BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240624T160000Z
DTEND:20240624T170000Z
DTSTAMP:20260428T163105
CREATED:20240603T165519Z
LAST-MODIFIED:20240603T165519Z
UID:26773-1719226800-1719230400@hdpusergroup.org
SUMMARY:Copper surface roughness model
DESCRIPTION:REview SEM and roughness model numbers. Update on Hurray Model. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T200000Z
DTEND:20240620T210000Z
DTSTAMP:20260428T163105
CREATED:20240530T202807Z
LAST-MODIFIED:20240530T202807Z
UID:26765-1718895600-1718899200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Will look at Weibull plots 
URL:https://hdpusergroup.org/event/photonic-soldering-2-23/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T170000Z
DTEND:20240620T180000Z
DTSTAMP:20260428T163105
CREATED:20240619T225104Z
LAST-MODIFIED:20240619T225104Z
UID:26816-1718884800-1718888400@hdpusergroup.org
SUMMARY:HDP document posting
DESCRIPTION:Meeting to review document posting procedure(s) 
URL:https://hdpusergroup.org/event/hdp-document-posting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T140000Z
DTEND:20240620T150000Z
DTSTAMP:20260428T163105
CREATED:20240606T143746Z
LAST-MODIFIED:20240606T143746Z
UID:26781-1718874000-1718877600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-26/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240619T160000Z
DTEND:20240619T170000Z
DTSTAMP:20260428T163105
CREATED:20240530T180636Z
LAST-MODIFIED:20240530T180636Z
UID:26764-1718794800-1718798400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review progress on final report 
URL:https://hdpusergroup.org/event/microvia-rel-48/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240618T150000Z
DTEND:20240618T160000Z
DTSTAMP:20260428T163105
CREATED:20240513T151300Z
LAST-MODIFIED:20240513T151300Z
UID:26542-1718704800-1718708400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-38/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240613T210000Z
DTEND:20240613T220000Z
DTSTAMP:20260428T163105
CREATED:20240605T054127Z
LAST-MODIFIED:20240605T054127Z
UID:26528-1718294400-1718298000@hdpusergroup.org
SUMMARY:Idea discussion: Glass Substrates for IC Packages
DESCRIPTION:Idea discussion: Glass Substrates for IC Packages 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240613T160000Z
DTEND:20240613T170000Z
DTSTAMP:20260428T163105
CREATED:20240529T163915Z
LAST-MODIFIED:20240529T163915Z
UID:26754-1718276400-1718280000@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-3/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240613T080000Z
DTEND:20240613T083000Z
DTSTAMP:20260428T163105
CREATED:20240613T072729Z
LAST-MODIFIED:20240613T072729Z
UID:26798-1718247600-1718249400@hdpusergroup.org
SUMMARY:Caption Function Check in detail
DESCRIPTION:Transciption 
URL:https://hdpusergroup.org/event/caption-function-check-in-detail/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240612T150000Z
DTEND:20240612T160000Z
DTSTAMP:20260428T163105
CREATED:20240515T155553Z
LAST-MODIFIED:20240515T155553Z
UID:26554-1718186400-1718190000@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-9/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240612T140000Z
DTEND:20240612T150000Z
DTSTAMP:20260428T163105
CREATED:20240508T141113Z
LAST-MODIFIED:20240508T141113Z
UID:26422-1718182800-1718186400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-9/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240612T060000Z
DTEND:20240612T063000Z
DTSTAMP:20260428T163105
CREATED:20240612T051005Z
LAST-MODIFIED:20240612T051005Z
UID:26791-1718154000-1718155800@hdpusergroup.org
SUMMARY:Caption function check
DESCRIPTION:Checking menu buttons 
URL:https://hdpusergroup.org/event/caption-function-check/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240612T010000Z
DTEND:20240612T020000Z
DTSTAMP:20260428T163105
CREATED:20240425T090758Z
LAST-MODIFIED:20240425T090758Z
UID:26288-1718136000-1718139600@hdpusergroup.org
SUMMARY:Correlating CF Profile to SI Project Call
DESCRIPTION:Correlating CF Profile to SI Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-si-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240610T150000Z
DTEND:20240610T160000Z
DTSTAMP:20260428T163105
CREATED:20240510T161013Z
LAST-MODIFIED:20240510T161013Z
UID:26454-1718013600-1718017200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-47/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240606T150000Z
DTEND:20240606T160000Z
DTSTAMP:20260428T163105
CREATED:20240515T180852Z
LAST-MODIFIED:20240515T180852Z
UID:26556-1717668000-1717671600@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:Measuring performance of cooling fluids (Dk\,Df) under time and temperature aging. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-4/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240606T140000Z
DTEND:20240606T150000Z
DTSTAMP:20260428T163105
CREATED:20240516T142017Z
LAST-MODIFIED:20240516T142017Z
UID:26559-1717664400-1717668000@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-25/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240605T160000Z
DTEND:20240605T170000Z
DTSTAMP:20260428T163105
CREATED:20240515T180424Z
LAST-MODIFIED:20240515T180424Z
UID:26555-1717585200-1717588800@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Glass Type comparison project under thermal stress conditions 
URL:https://hdpusergroup.org/event/glass-type-comparison-10/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240603T160000Z
DTEND:20240603T170000Z
DTSTAMP:20260428T163105
CREATED:20240506T180159Z
LAST-MODIFIED:20240506T180159Z
UID:26333-1717412400-1717416000@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:model SI loss with Hurray Model. Evaluate three different copper surface treatments for signal integrity and overall surface roughness. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-14/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240530T200000Z
DTEND:20240530T210000Z
DTSTAMP:20260428T163105
CREATED:20240529T135036Z
LAST-MODIFIED:20240529T135036Z
UID:26751-1717081200-1717084800@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Discuss Weibull results \nDrop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-22/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240530T180000Z
DTEND:20240530T190000Z
DTSTAMP:20260428T163105
CREATED:20240507T182814Z
LAST-MODIFIED:20240507T182814Z
UID:26368-1717074000-1717077600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Progress on final report \nMore discussion on possible next project 
URL:https://hdpusergroup.org/event/microvia-rel-47/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240530T170000Z
DTEND:20240530T180000Z
DTSTAMP:20260428T163105
CREATED:20240515T231422Z
LAST-MODIFIED:20240515T231422Z
UID:26558-1717070400-1717074000@hdpusergroup.org
SUMMARY:External Copper Trace Adhesion
DESCRIPTION:Continue to explore the possilbility of making this idea an HDP project 
URL:https://hdpusergroup.org/event/external-copper-trace-adhesion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240530T160000Z
DTEND:20240530T170000Z
DTSTAMP:20260428T163105
CREATED:20240507T164018Z
LAST-MODIFIED:20240507T164018Z
UID:26363-1717066800-1717070400@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-11/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T230000Z
DTEND:20240530T000000Z
DTSTAMP:20260428T163105
CREATED:20240506T233713Z
LAST-MODIFIED:20240506T233713Z
UID:26334-1717005600-1717009200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue working on project definition 
URL:https://hdpusergroup.org/event/porosity-8/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T160000Z
DTEND:20240529T170000Z
DTSTAMP:20260428T163105
CREATED:20240507T222818Z
LAST-MODIFIED:20240507T222818Z
UID:26245-1716980400-1716984000@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T150000Z
DTEND:20240529T160000Z
DTSTAMP:20260428T163105
CREATED:20240509T204630Z
LAST-MODIFIED:20240509T204630Z
UID:26440-1716976800-1716980400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-31/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T140000Z
DTEND:20240529T150000Z
DTSTAMP:20260428T163105
CREATED:20240509T200923Z
LAST-MODIFIED:20240509T200923Z
UID:26283-1716973200-1716976800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-20/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240528T170000Z
DTEND:20240528T180000Z
DTSTAMP:20260428T163105
CREATED:20240501T143337Z
LAST-MODIFIED:20240501T143337Z
UID:26302-1716897600-1716901200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-8/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240524T150000Z
DTEND:20240524T160000Z
DTSTAMP:20260428T163105
CREATED:20240514T174848Z
LAST-MODIFIED:20240514T174848Z
UID:26551-1716544800-1716548400@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Singapore good to go? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-13/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240522T010000Z
DTEND:20240522T093000Z
DTSTAMP:20260428T163105
CREATED:20240516T162631Z
LAST-MODIFIED:20240516T162631Z
UID:25021-1716321600-1716352200@hdpusergroup.org
SUMMARY:HDP May Asia 2024 Member Meeting
DESCRIPTION: \nThe HDP May 2024 Asia Meeting will be held on May 22 & 23\, 2024 (Taiwan Time) / May 21 & 22 (US Time) in Taipei\, Taiwan.  The meeting will be hosted by Co-Tech.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  \nMeeting Location: \nCo-Tech HeadquartersNo.392\, Ruiguang Rd.\, Neihu Dist.Taipei City 114\, Taiwan\, R.O.C. \nHotel: \nGrand Victoria Hotel Taipei (5-minute walk from Jiannan Road Station)No. 168\, Jingye 4th Rd\, Zhongshan DistrictTaipei City\, Taiwan 10491Tel: +886 2 8502 0000 \nhttps://grandvictoria.com.tw/ \nCo-Tech has assisted HDP in receiving a special corporate room rate:Standard Room with breakfast NT$ 4800 (~ 153.11 USD)Reservation deadline for rooms is end of April 2024\, after this date the rate will increase to NT$ 5830 (~187.29 USD)For reservations you can contact the HDP Business Manager\, include your hotel request when using the registration form on this page\, or email the hotel directly (be sure to state that you are an HDP May 2024 Asia Member Meeting guest) at: \nsamuel.chen@grandvictoria.com.tw \nres@grandvictoria.com.tw \nCall information (call ics files are available for download at the bottom of this page) \nDay 1Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m1dc538a0587e2ac60ac80303b53b851dJoin by meeting numberMeeting number (access code): 2555 542 1916Meeting password: HDPAsia2024Day1Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n \nDay 2Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m72c9df2b89624a3dd3c250725f402cd8Join by meeting numberMeeting number (access code): 2555 457 7864Meeting password: HDPAsia2024Day2Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-may-asia-2024-member-meeting/2024-05-22/
LOCATION:Taipei\, Taiwan
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240521T060000Z
DTEND:20240521T080000Z
DTSTAMP:20260428T163105
CREATED:20240517T012727Z
LAST-MODIFIED:20240517T012727Z
UID:26600-1716253200-1716260400@hdpusergroup.org
SUMMARY:Internet and AV check at Co-Tech for Member Meeting
DESCRIPTION:Internet and AV check at Co-Tech for Member Meeting 
URL:https://hdpusergroup.org/event/internet-and-av-check-at-co-tech-for-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR