BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260909T140000Z
DTEND:20260909T150000Z
DTSTAMP:20261018T205244
CREATED:20260825T141255Z
LAST-MODIFIED:20260825T141255Z
UID:41326-1788944400-1788948000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-27/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260908T170000Z
DTEND:20260908T180000Z
DTSTAMP:20261018T205244
CREATED:20260831T141319Z
LAST-MODIFIED:20260831T141319Z
UID:41341-1788868800-1788872400@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-8/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260908T130000Z
DTEND:20260908T140000Z
DTSTAMP:20261018T205244
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38751-1788854400-1788858000@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-09-08/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260903T160000Z
DTEND:20260903T170000Z
DTSTAMP:20261018T205244
CREATED:20260817T202407Z
LAST-MODIFIED:20260817T202407Z
UID:41261-1788433200-1788436800@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-9/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260903T010000Z
DTEND:20260903T020000Z
DTSTAMP:20261018T205244
CREATED:20260730T011804Z
LAST-MODIFIED:20260730T011804Z
UID:41178-1788379200-1788382800@hdpusergroup.org
SUMMARY:Correlating CF Profile to SI Next Phase Project Call
DESCRIPTION:Correlating CF Profile to SI Next Phase Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-si-next-phase-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260902T180000Z
DTEND:20260902T190000Z
DTSTAMP:20261018T205244
CREATED:20260813T172217Z
LAST-MODIFIED:20260813T172217Z
UID:41302-1788354000-1788357600@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:with aspect ratios exceeding 30:1\, what are the limitations to plating uniformity\, throwing power and long-term reliability.  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-3/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260902T140000Z
DTEND:20260902T150000Z
DTSTAMP:20261018T205244
CREATED:20260819T143941Z
LAST-MODIFIED:20260819T143941Z
UID:41319-1788339600-1788343200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project WebEx Call
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-webex-call-2/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260901T170000Z
DTEND:20260901T180000Z
DTSTAMP:20261018T205244
CREATED:20260804T172447Z
LAST-MODIFIED:20260804T172447Z
UID:41242-1788264000-1788267600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-14/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260901T150000Z
DTEND:20260901T160000Z
DTSTAMP:20261018T205244
CREATED:20260820T111038Z
LAST-MODIFIED:20260820T111038Z
UID:41321-1788256800-1788260400@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-20/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260901T010000Z
DTEND:20260901T020000Z
DTSTAMP:20261018T205244
CREATED:20260818T015911Z
LAST-MODIFIED:20260818T015911Z
UID:41316-1788206400-1788210000@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-5/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260828T010000Z
DTEND:20260828T020000Z
DTSTAMP:20261018T205244
CREATED:20260807T011954Z
LAST-MODIFIED:20260807T011954Z
UID:41270-1787860800-1787864400@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Phase 2-testing of next set of final finishes 
URL:https://hdpusergroup.org/event/porosity-testing-2-4/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T210000Z
DTEND:20260827T220000Z
DTSTAMP:20261018T205244
CREATED:20260807T065101Z
LAST-MODIFIED:20260807T065101Z
UID:41272-1787846400-1787850000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-41/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T180000Z
DTEND:20260827T190000Z
DTSTAMP:20261018T205244
CREATED:20260824T125320Z
LAST-MODIFIED:20260824T125320Z
UID:41300-1787835600-1787839200@hdpusergroup.org
SUMMARY:Non-Glass Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvias-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T160000Z
DTEND:20260827T170000Z
DTSTAMP:20261018T205244
CREATED:20260814T170606Z
LAST-MODIFIED:20260814T170606Z
UID:41306-1787828400-1787832000@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-5/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T140000Z
DTEND:20260827T150000Z
DTSTAMP:20261018T205244
CREATED:20260806T145856Z
LAST-MODIFIED:20260806T145856Z
UID:41260-1787821200-1787824800@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-21/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260826T180000Z
DTEND:20260826T190000Z
DTSTAMP:20261018T205244
CREATED:20260806T182643Z
LAST-MODIFIED:20260806T182643Z
UID:41265-1787749200-1787752800@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-17/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260825T170000Z
DTEND:20260825T180000Z
DTSTAMP:20261018T205244
CREATED:20260818T141500Z
LAST-MODIFIED:20260818T141500Z
UID:41318-1787659200-1787662800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-7/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260825T140000Z
DTEND:20260825T150000Z
DTSTAMP:20261018T205244
CREATED:20260818T065403Z
LAST-MODIFIED:20260818T065403Z
UID:41247-1787648400-1787652000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-26/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260824T150000Z
DTEND:20260824T160000Z
DTSTAMP:20261018T205244
CREATED:20260814T113530Z
LAST-MODIFIED:20260814T113530Z
UID:41170-1787565600-1787569200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Due to an urgent leader matter\, we are pushing this back by one week. Apologies for the last-minute change. 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-10/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260821T140000Z
DTEND:20260821T150000Z
DTSTAMP:20261018T205244
CREATED:20260727T135229Z
LAST-MODIFIED:20260727T135229Z
UID:41168-1787302800-1787306400@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-19/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260819T150000Z
DTEND:20260819T160000Z
DTSTAMP:20261018T205244
CREATED:20260805T132620Z
LAST-MODIFIED:20260805T132620Z
UID:41243-1787133600-1787137200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-50/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260819T140000Z
DTEND:20260819T150000Z
DTSTAMP:20261018T205244
CREATED:20260805T145508Z
LAST-MODIFIED:20260805T145508Z
UID:41246-1787130000-1787133600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project WebEx Call
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-webex-call/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260818T150000Z
DTEND:20260818T160000Z
DTSTAMP:20261018T205244
CREATED:20260810T130050Z
LAST-MODIFIED:20260810T130050Z
UID:41278-1787047200-1787050800@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-19/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260818T010000Z
DTEND:20260818T020000Z
DTSTAMP:20261018T205244
CREATED:20260804T020112Z
LAST-MODIFIED:20260804T020112Z
UID:41237-1786996800-1787000400@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-4/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T180000Z
DTEND:20260813T190000Z
DTSTAMP:20261018T205244
CREATED:20260810T125647Z
LAST-MODIFIED:20260810T125647Z
UID:41276-1786626000-1786629600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build Up
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-up/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T160000Z
DTEND:20260813T170000Z
DTSTAMP:20261018T205244
CREATED:20260723T181252Z
LAST-MODIFIED:20260723T181252Z
UID:41157-1786618800-1786622400@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-4/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T150000Z
DTEND:20260813T160000Z
DTSTAMP:20261018T205244
CREATED:20260716T152418Z
LAST-MODIFIED:20260716T152418Z
UID:40986-1786615200-1786618800@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-9/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260812T180000Z
DTEND:20260812T190000Z
DTSTAMP:20261018T205244
CREATED:20260715T190135Z
LAST-MODIFIED:20260715T190135Z
UID:40953-1786539600-1786543200@hdpusergroup.org
SUMMARY:high aspect ratio plating
DESCRIPTION:TV discussion.  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260812T160000Z
DTEND:20260812T170000Z
DTSTAMP:20261018T205244
CREATED:20260715T163720Z
LAST-MODIFIED:20260715T163720Z
UID:40951-1786532400-1786536000@hdpusergroup.org
SUMMARY:TCE Materials-CTE measurement validation
DESCRIPTION:Validation of improved TM for CTE measurements. ensure consistency across the supply chain.  
URL:https://hdpusergroup.org/event/tce-materials-cte-measurement-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260811T170000Z
DTEND:20260811T180000Z
DTSTAMP:20261018T205244
CREATED:20260724T174743Z
LAST-MODIFIED:20260724T174743Z
UID:41166-1786449600-1786453200@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-6/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR