BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20241011T010000Z
DTEND:20241011T020000Z
DTSTAMP:20260426T171304
CREATED:20240927T025511Z
LAST-MODIFIED:20240927T025511Z
UID:28062-1728590400-1728594000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-8/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241009T140000Z
DTEND:20241009T150000Z
DTSTAMP:20260426T171304
CREATED:20240925T150743Z
LAST-MODIFIED:20240925T150743Z
UID:28058-1728464400-1728468000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-13/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241008T140000Z
DTEND:20241008T203000Z
DTSTAMP:20260426T171304
CREATED:20240926T192739Z
LAST-MODIFIED:20240926T192739Z
UID:27776-1728378000-1728401400@hdpusergroup.org
SUMMARY:HDP Board of Directors Meeting Fall 2024
DESCRIPTION:HDP Fall Board of Directors Meeting. \nCall Information (a meeting ics file is available for download at the bottom of this page) \nWhen it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting link \nhttps://hdpug.webex.com/hdpug/j.php?MTID=md249dc107ebf944e455e5058b5758bfdJoin by meeting numberMeeting number (access code): 2556 671 6406Meeting password: HDPBoD1024Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-meeting-fall-2024/
LOCATION:Virtual
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241007T150000Z
DTEND:20241007T160000Z
DTSTAMP:20260426T171304
CREATED:20240916T153639Z
LAST-MODIFIED:20240916T153639Z
UID:27726-1728295200-1728298800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-52/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241003T230000Z
DTEND:20241004T000000Z
DTSTAMP:20260426T171304
CREATED:20240923T153737Z
LAST-MODIFIED:20240923T153737Z
UID:28052-1727978400-1727982000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Tie up loose ends \nCoomplete presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/porosity-13/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241003T150000Z
DTEND:20241003T160000Z
DTSTAMP:20260426T171304
CREATED:20240911T155103Z
LAST-MODIFIED:20240911T155103Z
UID:27550-1727949600-1727953200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-30/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T200000Z
DTEND:20241002T210000Z
DTSTAMP:20260426T171304
CREATED:20241001T001141Z
LAST-MODIFIED:20241001T001141Z
UID:28066-1727881200-1727884800@hdpusergroup.org
SUMMARY:Photonic Soldering AND MicroRel
DESCRIPTION:Briefly discuss Microvia Rel project \nMore on Photontic project 
URL:https://hdpusergroup.org/event/photonic-soldering-and-microrel/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T190000Z
DTEND:20241002T200000Z
DTSTAMP:20260426T171304
CREATED:20240918T151905Z
LAST-MODIFIED:20240918T151905Z
UID:27762-1727877600-1727881200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-16/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T150000Z
DTEND:20241002T160000Z
DTSTAMP:20260426T171304
CREATED:20240829T154331Z
LAST-MODIFIED:20240829T154331Z
UID:27270-1727863200-1727866800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-24/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T140000Z
DTEND:20241002T150000Z
DTSTAMP:20260426T171304
CREATED:20240918T144214Z
LAST-MODIFIED:20240918T144214Z
UID:27761-1727859600-1727863200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-15/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241001T170000Z
DTEND:20241001T180000Z
DTSTAMP:20260426T171304
CREATED:20240911T164927Z
LAST-MODIFIED:20240911T164927Z
UID:27551-1727784000-1727787600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-10/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241001T150000Z
DTEND:20241001T160000Z
DTSTAMP:20260426T171304
CREATED:20240918T210916Z
LAST-MODIFIED:20240918T210916Z
UID:27765-1727776800-1727780400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Update from Jason \nTalk with Hubert about his recent results 
URL:https://hdpusergroup.org/event/better-caf-eq-42/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240927T020000Z
DTEND:20240927T030000Z
DTSTAMP:20260426T171304
CREATED:20240919T235426Z
LAST-MODIFIED:20240919T235426Z
UID:27767-1727384400-1727388000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-7/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T210000Z
DTEND:20240926T220000Z
DTSTAMP:20260426T171304
CREATED:20240912T214140Z
LAST-MODIFIED:20240912T214140Z
UID:27636-1727366400-1727370000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-5/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T150000Z
DTEND:20240926T160000Z
DTSTAMP:20260426T171304
CREATED:20240904T124943Z
LAST-MODIFIED:20240904T124943Z
UID:27379-1727344800-1727348400@hdpusergroup.org
SUMMARY:TCE materials -New Project Idea Call
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. A relative comparison of laminates is needed. SAC 305 alloy and SnPb will be evaluated as part of the project. Project team will select the harshest test parameters. Test vehicle will include a dimensional test coupon and features to assemble CABGA 192 components (package size 14mm X 14mm). The project will also consider evaluating a larger BGA to compare to the CABGA. \nThe project will evaluate several materials that have significant differences in the TCE in X-Y and Z axis. In addition\, glass cloth styles and thickness may also play a role in the XY expansion. The Project team will also select several glass styles as part of the evaluation. \n  \nThere are three possible thermal profiles to measure reliability. These are: \n  \n\n0 to 100 Celsius\n-40 to 125 Celsius\n-55 to 125 Celsius\n\nThe team will chose two of the thermal cycles. 
URL:https://hdpusergroup.org/event/tce-materials-new-project-idea-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240925T140000Z
DTEND:20240925T150000Z
DTSTAMP:20260426T171304
CREATED:20240905T144240Z
LAST-MODIFIED:20240905T144240Z
UID:27223-1727254800-1727258400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-12/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240920T020000Z
DTEND:20240920T030000Z
DTSTAMP:20260426T171304
CREATED:20240906T144455Z
LAST-MODIFIED:20240906T144455Z
UID:27428-1726779600-1726783200@hdpusergroup.org
SUMMARY:TTM-HDP Call on February 2025 Member Meeting
DESCRIPTION:TTM-HDP Call on February 2025 Member Meeting 
URL:https://hdpusergroup.org/event/ttm-hdp-call-on-february-2025-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T160000Z
DTEND:20240919T170000Z
DTSTAMP:20260426T171304
CREATED:20240830T185123Z
LAST-MODIFIED:20240830T185123Z
UID:27298-1726743600-1726747200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Review progres with Dr. Fan. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-15/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T150000Z
DTEND:20240919T160000Z
DTSTAMP:20260426T171304
CREATED:20240822T162135Z
LAST-MODIFIED:20240822T162135Z
UID:27233-1726740000-1726743600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T000000Z
DTEND:20240919T010000Z
DTSTAMP:20260426T171304
CREATED:20240905T024818Z
LAST-MODIFIED:20240905T024818Z
UID:27394-1726686000-1726689600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-6/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T200000Z
DTEND:20240918T210000Z
DTSTAMP:20260426T171304
CREATED:20240828T202441Z
LAST-MODIFIED:20240828T202441Z
UID:27265-1726671600-1726675200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-6/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T150000Z
DTEND:20240918T160000Z
DTSTAMP:20260426T171304
CREATED:20240904T153459Z
LAST-MODIFIED:20240904T153459Z
UID:27380-1726653600-1726657200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-15/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T140000Z
DTEND:20240918T150000Z
DTSTAMP:20260426T171304
CREATED:20240905T143853Z
LAST-MODIFIED:20240905T143853Z
UID:27400-1726650000-1726653600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-14/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T170000Z
DTEND:20240917T180000Z
DTSTAMP:20260426T171304
CREATED:20240917T144357Z
LAST-MODIFIED:20240917T144357Z
UID:27743-1726574400-1726578000@hdpusergroup.org
SUMMARY:BOD explantion w/Karl
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/bod-explantion-w-karl/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T150000Z
DTEND:20240917T160000Z
DTSTAMP:20260426T171304
CREATED:20240821T142638Z
LAST-MODIFIED:20240821T142638Z
UID:27221-1726567200-1726570800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason \nReview presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-41/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240917T090000Z
DTEND:20240917T220000Z
DTSTAMP:20260426T171304
CREATED:20240917T083158Z
LAST-MODIFIED:20240917T083158Z
UID:27599-1726545600-1726592400@hdpusergroup.org
SUMMARY:Caffeine Test Event
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/caffeine-test-event/
LOCATION:Virtual
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240916T150000Z
DTEND:20240916T160000Z
DTSTAMP:20260426T171304
CREATED:20240826T160231Z
LAST-MODIFIED:20240826T160231Z
UID:27247-1726480800-1726484400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-51/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T230000Z
DTEND:20240913T000000Z
DTSTAMP:20260426T171304
CREATED:20240822T232709Z
LAST-MODIFIED:20240822T232709Z
UID:27235-1726164000-1726167600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Report on singulation \nHave we moved ot Implementation? 
URL:https://hdpusergroup.org/event/porosity-12/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T210000Z
DTEND:20240912T220000Z
DTSTAMP:20260426T171304
CREATED:20240822T220236Z
LAST-MODIFIED:20240822T220236Z
UID:27234-1726156800-1726160400@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-4/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240912T140000Z
DTEND:20240912T150000Z
DTSTAMP:20260426T171304
CREATED:20240815T141710Z
LAST-MODIFIED:20240815T141710Z
UID:27211-1726131600-1726135200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-34/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR