BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260416T190000Z
DTEND:20260416T200000Z
DTSTAMP:20260617T094323
CREATED:20260326T204227Z
LAST-MODIFIED:20260326T204227Z
UID:39804-1776348000-1776351600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Latest FA results \nWork on final report? 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-19/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T150000Z
DTEND:20260416T160000Z
DTSTAMP:20260617T094323
CREATED:20260327T005130Z
LAST-MODIFIED:20260327T005130Z
UID:39809-1776333600-1776337200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project WebEx Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-15/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T140000Z
DTEND:20260416T150000Z
DTSTAMP:20260617T094323
CREATED:20260330T160121Z
LAST-MODIFIED:20260330T160121Z
UID:39690-1776330000-1776333600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-18/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260415T200000Z
DTEND:20260415T210000Z
DTSTAMP:20260617T094323
CREATED:20260401T205730Z
LAST-MODIFIED:20260401T205730Z
UID:39972-1776265200-1776268800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-27/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260414T190000Z
DTEND:20260414T200000Z
DTSTAMP:20260617T094323
CREATED:20260402T152744Z
LAST-MODIFIED:20260402T152744Z
UID:39992-1776175200-1776178800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260414T150000Z
DTEND:20260414T160000Z
DTSTAMP:20260617T094323
CREATED:20260401T192322Z
LAST-MODIFIED:20260401T192322Z
UID:39968-1776160800-1776164400@hdpusergroup.org
SUMMARY:Better CAF  Eq
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/better-caf-eq-57/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260413T150000Z
DTEND:20260413T160000Z
DTSTAMP:20260617T094323
CREATED:20260323T160624Z
LAST-MODIFIED:20260323T160624Z
UID:39790-1776074400-1776078000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-4/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260408T160000Z
DTEND:20260408T170000Z
DTSTAMP:20260617T094323
CREATED:20260325T171305Z
LAST-MODIFIED:20260325T171305Z
UID:39800-1775646000-1775649600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project WebEx Call 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-7/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260408T150000Z
DTEND:20260408T160000Z
DTSTAMP:20260617T094323
CREATED:20260325T154002Z
LAST-MODIFIED:20260325T154002Z
UID:39794-1775642400-1775646000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-12/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260407T170000Z
DTEND:20260407T180000Z
DTSTAMP:20260617T094323
CREATED:20260313T155928Z
LAST-MODIFIED:20260313T155928Z
UID:39602-1775563200-1775566800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260407T150000Z
DTEND:20260407T160000Z
DTSTAMP:20260617T094323
CREATED:20260327T132925Z
LAST-MODIFIED:20260327T132925Z
UID:39829-1775556000-1775559600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-11/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260403T000000Z
DTEND:20260403T010000Z
DTSTAMP:20260617T094323
CREATED:20260327T001103Z
LAST-MODIFIED:20260327T001103Z
UID:39808-1775156400-1775160000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Any last minute changes to BoD application for Phase 2 \nNext final report draft 
URL:https://hdpusergroup.org/event/porosity-31/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T210000Z
DTEND:20260402T220000Z
DTSTAMP:20260617T094323
CREATED:20260323T155600Z
LAST-MODIFIED:20260323T155600Z
UID:39394-1775145600-1775149200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:*Due to an urgent matter involving the leader (Rich DePoto)\, the schedule has been changed to March 26–April 2.
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-33/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T150000Z
DTEND:20260402T160000Z
DTSTAMP:20260617T094323
CREATED:20260312T155225Z
LAST-MODIFIED:20260312T155225Z
UID:39586-1775124000-1775127600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-4/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T010000Z
DTEND:20260402T020000Z
DTSTAMP:20260617T094323
CREATED:20260312T142246Z
LAST-MODIFIED:20260312T142246Z
UID:39579-1775073600-1775077200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-34/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260401T200000Z
DTEND:20260401T210000Z
DTSTAMP:20260617T094323
CREATED:20260325T183213Z
LAST-MODIFIED:20260325T183213Z
UID:39802-1775055600-1775059200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-26/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260401T150000Z
DTEND:20260401T160000Z
DTSTAMP:20260617T094323
CREATED:20260219T165127Z
LAST-MODIFIED:20260219T165127Z
UID:39300-1775037600-1775041200@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-7/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260331T190000Z
DTEND:20260331T200000Z
DTSTAMP:20260617T094323
CREATED:20260317T115257Z
LAST-MODIFIED:20260317T115257Z
UID:39624-1774965600-1774969200@hdpusergroup.org
SUMMARY:Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability
DESCRIPTION:Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability \n  
URL:https://hdpusergroup.org/event/project-kickoff-call-effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260331T150000Z
DTEND:20260331T160000Z
DTSTAMP:20260617T094323
CREATED:20260225T153728Z
LAST-MODIFIED:20260225T153728Z
UID:39389-1774951200-1774954800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-44/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260327T130000Z
DTEND:20260327T140000Z
DTSTAMP:20260617T094323
CREATED:20260326T204626Z
LAST-MODIFIED:20260326T204626Z
UID:39805-1774598400-1774602000@hdpusergroup.org
SUMMARY:Discussion in setting meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/discussion-in-setting-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260327T000000Z
DTEND:20260327T010000Z
DTSTAMP:20260617T094323
CREATED:20260316T165638Z
LAST-MODIFIED:20260316T165638Z
UID:39618-1774551600-1774555200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Loose ends \nWork on final report and presentation to close project \nPresentation asking BoD permission for Phase 2 
URL:https://hdpusergroup.org/event/porosity-30/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260326T200000Z
DTEND:20260326T210000Z
DTSTAMP:20260617T094323
CREATED:20260219T213323Z
LAST-MODIFIED:20260219T213323Z
UID:39303-1774537200-1774540800@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Progress on FA \nWork on Final Report 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-18/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260326T160000Z
DTEND:20260326T170000Z
DTSTAMP:20260617T094323
CREATED:20260311T144712Z
LAST-MODIFIED:20260311T144712Z
UID:39177-1774522800-1774526400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-4/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260326T140000Z
DTEND:20260326T150000Z
DTSTAMP:20260617T094323
CREATED:20260219T161409Z
LAST-MODIFIED:20260219T161409Z
UID:39298-1774515600-1774519200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-14/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260325T180000Z
DTEND:20260325T190000Z
DTSTAMP:20260617T094323
CREATED:20260311T182743Z
LAST-MODIFIED:20260311T182743Z
UID:39574-1774443600-1774447200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:More indepth look at data \nReviw first report draft 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-25/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260325T160000Z
DTEND:20260325T170000Z
DTSTAMP:20260617T094323
CREATED:20260221T014559Z
LAST-MODIFIED:20260221T014559Z
UID:39341-1774436400-1774440000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-5/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260325T150000Z
DTEND:20260325T160000Z
DTSTAMP:20260617T094323
CREATED:20260218T165214Z
LAST-MODIFIED:20260218T165214Z
UID:39262-1774432800-1774436400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-11/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260324T150000Z
DTEND:20260324T160000Z
DTSTAMP:20260617T094323
CREATED:20260219T140915Z
LAST-MODIFIED:20260219T140915Z
UID:39295-1774346400-1774350000@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-12/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260324T130000Z
DTEND:20260324T140000Z
DTSTAMP:20260617T094323
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38741-1774339200-1774342800@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-03-24/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260323T150000Z
DTEND:20260323T160000Z
DTSTAMP:20260617T094323
CREATED:20260216T172457Z
LAST-MODIFIED:20260216T172457Z
UID:39201-1774260000-1774263600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-3/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR