BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20241210T180000Z
DTEND:20241210T190000Z
DTSTAMP:20260424T105921
CREATED:20241118T185357Z
LAST-MODIFIED:20241118T185357Z
UID:28378-1733832000-1733835600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-11/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241206T150000Z
DTEND:20241206T160000Z
DTSTAMP:20260424T105921
CREATED:20241202T201324Z
LAST-MODIFIED:20241202T201324Z
UID:28554-1733475600-1733479200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discussion with Dr. Fan and use of Huray Model for validation 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-16/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241205T150000Z
DTEND:20241205T160000Z
DTSTAMP:20260424T105921
CREATED:20241114T153743Z
LAST-MODIFIED:20241114T153743Z
UID:28393-1733389200-1733392800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-33/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T210000Z
DTEND:20241204T220000Z
DTSTAMP:20260424T105921
CREATED:20241030T203621Z
LAST-MODIFIED:20241030T203621Z
UID:28285-1733324400-1733328000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about design\, fab\, # of samples\, material type(s) 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-8/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T170000Z
DTEND:20241204T180000Z
DTSTAMP:20260424T105921
CREATED:20241030T163629Z
LAST-MODIFIED:20241030T163629Z
UID:28283-1733310000-1733313600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing - Phase 2
DESCRIPTION:I/L Cu Balancing - Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T160000Z
DTEND:20241204T170000Z
DTSTAMP:20260424T105921
CREATED:20241113T162821Z
LAST-MODIFIED:20241113T162821Z
UID:28390-1733306400-1733310000@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241202T210000Z
DTEND:20241202T220000Z
DTSTAMP:20260424T105921
CREATED:20241202T191306Z
LAST-MODIFIED:20241202T191306Z
UID:28552-1733151600-1733155200@hdpusergroup.org
SUMMARY:meeting with Bev
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-bev/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241127T160000Z
DTEND:20241127T170000Z
DTSTAMP:20260424T105921
CREATED:20241106T161845Z
LAST-MODIFIED:20241106T161845Z
UID:28361-1732701600-1732705200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-14/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241125T160000Z
DTEND:20241125T170000Z
DTSTAMP:20260424T105921
CREATED:20241111T170239Z
LAST-MODIFIED:20241111T170239Z
UID:28376-1732528800-1732532400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-55/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241121T220000Z
DTEND:20241121T230000Z
DTSTAMP:20260424T105921
CREATED:20241107T223543Z
LAST-MODIFIED:20241107T223543Z
UID:28367-1732204800-1732208400@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-8/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241121T150000Z
DTEND:20241121T160000Z
DTSTAMP:20260424T105921
CREATED:20241024T141538Z
LAST-MODIFIED:20241024T141538Z
UID:28265-1732179600-1732183200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-36/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241120T160000Z
DTEND:20241120T170000Z
DTSTAMP:20260424T105921
CREATED:20241030T154612Z
LAST-MODIFIED:20241030T154612Z
UID:28282-1732096800-1732100400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-26/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241118T140000Z
DTEND:20241118T150000Z
DTSTAMP:20260424T105921
CREATED:20241112T210709Z
LAST-MODIFIED:20241112T210709Z
UID:28386-1731916800-1731920400@hdpusergroup.org
SUMMARY:HDP / iNEMI Collaboration
DESCRIPTION:Discussion on areas of possible collaboration 
URL:https://hdpusergroup.org/event/hdp-inemi-collaboration/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241114T150000Z
DTEND:20241114T160000Z
DTSTAMP:20260424T105921
CREATED:20241031T144957Z
LAST-MODIFIED:20241031T144957Z
UID:28286-1731574800-1731578400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-32/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241114T010000Z
DTEND:20241114T020000Z
DTSTAMP:20260424T105921
CREATED:20241107T162147Z
LAST-MODIFIED:20241107T162147Z
UID:28365-1731524400-1731528000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-10/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241113T160000Z
DTEND:20241113T170000Z
DTSTAMP:20260424T105921
CREATED:20241023T152930Z
LAST-MODIFIED:20241023T152930Z
UID:28263-1731492000-1731495600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241111T160000Z
DTEND:20241111T170000Z
DTSTAMP:20260424T105921
CREATED:20241028T162300Z
LAST-MODIFIED:20241028T162300Z
UID:28271-1731319200-1731322800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-54/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241107T220000Z
DTEND:20241107T230000Z
DTSTAMP:20260424T105921
CREATED:20241024T221439Z
LAST-MODIFIED:20241024T221439Z
UID:28268-1730995200-1730998800@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-7/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241107T010000Z
DTEND:20241107T020000Z
DTSTAMP:20260424T105921
CREATED:20241011T020544Z
LAST-MODIFIED:20241011T020544Z
UID:28098-1730919600-1730923200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-9/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241106T210000Z
DTEND:20241106T220000Z
DTSTAMP:20260424T105921
CREATED:20241105T041251Z
LAST-MODIFIED:20241105T041251Z
UID:28355-1730905200-1730908800@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Glass /type Comparison 
URL:https://hdpusergroup.org/event/glass-type-comparison-12/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241106T160000Z
DTEND:20241106T170000Z
DTSTAMP:20260424T105921
CREATED:20241022T141511Z
LAST-MODIFIED:20241022T141511Z
UID:28262-1730887200-1730890800@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-13/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241106T150000Z
DTEND:20241106T160000Z
DTSTAMP:20260424T105921
CREATED:20241009T144914Z
LAST-MODIFIED:20241009T144914Z
UID:28089-1730883600-1730887200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-14/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241105T180000Z
DTEND:20241105T190000Z
DTSTAMP:20260424T105921
CREATED:20241010T192906Z
LAST-MODIFIED:20241010T192906Z
UID:28096-1730808000-1730811600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloys Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloys-evaluations-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241105T160000Z
DTEND:20241105T170000Z
DTSTAMP:20260424T105921
CREATED:20241001T152603Z
LAST-MODIFIED:20241001T152603Z
UID:28069-1730800800-1730804400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Status of Next Round of Testing 
URL:https://hdpusergroup.org/event/better-caf-eq-43/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241031T230000Z
DTEND:20241101T000000Z
DTSTAMP:20260424T105921
CREATED:20241003T234820Z
LAST-MODIFIED:20241003T234820Z
UID:28084-1730397600-1730401200@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Where are we on pilot runs 
URL:https://hdpusergroup.org/event/porosity-testing-3/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241031T140000Z
DTEND:20241031T150000Z
DTSTAMP:20260424T105921
CREATED:20241003T152645Z
LAST-MODIFIED:20241003T152645Z
UID:28083-1730365200-1730368800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-31/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T200000Z
DTEND:20241030T210000Z
DTSTAMP:20260424T105921
CREATED:20241002T190549Z
LAST-MODIFIED:20241002T190549Z
UID:27764-1730300400-1730304000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Hopefully had both a CAD source and PCB manufacturer onboard before the meeting or by the end of the meeting. 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-7/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T160000Z
DTEND:20241030T170000Z
DTSTAMP:20260424T105921
CREATED:20241015T152049Z
LAST-MODIFIED:20241015T152049Z
UID:28170-1730286000-1730289600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing – Phase 2
DESCRIPTION:Inner Layer Cu Balancing – Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T150000Z
DTEND:20241030T160000Z
DTSTAMP:20260424T105921
CREATED:20241002T155218Z
LAST-MODIFIED:20241002T155218Z
UID:28070-1730282400-1730286000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-25/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241028T150000Z
DTEND:20241028T160000Z
DTSTAMP:20260424T105921
CREATED:20241007T160601Z
LAST-MODIFIED:20241007T160601Z
UID:28087-1730109600-1730113200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-53/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR