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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20260308T080000
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DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260615T150000Z
DTEND:20260615T160000Z
DTSTAMP:20260528T144138
CREATED:20260518T160059Z
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UID:40333-1781517600-1781521200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-7/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20260616T140000Z
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UID:40370-1781600400-1781604000@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-18/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260616T170000Z
DTEND:20260616T180000Z
DTSTAMP:20260528T144138
CREATED:20260521T181753Z
LAST-MODIFIED:20260521T181753Z
UID:40344-1781611200-1781614800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-3/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20260617T020000Z
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CREATED:20260518T142226Z
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UID:40331-1781643600-1781647200@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Kick-off Meeting
DESCRIPTION:Large Component PWB Warpage Project Kick-off Meeting 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-kick-off-meeting/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20260617T140000Z
DTEND:20260617T150000Z
DTSTAMP:20260528T144138
CREATED:20260521T142526Z
LAST-MODIFIED:20260521T142526Z
UID:40340-1781686800-1781690400@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-16/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T150000Z
DTEND:20260617T160000Z
DTSTAMP:20260528T144138
CREATED:20260513T155344Z
LAST-MODIFIED:20260513T155344Z
UID:40226-1781690400-1781694000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Ca
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-ca/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T200000Z
DTEND:20260617T210000Z
DTSTAMP:20260528T144138
CREATED:20260528T183951Z
LAST-MODIFIED:20260528T183951Z
UID:40378-1781708400-1781712000@hdpusergroup.org
SUMMARY:Copper Outer Layer Trace Adhesion
DESCRIPTION:Copper out trace adhesion method  
URL:https://hdpusergroup.org/event/copper-outer-layer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260618T150000Z
DTEND:20260618T160000Z
DTSTAMP:20260528T144138
CREATED:20260514T153041Z
LAST-MODIFIED:20260514T153041Z
UID:40267-1781776800-1781780400@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-7/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260618T210000Z
DTEND:20260618T220000Z
DTSTAMP:20260528T144138
CREATED:20260521T223449Z
LAST-MODIFIED:20260521T223449Z
UID:40346-1781798400-1781802000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-37/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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