BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20241031T230000Z
DTEND:20241101T000000Z
DTSTAMP:20260426T123244
CREATED:20241003T234820Z
LAST-MODIFIED:20241003T234820Z
UID:28084-1730397600-1730401200@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Where are we on pilot runs 
URL:https://hdpusergroup.org/event/porosity-testing-3/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241031T140000Z
DTEND:20241031T150000Z
DTSTAMP:20260426T123244
CREATED:20241003T152645Z
LAST-MODIFIED:20241003T152645Z
UID:28083-1730365200-1730368800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-31/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T200000Z
DTEND:20241030T210000Z
DTSTAMP:20260426T123244
CREATED:20241002T190549Z
LAST-MODIFIED:20241002T190549Z
UID:27764-1730300400-1730304000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Hopefully had both a CAD source and PCB manufacturer onboard before the meeting or by the end of the meeting. 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-7/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T160000Z
DTEND:20241030T170000Z
DTSTAMP:20260426T123244
CREATED:20241015T152049Z
LAST-MODIFIED:20241015T152049Z
UID:28170-1730286000-1730289600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing – Phase 2
DESCRIPTION:Inner Layer Cu Balancing – Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T150000Z
DTEND:20241030T160000Z
DTSTAMP:20260426T123244
CREATED:20241002T155218Z
LAST-MODIFIED:20241002T155218Z
UID:28070-1730282400-1730286000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-25/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241028T150000Z
DTEND:20241028T160000Z
DTSTAMP:20260426T123244
CREATED:20241007T160601Z
LAST-MODIFIED:20241007T160601Z
UID:28087-1730109600-1730113200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-53/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241024T210000Z
DTEND:20241024T220000Z
DTSTAMP:20260426T123244
CREATED:20240926T214302Z
LAST-MODIFIED:20240926T214302Z
UID:28061-1729785600-1729789200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-6/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241024T140000Z
DTEND:20241024T150000Z
DTSTAMP:20260426T123244
CREATED:20240912T141807Z
LAST-MODIFIED:20240912T141807Z
UID:27632-1729760400-1729764000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-35/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241023T150000Z
DTEND:20241023T160000Z
DTSTAMP:20260426T123244
CREATED:20240919T151834Z
LAST-MODIFIED:20240919T151834Z
UID:27779-1729677600-1729681200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-16/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241016T130000Z
DTEND:20241016T220000Z
DTSTAMP:20260426T123244
CREATED:20241029T123752Z
LAST-MODIFIED:20241029T123752Z
UID:26904-1729065600-1729098000@hdpusergroup.org
SUMMARY:HDP Fall Virtual Meeting
DESCRIPTION:The Fall HDP Member Meeting will be held virtually October 16 & 17\, 2024.  Please register for the meeting using the register button on this page\, or contact the HDP Business Manager at kima77@hdpug.org. \nMeeting Call Information – ICS Files available for download at the bottom of this page \nDay 1 \nJoin meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m87607b08d07adf257621c7564c79aa54Join by meeting numberMeeting number (access code): 2557 893 7654Meeting password: HDPFall24Day1 \nJoin by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nDay 2 \n \nJoin meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m8002b0415955b78e4d1bb7151f06e7f2Join by meeting numberMeeting number (access code): 2558 224 3278Meeting password: HDPFall24Day2Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-fall-virtual-meeting/2024-10-16/
LOCATION:Virtual
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241015T180000Z
DTEND:20241015T190000Z
DTSTAMP:20260426T123244
CREATED:20241010T205633Z
LAST-MODIFIED:20241010T205633Z
UID:28097-1728997200-1729000800@hdpusergroup.org
SUMMARY:Bylaws Review
DESCRIPTION:Review of Bylaws - Vacancy Sections 
URL:https://hdpusergroup.org/event/bylaws-review/
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241015T150000Z
DTEND:20241015T160000Z
DTSTAMP:20260426T123244
CREATED:20240923T130912Z
LAST-MODIFIED:20240923T130912Z
UID:28051-1728986400-1728990000@hdpusergroup.org
SUMMARY:Gene Weiner Test Run
DESCRIPTION:Test run with Gene Weiner. 
URL:https://hdpusergroup.org/event/gene-weiner-test-run/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241011T010000Z
DTEND:20241011T020000Z
DTSTAMP:20260426T123244
CREATED:20240927T025511Z
LAST-MODIFIED:20240927T025511Z
UID:28062-1728590400-1728594000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-8/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241009T140000Z
DTEND:20241009T150000Z
DTSTAMP:20260426T123244
CREATED:20240925T150743Z
LAST-MODIFIED:20240925T150743Z
UID:28058-1728464400-1728468000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-13/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241008T140000Z
DTEND:20241008T203000Z
DTSTAMP:20260426T123244
CREATED:20240926T192739Z
LAST-MODIFIED:20240926T192739Z
UID:27776-1728378000-1728401400@hdpusergroup.org
SUMMARY:HDP Board of Directors Meeting Fall 2024
DESCRIPTION:HDP Fall Board of Directors Meeting. \nCall Information (a meeting ics file is available for download at the bottom of this page) \nWhen it’s time\, join the Webex meeting here:Join meetingMore ways to join:Join from the meeting link \nhttps://hdpug.webex.com/hdpug/j.php?MTID=md249dc107ebf944e455e5058b5758bfdJoin by meeting numberMeeting number (access code): 2556 671 6406Meeting password: HDPBoD1024Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-meeting-fall-2024/
LOCATION:Virtual
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241007T150000Z
DTEND:20241007T160000Z
DTSTAMP:20260426T123244
CREATED:20240916T153639Z
LAST-MODIFIED:20240916T153639Z
UID:27726-1728295200-1728298800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-52/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241003T230000Z
DTEND:20241004T000000Z
DTSTAMP:20260426T123244
CREATED:20240923T153737Z
LAST-MODIFIED:20240923T153737Z
UID:28052-1727978400-1727982000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Tie up loose ends \nCoomplete presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/porosity-13/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241003T150000Z
DTEND:20241003T160000Z
DTSTAMP:20260426T123244
CREATED:20240911T155103Z
LAST-MODIFIED:20240911T155103Z
UID:27550-1727949600-1727953200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-30/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T200000Z
DTEND:20241002T210000Z
DTSTAMP:20260426T123244
CREATED:20241001T001141Z
LAST-MODIFIED:20241001T001141Z
UID:28066-1727881200-1727884800@hdpusergroup.org
SUMMARY:Photonic Soldering AND MicroRel
DESCRIPTION:Briefly discuss Microvia Rel project \nMore on Photontic project 
URL:https://hdpusergroup.org/event/photonic-soldering-and-microrel/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T190000Z
DTEND:20241002T200000Z
DTSTAMP:20260426T123244
CREATED:20240918T151905Z
LAST-MODIFIED:20240918T151905Z
UID:27762-1727877600-1727881200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-16/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T150000Z
DTEND:20241002T160000Z
DTSTAMP:20260426T123244
CREATED:20240829T154331Z
LAST-MODIFIED:20240829T154331Z
UID:27270-1727863200-1727866800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-24/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241002T140000Z
DTEND:20241002T150000Z
DTSTAMP:20260426T123244
CREATED:20240918T144214Z
LAST-MODIFIED:20240918T144214Z
UID:27761-1727859600-1727863200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-15/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241001T170000Z
DTEND:20241001T180000Z
DTSTAMP:20260426T123244
CREATED:20240911T164927Z
LAST-MODIFIED:20240911T164927Z
UID:27551-1727784000-1727787600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-10/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241001T150000Z
DTEND:20241001T160000Z
DTSTAMP:20260426T123244
CREATED:20240918T210916Z
LAST-MODIFIED:20240918T210916Z
UID:27765-1727776800-1727780400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Update from Jason \nTalk with Hubert about his recent results 
URL:https://hdpusergroup.org/event/better-caf-eq-42/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240927T020000Z
DTEND:20240927T030000Z
DTSTAMP:20260426T123244
CREATED:20240919T235426Z
LAST-MODIFIED:20240919T235426Z
UID:27767-1727384400-1727388000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-7/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T210000Z
DTEND:20240926T220000Z
DTSTAMP:20260426T123244
CREATED:20240912T214140Z
LAST-MODIFIED:20240912T214140Z
UID:27636-1727366400-1727370000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-5/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T150000Z
DTEND:20240926T160000Z
DTSTAMP:20260426T123244
CREATED:20240904T124943Z
LAST-MODIFIED:20240904T124943Z
UID:27379-1727344800-1727348400@hdpusergroup.org
SUMMARY:TCE materials -New Project Idea Call
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. A relative comparison of laminates is needed. SAC 305 alloy and SnPb will be evaluated as part of the project. Project team will select the harshest test parameters. Test vehicle will include a dimensional test coupon and features to assemble CABGA 192 components (package size 14mm X 14mm). The project will also consider evaluating a larger BGA to compare to the CABGA. \nThe project will evaluate several materials that have significant differences in the TCE in X-Y and Z axis. In addition\, glass cloth styles and thickness may also play a role in the XY expansion. The Project team will also select several glass styles as part of the evaluation. \n  \nThere are three possible thermal profiles to measure reliability. These are: \n  \n\n0 to 100 Celsius\n-40 to 125 Celsius\n-55 to 125 Celsius\n\nThe team will chose two of the thermal cycles. 
URL:https://hdpusergroup.org/event/tce-materials-new-project-idea-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240925T140000Z
DTEND:20240925T150000Z
DTSTAMP:20260426T123244
CREATED:20240905T144240Z
LAST-MODIFIED:20240905T144240Z
UID:27223-1727254800-1727258400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-12/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240920T020000Z
DTEND:20240920T030000Z
DTSTAMP:20260426T123244
CREATED:20240906T144455Z
LAST-MODIFIED:20240906T144455Z
UID:27428-1726779600-1726783200@hdpusergroup.org
SUMMARY:TTM-HDP Call on February 2025 Member Meeting
DESCRIPTION:TTM-HDP Call on February 2025 Member Meeting 
URL:https://hdpusergroup.org/event/ttm-hdp-call-on-february-2025-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240919T160000Z
DTEND:20240919T170000Z
DTSTAMP:20260426T123244
CREATED:20240830T185123Z
LAST-MODIFIED:20240830T185123Z
UID:27298-1726743600-1726747200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Review progres with Dr. Fan. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-15/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR