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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20260308T080000
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DTSTART:20261101T070000
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DTSTART:20260811T160000Z
DTEND:20260811T170000Z
DTSTAMP:20260827T053144
CREATED:20260804T164016Z
LAST-MODIFIED:20260804T164016Z
UID:41241-1786446000-1786449600@hdpusergroup.org
SUMMARY:Call with Cisco
DESCRIPTION:Call with Vy at Cisco 
URL:https://hdpusergroup.org/event/call-with-cisco/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20260811T170000Z
DTEND:20260811T180000Z
DTSTAMP:20260827T053144
CREATED:20260724T174743Z
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UID:41166-1786449600-1786453200@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-6/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260812T160000Z
DTEND:20260812T170000Z
DTSTAMP:20260827T053144
CREATED:20260715T163720Z
LAST-MODIFIED:20260715T163720Z
UID:40951-1786532400-1786536000@hdpusergroup.org
SUMMARY:TCE Materials-CTE measurement validation
DESCRIPTION:Validation of improved TM for CTE measurements. ensure consistency across the supply chain.  
URL:https://hdpusergroup.org/event/tce-materials-cte-measurement-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20260812T180000Z
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CREATED:20260715T190135Z
LAST-MODIFIED:20260715T190135Z
UID:40953-1786539600-1786543200@hdpusergroup.org
SUMMARY:high aspect ratio plating
DESCRIPTION:TV discussion.  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260813T150000Z
DTEND:20260813T160000Z
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CREATED:20260716T152418Z
LAST-MODIFIED:20260716T152418Z
UID:40986-1786615200-1786618800@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-9/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T160000Z
DTEND:20260813T170000Z
DTSTAMP:20260827T053144
CREATED:20260723T181252Z
LAST-MODIFIED:20260723T181252Z
UID:41157-1786618800-1786622400@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-4/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T180000Z
DTEND:20260813T190000Z
DTSTAMP:20260827T053144
CREATED:20260810T125647Z
LAST-MODIFIED:20260810T125647Z
UID:41276-1786626000-1786629600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build Up
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-up/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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