BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240920T020000Z
DTEND:20240920T030000Z
DTSTAMP:20260426T230815
CREATED:20240906T144455Z
LAST-MODIFIED:20240906T144455Z
UID:27428-1726779600-1726783200@hdpusergroup.org
SUMMARY:TTM-HDP Call on February 2025 Member Meeting
DESCRIPTION:TTM-HDP Call on February 2025 Member Meeting 
URL:https://hdpusergroup.org/event/ttm-hdp-call-on-february-2025-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T160000Z
DTEND:20240919T170000Z
DTSTAMP:20260426T230815
CREATED:20240830T185123Z
LAST-MODIFIED:20240830T185123Z
UID:27298-1726743600-1726747200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Review progres with Dr. Fan. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-15/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T150000Z
DTEND:20240919T160000Z
DTSTAMP:20260426T230815
CREATED:20240822T162135Z
LAST-MODIFIED:20240822T162135Z
UID:27233-1726740000-1726743600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T000000Z
DTEND:20240919T010000Z
DTSTAMP:20260426T230815
CREATED:20240905T024818Z
LAST-MODIFIED:20240905T024818Z
UID:27394-1726686000-1726689600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-6/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T200000Z
DTEND:20240918T210000Z
DTSTAMP:20260426T230815
CREATED:20240828T202441Z
LAST-MODIFIED:20240828T202441Z
UID:27265-1726671600-1726675200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-6/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T150000Z
DTEND:20240918T160000Z
DTSTAMP:20260426T230815
CREATED:20240904T153459Z
LAST-MODIFIED:20240904T153459Z
UID:27380-1726653600-1726657200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-15/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T140000Z
DTEND:20240918T150000Z
DTSTAMP:20260426T230815
CREATED:20240905T143853Z
LAST-MODIFIED:20240905T143853Z
UID:27400-1726650000-1726653600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-14/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T170000Z
DTEND:20240917T180000Z
DTSTAMP:20260426T230815
CREATED:20240917T144357Z
LAST-MODIFIED:20240917T144357Z
UID:27743-1726574400-1726578000@hdpusergroup.org
SUMMARY:BOD explantion w/Karl
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/bod-explantion-w-karl/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T150000Z
DTEND:20240917T160000Z
DTSTAMP:20260426T230815
CREATED:20240821T142638Z
LAST-MODIFIED:20240821T142638Z
UID:27221-1726567200-1726570800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason \nReview presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-41/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T090000Z
DTEND:20240917T220000Z
DTSTAMP:20260426T230815
CREATED:20240917T083158Z
LAST-MODIFIED:20240917T083158Z
UID:27599-1726545600-1726592400@hdpusergroup.org
SUMMARY:Caffeine Test Event
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/caffeine-test-event/
LOCATION:Virtual
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240916T150000Z
DTEND:20240916T160000Z
DTSTAMP:20260426T230815
CREATED:20240826T160231Z
LAST-MODIFIED:20240826T160231Z
UID:27247-1726480800-1726484400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-51/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T230000Z
DTEND:20240913T000000Z
DTSTAMP:20260426T230815
CREATED:20240822T232709Z
LAST-MODIFIED:20240822T232709Z
UID:27235-1726164000-1726167600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Report on singulation \nHave we moved ot Implementation? 
URL:https://hdpusergroup.org/event/porosity-12/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T210000Z
DTEND:20240912T220000Z
DTSTAMP:20260426T230815
CREATED:20240822T220236Z
LAST-MODIFIED:20240822T220236Z
UID:27234-1726156800-1726160400@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-4/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T140000Z
DTEND:20240912T150000Z
DTSTAMP:20260426T230815
CREATED:20240815T141710Z
LAST-MODIFIED:20240815T141710Z
UID:27211-1726131600-1726135200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-34/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240911T160000Z
DTEND:20240911T170000Z
DTSTAMP:20260426T230815
CREATED:20240827T211856Z
LAST-MODIFIED:20240827T211856Z
UID:27260-1726052400-1726056000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project Phase 1 and 2
DESCRIPTION:Inner Layer Copper Balancing Project Phase 1 and 2 Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project-phase-1-and-2-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240911T150000Z
DTEND:20240911T160000Z
DTSTAMP:20260426T230815
CREATED:20240821T155541Z
LAST-MODIFIED:20240821T155541Z
UID:27224-1726048800-1726052400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-29/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240910T180000Z
DTEND:20240910T190000Z
DTSTAMP:20260426T230815
CREATED:20240906T155703Z
LAST-MODIFIED:20240906T155703Z
UID:27430-1725973200-1725976800@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Input from Ivan 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-16/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240905T180000Z
DTEND:20240905T190000Z
DTSTAMP:20260426T230815
CREATED:20240827T203855Z
LAST-MODIFIED:20240827T203855Z
UID:27258-1725541200-1725544800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/microvia-rel-51/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240905T170000Z
DTEND:20240905T180000Z
DTSTAMP:20260426T230815
CREATED:20240827T203554Z
LAST-MODIFIED:20240827T203554Z
UID:27257-1725537600-1725541200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Continue working on final report 
URL:https://hdpusergroup.org/event/photonic-soldering-2-25/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240905T160000Z
DTEND:20240905T170000Z
DTSTAMP:20260426T230815
CREATED:20240822T151320Z
LAST-MODIFIED:20240822T151320Z
UID:27232-1725534000-1725537600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Results of AGC in-house experiments 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-15/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240905T010000Z
DTEND:20240905T020000Z
DTSTAMP:20260426T230815
CREATED:20240822T014601Z
LAST-MODIFIED:20240822T014601Z
UID:27230-1725480000-1725483600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-5/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240904T160000Z
DTEND:20240904T170000Z
DTSTAMP:20260426T230815
CREATED:20240827T205558Z
LAST-MODIFIED:20240827T205558Z
UID:27047-1725447600-1725451200@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-5/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240904T150000Z
DTEND:20240904T160000Z
DTSTAMP:20260426T230815
CREATED:20240807T151819Z
LAST-MODIFIED:20240807T151819Z
UID:27104-1725444000-1725447600@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-14/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240904T020000Z
DTEND:20240904T030000Z
DTSTAMP:20260426T230815
CREATED:20240826T073225Z
LAST-MODIFIED:20240826T073225Z
UID:27246-1725397200-1725400800@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-54/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240903T170000Z
DTEND:20240903T180000Z
DTSTAMP:20260426T230815
CREATED:20240808T134623Z
LAST-MODIFIED:20240808T134623Z
UID:27109-1725364800-1725368400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations -- Periodic Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-periodic-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T160000Z
DTEND:20240829T170000Z
DTSTAMP:20260426T230815
CREATED:20240815T163809Z
LAST-MODIFIED:20240815T163809Z
UID:27212-1724929200-1724932800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-14/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T150000Z
DTEND:20240829T160000Z
DTSTAMP:20260426T230815
CREATED:20240731T153940Z
LAST-MODIFIED:20240731T153940Z
UID:27080-1724925600-1724929200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-23/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T200000Z
DTEND:20240828T210000Z
DTSTAMP:20260426T230815
CREATED:20240821T200605Z
LAST-MODIFIED:20240821T200605Z
UID:27106-1724857200-1724860800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-5/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T140000Z
DTEND:20240828T150000Z
DTSTAMP:20260426T230815
CREATED:20240726T140636Z
LAST-MODIFIED:20240726T140636Z
UID:27061-1724835600-1724839200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-13/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240827T200000Z
DTEND:20240827T210000Z
DTSTAMP:20260426T230815
CREATED:20240821T143606Z
LAST-MODIFIED:20240821T143606Z
UID:27222-1724770800-1724774400@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Status of final report 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-26/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR