BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240723T150000Z
DTEND:20240723T160000Z
DTSTAMP:20260428T061350
CREATED:20240708T162242Z
LAST-MODIFIED:20240708T162242Z
UID:27021-1721728800-1721732400@hdpusergroup.org
SUMMARY:Microvia Reliability
DESCRIPTION:Continuing to review final report 
URL:https://hdpusergroup.org/event/microvia-reliability-4/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240719T150000Z
DTEND:20240719T160000Z
DTSTAMP:20260428T061350
CREATED:20240711T175331Z
LAST-MODIFIED:20240711T175331Z
UID:27033-1721383200-1721386800@hdpusergroup.org
SUMMARY:permittivity of cooling fluids
DESCRIPTION:Study of non PFAS cooling fluids under time and temperature excursions 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-6/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T230000Z
DTEND:20240719T000000Z
DTSTAMP:20260428T061350
CREATED:20240628T005745Z
LAST-MODIFIED:20240628T005745Z
UID:26900-1721325600-1721329200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/porosity-10/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T210000Z
DTEND:20240718T220000Z
DTSTAMP:20260428T061350
CREATED:20240627T220403Z
LAST-MODIFIED:20240627T220403Z
UID:26899-1721318400-1721322000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T150000Z
DTEND:20240718T160000Z
DTSTAMP:20260428T061350
CREATED:20240716T160530Z
LAST-MODIFIED:20240716T160530Z
UID:27043-1721296800-1721300400@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Hopefully ressolve any difficulties 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T140000Z
DTEND:20240718T150000Z
DTSTAMP:20260428T061350
CREATED:20240620T141945Z
LAST-MODIFIED:20240620T141945Z
UID:26818-1721293200-1721296800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-27/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T160000Z
DTEND:20240717T170000Z
DTSTAMP:20260428T061350
CREATED:20240613T163408Z
LAST-MODIFIED:20240613T163408Z
UID:26802-1721214000-1721217600@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T140000Z
DTEND:20240717T150000Z
DTSTAMP:20260428T061350
CREATED:20240612T141254Z
LAST-MODIFIED:20240612T141254Z
UID:26792-1721206800-1721210400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-10/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T010000Z
DTEND:20240717T020000Z
DTSTAMP:20260428T061350
CREATED:20240703T020328Z
LAST-MODIFIED:20240703T020328Z
UID:26974-1721160000-1721163600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-2/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240716T150000Z
DTEND:20240716T160000Z
DTSTAMP:20260428T061350
CREATED:20240618T151837Z
LAST-MODIFIED:20240618T151837Z
UID:26808-1721124000-1721127600@hdpusergroup.org
SUMMARY:Better CAF eq
DESCRIPTION:Status update on testing \nPossible further discussion on data already colllected 
URL:https://hdpusergroup.org/event/better-caf-eq-39/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T200000Z
DTEND:20240711T210000Z
DTSTAMP:20260428T061350
CREATED:20240626T183539Z
LAST-MODIFIED:20240626T183539Z
UID:26894-1720710000-1720713600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Starting on final report \nStatus on drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-25/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T150000Z
DTEND:20240711T160000Z
DTSTAMP:20260428T061350
CREATED:20240529T153334Z
LAST-MODIFIED:20240529T153334Z
UID:26753-1720692000-1720695600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-32/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T200000Z
DTEND:20240710T210000Z
DTSTAMP:20260428T061350
CREATED:20240625T202541Z
LAST-MODIFIED:20240625T202541Z
UID:26891-1720623600-1720627200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue pulling things together to move from Idea to Definition 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-2/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T160000Z
DTEND:20240710T170000Z
DTSTAMP:20260428T061350
CREATED:20240626T161217Z
LAST-MODIFIED:20240626T161217Z
UID:26892-1720609200-1720612800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-11/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T150000Z
DTEND:20240710T160000Z
DTSTAMP:20260428T061350
CREATED:20240529T145201Z
LAST-MODIFIED:20240529T145201Z
UID:26752-1720605600-1720609200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-21/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T140000Z
DTEND:20240710T150000Z
DTSTAMP:20260428T061350
CREATED:20240710T134646Z
LAST-MODIFIED:20240710T134646Z
UID:26553-1720602000-1720605600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CFT at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CFT at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cft-at-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240708T160000Z
DTEND:20240708T170000Z
DTSTAMP:20260428T061350
CREATED:20240619T163547Z
LAST-MODIFIED:20240619T163547Z
UID:26815-1720436400-1720440000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue working on final report \nAny ideas/interest in another microvia project? 
URL:https://hdpusergroup.org/event/microvia-rel-49/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240708T150000Z
DTEND:20240708T160000Z
DTSTAMP:20260428T061350
CREATED:20240610T154521Z
LAST-MODIFIED:20240610T154521Z
UID:26786-1720432800-1720436400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-48/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240703T010000Z
DTEND:20240703T020000Z
DTSTAMP:20260428T061350
CREATED:20240612T013448Z
LAST-MODIFIED:20240612T013448Z
UID:26790-1719950400-1719954000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240702T170000Z
DTEND:20240702T180000Z
DTSTAMP:20260428T061350
CREATED:20240619T121119Z
LAST-MODIFIED:20240619T121119Z
UID:26762-1719921600-1719925200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-9/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T230000Z
DTEND:20240628T000000Z
DTSTAMP:20260428T061350
CREATED:20240617T124646Z
LAST-MODIFIED:20240617T124646Z
UID:26761-1719511200-1719514800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Coninue working on project definition 
URL:https://hdpusergroup.org/event/porosity-9/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T210000Z
DTEND:20240627T220000Z
DTSTAMP:20260428T061350
CREATED:20240613T231044Z
LAST-MODIFIED:20240613T231044Z
UID:26803-1719504000-1719507600@hdpusergroup.org
SUMMARY:Idea discussion: Glass Substrates for IC Packages
DESCRIPTION:Idea discussion: Glass Substrates for IC Packages
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T150000Z
DTEND:20240627T160000Z
DTSTAMP:20260428T061350
CREATED:20240610T145141Z
LAST-MODIFIED:20240610T145141Z
UID:26763-1719482400-1719486000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-12/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240626T150000Z
DTEND:20240626T160000Z
DTSTAMP:20260428T061350
CREATED:20240612T160251Z
LAST-MODIFIED:20240612T160251Z
UID:26793-1719396000-1719399600@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-10/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240625T200000Z
DTEND:20240625T210000Z
DTSTAMP:20260428T061350
CREATED:20240614T183511Z
LAST-MODIFIED:20240614T183511Z
UID:26804-1719327600-1719331200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping put the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240624T160000Z
DTEND:20240624T170000Z
DTSTAMP:20260428T061350
CREATED:20240603T165519Z
LAST-MODIFIED:20240603T165519Z
UID:26773-1719226800-1719230400@hdpusergroup.org
SUMMARY:Copper surface roughness model
DESCRIPTION:REview SEM and roughness model numbers. Update on Hurray Model. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T200000Z
DTEND:20240620T210000Z
DTSTAMP:20260428T061350
CREATED:20240530T202807Z
LAST-MODIFIED:20240530T202807Z
UID:26765-1718895600-1718899200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Will look at Weibull plots 
URL:https://hdpusergroup.org/event/photonic-soldering-2-23/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T170000Z
DTEND:20240620T180000Z
DTSTAMP:20260428T061350
CREATED:20240619T225104Z
LAST-MODIFIED:20240619T225104Z
UID:26816-1718884800-1718888400@hdpusergroup.org
SUMMARY:HDP document posting
DESCRIPTION:Meeting to review document posting procedure(s) 
URL:https://hdpusergroup.org/event/hdp-document-posting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240620T140000Z
DTEND:20240620T150000Z
DTSTAMP:20260428T061350
CREATED:20240606T143746Z
LAST-MODIFIED:20240606T143746Z
UID:26781-1718874000-1718877600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-26/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240619T160000Z
DTEND:20240619T170000Z
DTSTAMP:20260428T061350
CREATED:20240530T180636Z
LAST-MODIFIED:20240530T180636Z
UID:26764-1718794800-1718798400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review progress on final report 
URL:https://hdpusergroup.org/event/microvia-rel-48/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR