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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260714T160000Z
DTEND:20260714T170000Z
DTSTAMP:20260806T060023
CREATED:20260625T161552Z
LAST-MODIFIED:20260625T161552Z
UID:40790-1784026800-1784030400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T010000Z
DTEND:20260715T020000Z
DTSTAMP:20260806T060023
CREATED:20260701T021722Z
LAST-MODIFIED:20260701T021722Z
UID:40804-1784059200-1784062800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-2/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T140000Z
DTEND:20260715T150000Z
DTSTAMP:20260806T060023
CREATED:20260616T145459Z
LAST-MODIFIED:20260616T145459Z
UID:40747-1784106000-1784109600@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-19/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260715T160000Z
DTEND:20260715T170000Z
DTSTAMP:20260806T060023
CREATED:20260701T170102Z
LAST-MODIFIED:20260701T170102Z
UID:40807-1784113200-1784116800@hdpusergroup.org
SUMMARY:TCE Materials
DESCRIPTION:Calibration and validation of CTE test method update 
URL:https://hdpusergroup.org/event/tce-materials-6/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T180000Z
DTEND:20260715T190000Z
DTSTAMP:20260806T060023
CREATED:20260618T161958Z
LAST-MODIFIED:20260618T161958Z
UID:40764-1784120400-1784124000@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:Discuss new project for test vehicle design to test several diamter holes sizes and aspect ratios  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits/
CATEGORIES:High Aspect Ratio Plating Limits
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T180000Z
DTEND:20260715T190000Z
DTSTAMP:20260806T060023
CREATED:20260702T141211Z
LAST-MODIFIED:20260702T141211Z
UID:40818-1784120400-1784124000@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:Discuss TV for evaluation 
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-2/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T140000Z
DTEND:20260716T150000Z
DTSTAMP:20260806T060023
CREATED:20260625T224759Z
LAST-MODIFIED:20260625T224759Z
UID:40793-1784192400-1784196000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-10/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T150000Z
DTEND:20260716T160000Z
DTSTAMP:20260806T060023
CREATED:20260618T152549Z
LAST-MODIFIED:20260618T152549Z
UID:40763-1784196000-1784199600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-8/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T160000Z
DTEND:20260716T170000Z
DTSTAMP:20260806T060023
CREATED:20260707T110030Z
LAST-MODIFIED:20260707T110030Z
UID:40798-1784199600-1784203200@hdpusergroup.org
SUMMARY:Non-Glass Microvia
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260717T010000Z
DTEND:20260717T020000Z
DTSTAMP:20260806T060023
CREATED:20260715T030404Z
LAST-MODIFIED:20260715T030404Z
UID:40945-1784232000-1784235600@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Building on the procedure developed in phase 1 and will apply to a ndw set of solderable finishes. 
URL:https://hdpusergroup.org/event/porosity-testing-2-2/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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