BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240814T160000Z
DTEND:20240814T170000Z
DTSTAMP:20260428T001353
CREATED:20240711T203912Z
LAST-MODIFIED:20240711T203912Z
UID:27037-1723633200-1723636800@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Status of visual and x-ray inpsection of ATC boards \nStatus on drop testing \nStatus on FA \nProgress on final report 
URL:https://hdpusergroup.org/event/photonic-soldering-32/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240808T180000Z
DTEND:20240808T190000Z
DTSTAMP:20260428T001353
CREATED:20240801T180153Z
LAST-MODIFIED:20240801T180153Z
UID:27089-1723122000-1723125600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Historically\, UL considered glass reinforcement an inert portion of the laminate composition. Glass styles were tested based on a range of thicknesses. Recently UL data showed differences in performance between E-glass and Low Dk-glass. Modern circuit design trends require Low Dk-glass for microvia technology. They enable\, improved CAF resistance\, and extend the usable frequency range.PWBs are exposed to sustained and cyclic temperatures when installed in end products. Laminate RTI and PWB MOT ratings are used to mitigate risk of Fire and Electric shock. Laminates provide mechanical support\, dielectric insulation and flammability properties for the PWB to support traces and components and maintain electrical clearance and creepage spacing. Degradation and material variation investigations are important to understand the material performance does not change over time.The question is how these glass trends affect the laminate performance from a short- and long-term degradation perspective. This project will evaluate the need for additional testing of Low Dk glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-11/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T200000Z
DTEND:20240807T210000Z
DTSTAMP:20260428T001353
CREATED:20240725T203523Z
LAST-MODIFIED:20240725T203523Z
UID:27069-1723042800-1723046400@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Look at new artwork \nStatus of possible service provider 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-4/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T150000Z
DTEND:20240807T160000Z
DTSTAMP:20260428T001353
CREATED:20240724T153555Z
LAST-MODIFIED:20240724T153555Z
UID:27062-1723024800-1723028400@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-13/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240806T170000Z
DTEND:20240806T180000Z
DTSTAMP:20260428T001353
CREATED:20240702T173253Z
LAST-MODIFIED:20240702T173253Z
UID:26930-1722945600-1722949200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240806T150000Z
DTEND:20240806T160000Z
DTSTAMP:20260428T001353
CREATED:20240723T160450Z
LAST-MODIFIED:20240723T160450Z
UID:27060-1722938400-1722942000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review most recent version of final report \nDiscuss possible new project 
URL:https://hdpusergroup.org/event/microvia-rel-50/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240801T230000Z
DTEND:20240802T000000Z
DTSTAMP:20260428T001353
CREATED:20240718T235946Z
LAST-MODIFIED:20240718T235946Z
UID:27054-1722535200-1722538800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue working on project Definition 
URL:https://hdpusergroup.org/event/porosity-11/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240801T210000Z
DTEND:20240801T220000Z
DTSTAMP:20260428T001353
CREATED:20240718T221756Z
LAST-MODIFIED:20240718T221756Z
UID:27053-1722528000-1722531600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-2/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240801T010000Z
DTEND:20240801T020000Z
DTSTAMP:20260428T001353
CREATED:20240717T021607Z
LAST-MODIFIED:20240717T021607Z
UID:27044-1722456000-1722459600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-3/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240731T150000Z
DTEND:20240731T160000Z
DTSTAMP:20260428T001353
CREATED:20240710T155645Z
LAST-MODIFIED:20240710T155645Z
UID:27025-1722420000-1722423600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-22/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240729T150000Z
DTEND:20240729T160000Z
DTSTAMP:20260428T001353
CREATED:20240708T160728Z
LAST-MODIFIED:20240708T160728Z
UID:27020-1722247200-1722250800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency  
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-49/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T200000Z
DTEND:20240725T210000Z
DTSTAMP:20260428T001353
CREATED:20240710T202911Z
LAST-MODIFIED:20240710T202911Z
UID:27027-1721919600-1721923200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-3/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T150000Z
DTEND:20240725T160000Z
DTSTAMP:20260428T001353
CREATED:20240627T153219Z
LAST-MODIFIED:20240627T153219Z
UID:26896-1721901600-1721905200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T140000Z
DTEND:20240725T150000Z
DTSTAMP:20260428T001353
CREATED:20240718T160104Z
LAST-MODIFIED:20240718T160104Z
UID:27052-1721898000-1721901600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Response from Singapore \nNext steps 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T150000Z
DTEND:20240724T160000Z
DTSTAMP:20260428T001353
CREATED:20240710T165503Z
LAST-MODIFIED:20240710T165503Z
UID:27026-1721815200-1721818800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-12/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T140000Z
DTEND:20240724T150000Z
DTSTAMP:20260428T001353
CREATED:20240710T141037Z
LAST-MODIFIED:20240710T141037Z
UID:27024-1721811600-1721815200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-12/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240723T150000Z
DTEND:20240723T160000Z
DTSTAMP:20260428T001353
CREATED:20240708T162242Z
LAST-MODIFIED:20240708T162242Z
UID:27021-1721728800-1721732400@hdpusergroup.org
SUMMARY:Microvia Reliability
DESCRIPTION:Continuing to review final report 
URL:https://hdpusergroup.org/event/microvia-reliability-4/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240719T150000Z
DTEND:20240719T160000Z
DTSTAMP:20260428T001353
CREATED:20240711T175331Z
LAST-MODIFIED:20240711T175331Z
UID:27033-1721383200-1721386800@hdpusergroup.org
SUMMARY:permittivity of cooling fluids
DESCRIPTION:Study of non PFAS cooling fluids under time and temperature excursions 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-6/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T230000Z
DTEND:20240719T000000Z
DTSTAMP:20260428T001353
CREATED:20240628T005745Z
LAST-MODIFIED:20240628T005745Z
UID:26900-1721325600-1721329200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/porosity-10/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T210000Z
DTEND:20240718T220000Z
DTSTAMP:20260428T001353
CREATED:20240627T220403Z
LAST-MODIFIED:20240627T220403Z
UID:26899-1721318400-1721322000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T150000Z
DTEND:20240718T160000Z
DTSTAMP:20260428T001353
CREATED:20240716T160530Z
LAST-MODIFIED:20240716T160530Z
UID:27043-1721296800-1721300400@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Hopefully ressolve any difficulties 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T140000Z
DTEND:20240718T150000Z
DTSTAMP:20260428T001353
CREATED:20240620T141945Z
LAST-MODIFIED:20240620T141945Z
UID:26818-1721293200-1721296800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-27/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T160000Z
DTEND:20240717T170000Z
DTSTAMP:20260428T001353
CREATED:20240613T163408Z
LAST-MODIFIED:20240613T163408Z
UID:26802-1721214000-1721217600@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T140000Z
DTEND:20240717T150000Z
DTSTAMP:20260428T001353
CREATED:20240612T141254Z
LAST-MODIFIED:20240612T141254Z
UID:26792-1721206800-1721210400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-10/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T010000Z
DTEND:20240717T020000Z
DTSTAMP:20260428T001353
CREATED:20240703T020328Z
LAST-MODIFIED:20240703T020328Z
UID:26974-1721160000-1721163600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-2/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240716T150000Z
DTEND:20240716T160000Z
DTSTAMP:20260428T001353
CREATED:20240618T151837Z
LAST-MODIFIED:20240618T151837Z
UID:26808-1721124000-1721127600@hdpusergroup.org
SUMMARY:Better CAF eq
DESCRIPTION:Status update on testing \nPossible further discussion on data already colllected 
URL:https://hdpusergroup.org/event/better-caf-eq-39/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T200000Z
DTEND:20240711T210000Z
DTSTAMP:20260428T001353
CREATED:20240626T183539Z
LAST-MODIFIED:20240626T183539Z
UID:26894-1720710000-1720713600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Starting on final report \nStatus on drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-25/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T150000Z
DTEND:20240711T160000Z
DTSTAMP:20260428T001353
CREATED:20240529T153334Z
LAST-MODIFIED:20240529T153334Z
UID:26753-1720692000-1720695600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-32/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T200000Z
DTEND:20240710T210000Z
DTSTAMP:20260428T001353
CREATED:20240625T202541Z
LAST-MODIFIED:20240625T202541Z
UID:26891-1720623600-1720627200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue pulling things together to move from Idea to Definition 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-2/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T160000Z
DTEND:20240710T170000Z
DTSTAMP:20260428T001353
CREATED:20240626T161217Z
LAST-MODIFIED:20240626T161217Z
UID:26892-1720609200-1720612800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-11/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR