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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20260308T080000
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DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260804T010000Z
DTEND:20260804T020000Z
DTSTAMP:20260826T174247
CREATED:20260716T065335Z
LAST-MODIFIED:20260716T065335Z
UID:40943-1785787200-1785790800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-3/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T150000Z
DTEND:20260804T160000Z
DTSTAMP:20260826T174247
CREATED:20260722T140430Z
LAST-MODIFIED:20260722T140430Z
UID:41146-1785837600-1785841200@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-18/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260804T170000Z
DTEND:20260804T180000Z
DTSTAMP:20260826T174247
CREATED:20260724T174302Z
LAST-MODIFIED:20260724T174302Z
UID:41165-1785844800-1785848400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-13/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260805T130000Z
DTEND:20260805T140000Z
DTSTAMP:20260826T174247
CREATED:20260722T153008Z
LAST-MODIFIED:20260722T153008Z
UID:41151-1785916800-1785920400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-49/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T140000Z
DTEND:20260805T150000Z
DTSTAMP:20260826T174247
CREATED:20260716T143920Z
LAST-MODIFIED:20260716T143920Z
UID:40984-1785920400-1785924000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-11/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T150000Z
DTEND:20260805T160000Z
DTSTAMP:20260826T174247
CREATED:20260722T151527Z
LAST-MODIFIED:20260722T151527Z
UID:41148-1785924000-1785927600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-25/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T140000Z
DTEND:20260806T150000Z
DTSTAMP:20260826T174247
CREATED:20260728T184406Z
LAST-MODIFIED:20260728T184406Z
UID:40950-1786006800-1786010400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-20/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T160000Z
DTEND:20260806T170000Z
DTSTAMP:20260826T174247
CREATED:20260714T170302Z
LAST-MODIFIED:20260714T170302Z
UID:40890-1786014000-1786017600@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T180000Z
DTEND:20260806T190000Z
DTSTAMP:20260826T174247
CREATED:20260723T153733Z
LAST-MODIFIED:20260723T153733Z
UID:41156-1786021200-1786024800@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T210000Z
DTEND:20260806T220000Z
DTSTAMP:20260826T174247
CREATED:20260724T070752Z
LAST-MODIFIED:20260724T070752Z
UID:41164-1786032000-1786035600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-40/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260807T010000Z
DTEND:20260807T020000Z
DTSTAMP:20260826T174247
CREATED:20260717T013458Z
LAST-MODIFIED:20260717T013458Z
UID:41000-1786046400-1786050000@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Expand on method developed in Phase 1 with nickel free finishes for phase 2. 
URL:https://hdpusergroup.org/event/porosity-testing-2-3/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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