BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260331T150000Z
DTEND:20260331T160000Z
DTSTAMP:20260412T213308
CREATED:20260225T153728Z
LAST-MODIFIED:20260225T153728Z
UID:39389-1774951200-1774954800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-44/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260331T190000Z
DTEND:20260331T200000Z
DTSTAMP:20260412T213308
CREATED:20260317T115257Z
LAST-MODIFIED:20260317T115257Z
UID:39624-1774965600-1774969200@hdpusergroup.org
SUMMARY:Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability
DESCRIPTION:Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability \n  
URL:https://hdpusergroup.org/event/project-kickoff-call-effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260401T150000Z
DTEND:20260401T160000Z
DTSTAMP:20260412T213308
CREATED:20260219T165127Z
LAST-MODIFIED:20260219T165127Z
UID:39300-1775037600-1775041200@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-7/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260401T200000Z
DTEND:20260401T210000Z
DTSTAMP:20260412T213308
CREATED:20260325T183213Z
LAST-MODIFIED:20260325T183213Z
UID:39802-1775055600-1775059200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-26/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T010000Z
DTEND:20260402T020000Z
DTSTAMP:20260412T213308
CREATED:20260312T141225Z
LAST-MODIFIED:20260312T141225Z
UID:39578-1775073600-1775077200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-33/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T010000Z
DTEND:20260402T020000Z
DTSTAMP:20260412T213308
CREATED:20260312T142246Z
LAST-MODIFIED:20260312T142246Z
UID:39579-1775073600-1775077200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-34/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T150000Z
DTEND:20260402T160000Z
DTSTAMP:20260412T213308
CREATED:20260312T155225Z
LAST-MODIFIED:20260312T155225Z
UID:39586-1775124000-1775127600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-4/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260402T210000Z
DTEND:20260402T220000Z
DTSTAMP:20260412T213308
CREATED:20260323T155600Z
LAST-MODIFIED:20260323T155600Z
UID:39394-1775145600-1775149200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:*Due to an urgent matter involving the leader (Rich DePoto)\, the schedule has been changed to March 26–April 2.
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-33/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260403T000000Z
DTEND:20260403T010000Z
DTSTAMP:20260412T213308
CREATED:20260327T001103Z
LAST-MODIFIED:20260327T001103Z
UID:39808-1775156400-1775160000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Any last minute changes to BoD application for Phase 2 \nNext final report draft 
URL:https://hdpusergroup.org/event/porosity-31/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR