpusergroup.org
SUMMARY:Backdrill Transition Project
DESCRIPTION:HDP Backdrill Via Transition Project meeting 
URL:https://hdpusergroup.org/event/backdrill-transition-project-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T160000Z
DTEND:20240207T170000Z
DTSTAMP:20260501T072932
CREATED:20240117T164725Z
LAST-MODIFIED:20240117T164725Z
UID:25300-1707300000-1707303600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-17/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T150000Z
DTEND:20240207T160000Z
DTSTAMP:20260501T072932
CREATED:20240124T173045Z
LAST-MODIFIED:20240124T173045Z
UID:25352-1707296400-1707300000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-26/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T230000Z
DTEND:20240207T000000Z
DTSTAMP:20260501T072932
CREATED:20240130T204027Z
LAST-MODIFIED:20240130T204027Z
UID:25147-1707238800-1707242400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Look at test methods \nPass/fail criteria \nDown select finishes to test 
URL:https://hdpusergroup.org/event/porosity-testing/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T180000Z
DTEND:20240206T190000Z
DTSTAMP:20260501T072932
CREATED:20240116T152214Z
LAST-MODIFIED:20240116T152214Z
UID:25251-1707220800-1707224400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-5/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T170000Z
DTEND:20240206T180000Z
DTSTAMP:20260501T072932
CREATED:20240128T145531Z
LAST-MODIFIED:20240128T145531Z
UID:25404-1707217200-1707220800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness. \nThis new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T160000Z
DTEND:20240206T170000Z
DTSTAMP:20260501T072932
CREATED:20240205T175210Z
LAST-MODIFIED:20240205T175210Z
UID:25497-1707213600-1707217200@hdpusergroup.org
SUMMARY:Discussion on MM presentation
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/discussion-on-mm-presentation/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240205T160000Z
DTEND:20240205T170000Z
DTSTAMP:20260501T072932
CREATED:20240122T162740Z
LAST-MODIFIED:20240122T162740Z
UID:25314-1707127200-1707130800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-40/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240202T150000Z
DTEND:20240202T160000Z
DTSTAMP:20260501T072932
CREATED:20240112T152223Z
LAST-MODIFIED:20240112T152223Z
UID:25224-1706864400-1706868000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-7/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240201T190000Z
DTEND:20240201T200000Z
DTSTAMP:20260501T072932
CREATED:20240118T182211Z
LAST-MODIFIED:20240118T182211Z
UID:25305-1706792400-1706796000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:# of panels? \nPresenatation for BoD \nPresentation for Members’ meeting
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-9/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240201T160000Z
DTEND:20240201T170000Z
DTSTAMP:20260501T072932
CREATED:20240118T170316Z
LAST-MODIFIED:20240118T170316Z
UID:25304-1706781600-1706785200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-5/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T190000Z
DTEND:20240131T200000Z
DTSTAMP:20260501T072932
CREATED:20240122T210348Z
LAST-MODIFIED:20240122T210348Z
UID:25316-1706706000-1706709600@hdpusergroup.org
SUMMARY:Discussion on PFAS
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/discussion-on-pfas/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T150000Z
DTEND:20240131T160000Z
DTSTAMP:20260501T072932
CREATED:20240117T152120Z
LAST-MODIFIED:20240117T152120Z
UID:25299-1706691600-1706695200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-5/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T020000Z
DTEND:20240131T030000Z
DTSTAMP:20260501T072932
CREATED:20231220T022028Z
LAST-MODIFIED:20231220T022028Z
UID:25105-1706644800-1706648400@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-53/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240131T010000Z
DTEND:20240131T020000Z
DTSTAMP:20260501T072932
CREATED:20231130T012358Z
LAST-MODIFIED:20231130T012358Z
UID:25016-1706641200-1706644800@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-2/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240125T170000Z
DTEND:20240125T180000Z
DTSTAMP:20260501T072932
CREATED:20240119T234835Z
LAST-MODIFIED:20240119T234835Z
UID:25153-1706180400-1706184000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project 1 and 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR