BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20241219T150000Z
DTEND:20241219T160000Z
DTSTAMP:20260424T064141
CREATED:20241121T151706Z
LAST-MODIFIED:20241121T151706Z
UID:28413-1734598800-1734602400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-37/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241218T160000Z
DTEND:20241218T170000Z
DTSTAMP:20260424T064141
CREATED:20241127T162147Z
LAST-MODIFIED:20241127T162147Z
UID:28498-1734516000-1734519600@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-15/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241218T150000Z
DTEND:20241218T160000Z
DTSTAMP:20260424T064141
CREATED:20241128T163906Z
LAST-MODIFIED:20241128T163906Z
UID:28528-1734512400-1734516000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Sanmina's progress in the build 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-17/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241218T140000Z
DTEND:20241218T150000Z
DTSTAMP:20260424T064141
CREATED:20241129T181403Z
LAST-MODIFIED:20241129T181403Z
UID:28540-1734508800-1734512400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason. 
URL:https://hdpusergroup.org/event/better-caf-eq-44/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241217T190000Z
DTEND:20241217T213000Z
DTSTAMP:20260424T064141
CREATED:20241112T152019Z
LAST-MODIFIED:20241112T152019Z
UID:28381-1734440400-1734449400@hdpusergroup.org
SUMMARY:HDP Board of Directors 2024 Performance to Op Plan Review
DESCRIPTION:HDP Board of Directors  2024 Performance to Op Plan Review\n  \n  \nCall Information (the call ics is available for download at the bottom of this page) \n \nJoin meetingJoin from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m570042f99cb3190ac7dff5c5803a4d4dJoin by meeting numberMeeting number (access code): 2558 491 7294Meeting password: Perform2024Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-2024-performance-to-op-plan-review/
LOCATION:Virtual
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241216T170000Z
DTEND:20241216T180000Z
DTSTAMP:20260424T064141
CREATED:20241125T201628Z
LAST-MODIFIED:20241125T201628Z
UID:28424-1734346800-1734350400@hdpusergroup.org
SUMMARY:TCE Materials Project Kickoff
DESCRIPTION:Discuss possible new project to determine if CTE of glass in the X-Y direction plays a role in reliability. 
URL:https://hdpusergroup.org/event/tce-materials-project-kickoff/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241216T160000Z
DTEND:20241216T170000Z
DTSTAMP:20260424T064141
CREATED:20241125T164536Z
LAST-MODIFIED:20241125T164536Z
UID:28423-1734343200-1734346800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-56/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241216T150000Z
DTEND:20241216T160000Z
DTSTAMP:20260424T064141
CREATED:20241204T163147Z
LAST-MODIFIED:20241204T163147Z
UID:28557-1734339600-1734343200@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-3/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241213T000000Z
DTEND:20241213T010000Z
DTSTAMP:20260424T064141
CREATED:20241205T031624Z
LAST-MODIFIED:20241205T031624Z
UID:28289-1734026400-1734030000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Progress on Parts 1A & 1B nitirc acid testting 
URL:https://hdpusergroup.org/event/porosity-14/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241212T220000Z
DTEND:20241212T230000Z
DTSTAMP:20260424T064141
CREATED:20241121T231919Z
LAST-MODIFIED:20241121T231919Z
UID:28416-1734019200-1734022800@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-9/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241212T010000Z
DTEND:20241212T020000Z
DTSTAMP:20260424T064141
CREATED:20241114T015936Z
LAST-MODIFIED:20241114T015936Z
UID:28392-1733943600-1733947200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-11/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241211T150000Z
DTEND:20241211T160000Z
DTSTAMP:20260424T064141
CREATED:20241106T155313Z
LAST-MODIFIED:20241106T155313Z
UID:28360-1733907600-1733911200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact
DESCRIPTION:Reflow Cycle Via Reliability Impact 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241210T180000Z
DTEND:20241210T190000Z
DTSTAMP:20260424T064141
CREATED:20241118T185357Z
LAST-MODIFIED:20241118T185357Z
UID:28378-1733832000-1733835600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-11/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241206T150000Z
DTEND:20241206T160000Z
DTSTAMP:20260424T064141
CREATED:20241202T201324Z
LAST-MODIFIED:20241202T201324Z
UID:28554-1733475600-1733479200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discussion with Dr. Fan and use of Huray Model for validation 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-16/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241205T150000Z
DTEND:20241205T160000Z
DTSTAMP:20260424T064141
CREATED:20241114T153743Z
LAST-MODIFIED:20241114T153743Z
UID:28393-1733389200-1733392800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-33/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T210000Z
DTEND:20241204T220000Z
DTSTAMP:20260424T064141
CREATED:20241030T203621Z
LAST-MODIFIED:20241030T203621Z
UID:28285-1733324400-1733328000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about design\, fab\, # of samples\, material type(s) 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-8/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T170000Z
DTEND:20241204T180000Z
DTSTAMP:20260424T064141
CREATED:20241030T163629Z
LAST-MODIFIED:20241030T163629Z
UID:28283-1733310000-1733313600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing - Phase 2
DESCRIPTION:I/L Cu Balancing - Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T160000Z
DTEND:20241204T170000Z
DTSTAMP:20260424T064141
CREATED:20241113T162821Z
LAST-MODIFIED:20241113T162821Z
UID:28390-1733306400-1733310000@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241202T210000Z
DTEND:20241202T220000Z
DTSTAMP:20260424T064141
CREATED:20241202T191306Z
LAST-MODIFIED:20241202T191306Z
UID:28552-1733151600-1733155200@hdpusergroup.org
SUMMARY:meeting with Bev
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-bev/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241127T160000Z
DTEND:20241127T170000Z
DTSTAMP:20260424T064141
CREATED:20241106T161845Z
LAST-MODIFIED:20241106T161845Z
UID:28361-1732701600-1732705200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-14/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241125T160000Z
DTEND:20241125T170000Z
DTSTAMP:20260424T064141
CREATED:20241111T170239Z
LAST-MODIFIED:20241111T170239Z
UID:28376-1732528800-1732532400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-55/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241121T220000Z
DTEND:20241121T230000Z
DTSTAMP:20260424T064141
CREATED:20241107T223543Z
LAST-MODIFIED:20241107T223543Z
UID:28367-1732204800-1732208400@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-8/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241121T150000Z
DTEND:20241121T160000Z
DTSTAMP:20260424T064141
CREATED:20241024T141538Z
LAST-MODIFIED:20241024T141538Z
UID:28265-1732179600-1732183200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-36/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241120T160000Z
DTEND:20241120T170000Z
DTSTAMP:20260424T064141
CREATED:20241030T154612Z
LAST-MODIFIED:20241030T154612Z
UID:28282-1732096800-1732100400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-26/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241118T140000Z
DTEND:20241118T150000Z
DTSTAMP:20260424T064141
CREATED:20241112T210709Z
LAST-MODIFIED:20241112T210709Z
UID:28386-1731916800-1731920400@hdpusergroup.org
SUMMARY:HDP / iNEMI Collaboration
DESCRIPTION:Discussion on areas of possible collaboration 
URL:https://hdpusergroup.org/event/hdp-inemi-collaboration/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241114T150000Z
DTEND:20241114T160000Z
DTSTAMP:20260424T064141
CREATED:20241031T144957Z
LAST-MODIFIED:20241031T144957Z
UID:28286-1731574800-1731578400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-32/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241114T010000Z
DTEND:20241114T020000Z
DTSTAMP:20260424T064141
CREATED:20241107T162147Z
LAST-MODIFIED:20241107T162147Z
UID:28365-1731524400-1731528000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-10/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241113T160000Z
DTEND:20241113T170000Z
DTSTAMP:20260424T064141
CREATED:20241023T152930Z
LAST-MODIFIED:20241023T152930Z
UID:28263-1731492000-1731495600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241111T160000Z
DTEND:20241111T170000Z
DTSTAMP:20260424T064141
CREATED:20241028T162300Z
LAST-MODIFIED:20241028T162300Z
UID:28271-1731319200-1731322800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-54/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241107T220000Z
DTEND:20241107T230000Z
DTSTAMP:20260424T064141
CREATED:20241024T221439Z
LAST-MODIFIED:20241024T221439Z
UID:28268-1730995200-1730998800@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-7/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR