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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
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BEGIN:VEVENT
DTSTART:20251013T150000Z
DTEND:20251013T160000Z
DTSTAMP:20260417T135928
CREATED:20250929T160402Z
LAST-MODIFIED:20250929T160402Z
UID:37393-1760349600-1760353200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-72/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251014T150000Z
DTEND:20251014T160000Z
DTSTAMP:20260417T135928
CREATED:20251008T144034Z
LAST-MODIFIED:20251008T144034Z
UID:37621-1760436000-1760439600@hdpusergroup.org
SUMMARY:Microvia Electrical Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-characterization-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251015T150000Z
DTEND:20251015T160000Z
DTSTAMP:20260417T135928
CREATED:20251015T145937Z
LAST-MODIFIED:20251015T145937Z
UID:37297-1760522400-1760526000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:This project seeks to develop a CAD translator utility for members that will provide analysis of local copper distribution to identify risk areas for: Core deformation and backdrill stub variation; Surface Topography variations; Glass Stop (local areas). It may also provide additional validation of the coplanarity and core deformation mitigation by using sub-lam sequence and stackup optimization. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251015T160000Z
DTEND:20251015T170000Z
DTSTAMP:20260417T135928
CREATED:20250925T161851Z
LAST-MODIFIED:20250925T161851Z
UID:37378-1760526000-1760529600@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call-3/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T010000Z
DTEND:20251016T020000Z
DTSTAMP:20260417T135928
CREATED:20250918T012735Z
LAST-MODIFIED:20250918T012735Z
UID:37353-1760558400-1760562000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-26/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T140000Z
DTEND:20251016T150000Z
DTSTAMP:20260417T135928
CREATED:20250924T143411Z
LAST-MODIFIED:20250924T143411Z
UID:37371-1760605200-1760608800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Hopefully finalize fall meeeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-51/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T150000Z
DTEND:20251016T160000Z
DTSTAMP:20260417T135928
CREATED:20250924T153519Z
LAST-MODIFIED:20250924T153519Z
UID:37372-1760608800-1760612400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-3/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T160000Z
DTEND:20251016T170000Z
DTSTAMP:20260417T135928
CREATED:20251002T200522Z
LAST-MODIFIED:20251002T200522Z
UID:37576-1760612400-1760616000@hdpusergroup.org
SUMMARY:TCE Materials-CTE Method validation
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. System developments in packaging are driving the size of packages to grow\, and I/O pitches to become finer. Both of these factors are impacting the reliability of products\, as more x-y stress is being placed on the solder joints. \nThe industry lacks a validated universal test method designed to measure CTE \nMaterials suppliers and OEMs rely on their own internal testing methodologies with no standard method. \nThis project will develop a standard test method through a validation process to measure CTE in the Z and X-Y axes. \n  
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR