BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240515T200000Z
DTEND:20240515T210000Z
DTSTAMP:20260429T003629
CREATED:20240507T141541Z
LAST-MODIFIED:20240507T141541Z
UID:26356-1715785200-1715788800@hdpusergroup.org
SUMMARY:NEW PROJECT - Outer Trace Adhesion
DESCRIPTION:HDP recently completed a project about the adhesion strength of inner layer copper traces.  This new project proposes to investigate and validate a quantitative test method for determining the adhesion strength of ultra thin traces on the outside of a PCB.  Come bring your ideas to this kick-off meeting. 
URL:https://hdpusergroup.org/event/new-project-outer-trace-adhesion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T150000Z
DTEND:20240515T160000Z
DTSTAMP:20260429T003629
CREATED:20240501T155522Z
LAST-MODIFIED:20240501T155522Z
UID:26304-1715767200-1715770800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting \n  \n  \n  
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T140000Z
DTEND:20240515T150000Z
DTSTAMP:20260429T003629
CREATED:20240501T144845Z
LAST-MODIFIED:20240501T144845Z
UID:26303-1715763600-1715767200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-11/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240514T160000Z
DTEND:20240514T170000Z
DTSTAMP:20260429T003629
CREATED:20240430T150305Z
LAST-MODIFIED:20240430T150305Z
UID:26300-1715684400-1715688000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Are we ready to build? \nLook at presentation for Member Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-12/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240513T150000Z
DTEND:20240513T160000Z
DTSTAMP:20260429T003629
CREATED:20240512T231709Z
LAST-MODIFIED:20240512T231709Z
UID:26529-1715594400-1715598000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Test status updates \nReview Member Meeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-37/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240510T150000Z
DTEND:20240510T160000Z
DTSTAMP:20260429T003629
CREATED:20240429T162145Z
LAST-MODIFIED:20240429T162145Z
UID:26295-1715335200-1715338800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-46/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240510T010000Z
DTEND:20240510T020000Z
DTSTAMP:20260429T003629
CREATED:20240430T042437Z
LAST-MODIFIED:20240430T042437Z
UID:26298-1715284800-1715288400@hdpusergroup.org
SUMMARY:Kinwong Onboard Orientation Call
DESCRIPTION:Kinwong Onboard Orientation Call 
URL:https://hdpusergroup.org/event/kinwong-onboard-orientation-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240509T210000Z
DTEND:20240509T220000Z
DTSTAMP:20260429T003629
CREATED:20240418T222859Z
LAST-MODIFIED:20240418T222859Z
UID:26265-1715270400-1715274000@hdpusergroup.org
SUMMARY:Idea discussion: Glass substrates for IC packages
DESCRIPTION:Idea discussion: Glass substrates for IC packages (Please bring any shareable information with us) \n 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240509T140000Z
DTEND:20240509T150000Z
DTSTAMP:20260429T003629
CREATED:20240502T144439Z
LAST-MODIFIED:20240502T144439Z
UID:26310-1715245200-1715248800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-30/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240508T140000Z
DTEND:20240508T150000Z
DTSTAMP:20260429T003629
CREATED:20240327T144355Z
LAST-MODIFIED:20240327T144355Z
UID:26001-1715158800-1715162400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-8/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240507T180000Z
DTEND:20240507T190000Z
DTSTAMP:20260429T003629
CREATED:20240501T170907Z
LAST-MODIFIED:20240501T170907Z
UID:26306-1715086800-1715090400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Pogress on final report. \nIdeas for next project? 
URL:https://hdpusergroup.org/event/microvia-rel-46/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240507T160000Z
DTEND:20240507T170000Z
DTSTAMP:20260429T003629
CREATED:20240423T164547Z
LAST-MODIFIED:20240423T164547Z
UID:26280-1715079600-1715083200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-10/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240506T230000Z
DTEND:20240507T000000Z
DTSTAMP:20260429T003629
CREATED:20240503T133801Z
LAST-MODIFIED:20240503T133801Z
UID:26282-1715018400-1715022000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Talk about: flow chart\, test methods\, short list of finishes\, who will test what\, contact with Penn State and Mike Carano. 
URL:https://hdpusergroup.org/event/porosity-7/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240506T160000Z
DTEND:20240506T170000Z
DTSTAMP:20260429T003629
CREATED:20240430T215134Z
LAST-MODIFIED:20240430T215134Z
UID:26301-1714993200-1714996800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Review results and align tasks for microsectioning and data collection 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-13/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T200000Z
DTEND:20240502T210000Z
DTSTAMP:20260429T003629
CREATED:20240418T202136Z
LAST-MODIFIED:20240418T202136Z
UID:26253-1714662000-1714665600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Drop and ATC updates 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-24/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T150000Z
DTEND:20240502T160000Z
DTSTAMP:20260429T003629
CREATED:20240419T133729Z
LAST-MODIFIED:20240419T133729Z
UID:26268-1714644000-1714647600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-23/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T140000Z
DTEND:20240502T150000Z
DTSTAMP:20260429T003629
CREATED:20240402T153306Z
LAST-MODIFIED:20240402T153306Z
UID:26036-1714640400-1714644000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-29/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240501T150000Z
DTEND:20240501T160000Z
DTSTAMP:20260429T003629
CREATED:20240417T172806Z
LAST-MODIFIED:20240417T172806Z
UID:26246-1714557600-1714561200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240501T140000Z
DTEND:20240501T150000Z
DTSTAMP:20260429T003629
CREATED:20240327T152727Z
LAST-MODIFIED:20240327T152727Z
UID:26002-1714554000-1714557600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-10/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240430T170000Z
DTEND:20240430T180000Z
DTSTAMP:20260429T003629
CREATED:20240402T193521Z
LAST-MODIFIED:20240402T193521Z
UID:26056-1714478400-1714482000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations -- Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-7/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240429T153000Z
DTEND:20240429T163000Z
DTSTAMP:20260429T003629
CREATED:20240418T223306Z
LAST-MODIFIED:20240418T223306Z
UID:26030-1714386600-1714390200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-45/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240426T180000Z
DTEND:20240426T190000Z
DTSTAMP:20260429T003629
CREATED:20240424T170552Z
LAST-MODIFIED:20240424T170552Z
UID:26286-1714136400-1714140000@hdpusergroup.org
SUMMARY:Call to discuss short Tech Direction slides
DESCRIPTION:Call to review slides 
URL:https://hdpusergroup.org/event/call-to-discuss-short-tech-direction-slides/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240425T010000Z
DTEND:20240425T020000Z
DTSTAMP:20260429T003629
CREATED:20240326T045447Z
LAST-MODIFIED:20240326T045447Z
UID:25980-1713988800-1713992400@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-4/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240424T140000Z
DTEND:20240424T150000Z
DTSTAMP:20260429T003629
CREATED:20240403T161922Z
LAST-MODIFIED:20240403T161922Z
UID:25840-1713949200-1713952800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-19/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T230000Z
DTEND:20240424T000000Z
DTSTAMP:20260429T003629
CREATED:20240326T235502Z
LAST-MODIFIED:20240326T235502Z
UID:25999-1713895200-1713898800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/porosity-6/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T160000Z
DTEND:20240423T170000Z
DTSTAMP:20260429T003629
CREATED:20240327T164249Z
LAST-MODIFIED:20240327T164249Z
UID:26008-1713870000-1713873600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-9/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T150000Z
DTEND:20240423T160000Z
DTSTAMP:20260429T003629
CREATED:20240404T171023Z
LAST-MODIFIED:20240404T171023Z
UID:26123-1713866400-1713870000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Any questions from Sanmina Singapore? Others? \nAmount of material needed? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-11/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T060000Z
DTEND:20240423T070000Z
DTSTAMP:20260429T003629
CREATED:20240422T103546Z
LAST-MODIFIED:20240422T103546Z
UID:26275-1713834000-1713837600@hdpusergroup.org
SUMMARY:Co Tech HDP AV Internet Check for May Member Meeting
DESCRIPTION:Co Tech HDP AV Internet Check for May Member Meeting 
URL:https://hdpusergroup.org/event/co-tech-hdp-av-internet-check-for-may-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T210000Z
DTEND:20240418T220000Z
DTSTAMP:20260429T003629
CREATED:20240329T213906Z
LAST-MODIFIED:20240329T213906Z
UID:26024-1713456000-1713459600@hdpusergroup.org
SUMMARY:Idea discussion: Glass substrates for IC packages
DESCRIPTION:Idea discussion: Glass substrates for IC packages 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T200000Z
DTEND:20240418T210000Z
DTSTAMP:20260429T003629
CREATED:20240401T173903Z
LAST-MODIFIED:20240401T173903Z
UID:26032-1713452400-1713456000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates on drop and ATC testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-21/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR