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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20260308T080000
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DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260901T010000Z
DTEND:20260901T020000Z
DTSTAMP:20260824T135851
CREATED:20260818T015911Z
LAST-MODIFIED:20260818T015911Z
UID:41316-1788206400-1788210000@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-5/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260901T150000Z
DTEND:20260901T160000Z
DTSTAMP:20260824T135851
CREATED:20260820T111038Z
LAST-MODIFIED:20260820T111038Z
UID:41321-1788256800-1788260400@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-20/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260901T170000Z
DTEND:20260901T180000Z
DTSTAMP:20260824T135851
CREATED:20260804T172447Z
LAST-MODIFIED:20260804T172447Z
UID:41242-1788264000-1788267600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-14/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260902T140000Z
DTEND:20260902T150000Z
DTSTAMP:20260824T135851
CREATED:20260819T143941Z
LAST-MODIFIED:20260819T143941Z
UID:41319-1788339600-1788343200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project WebEx Call
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-webex-call-2/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260902T180000Z
DTEND:20260902T190000Z
DTSTAMP:20260824T135851
CREATED:20260813T172217Z
LAST-MODIFIED:20260813T172217Z
UID:41302-1788354000-1788357600@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:with aspect ratios exceeding 30:1\, what are the limitations to plating uniformity\, throwing power and long-term reliability.  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-3/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260903T010000Z
DTEND:20260903T020000Z
DTSTAMP:20260824T135851
CREATED:20260730T011804Z
LAST-MODIFIED:20260730T011804Z
UID:41178-1788379200-1788382800@hdpusergroup.org
SUMMARY:Correlating CF Profile to SI Next Phase Project Call
DESCRIPTION:Correlating CF Profile to SI Next Phase Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-si-next-phase-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260903T160000Z
DTEND:20260903T170000Z
DTSTAMP:20260824T135851
CREATED:20260817T202407Z
LAST-MODIFIED:20260817T202407Z
UID:41261-1788433200-1788436800@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-9/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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