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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
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BEGIN:VEVENT
DTSTART:20250929T150000Z
DTEND:20250929T160000Z
DTSTAMP:20260417T202258
CREATED:20250908T160708Z
LAST-MODIFIED:20250908T160708Z
UID:37169-1759140000-1759143600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-71/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250930T150000Z
DTEND:20250930T160000Z
DTSTAMP:20260417T202258
CREATED:20250912T174346Z
LAST-MODIFIED:20250912T174346Z
UID:37342-1759226400-1759230000@hdpusergroup.org
SUMMARY:Microvia Electrical Performance Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance-characterization/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T034500Z
DTEND:20251001T044500Z
DTSTAMP:20260417T202258
CREATED:20250930T142720Z
LAST-MODIFIED:20250930T142720Z
UID:37459-1759272300-1759275900@hdpusergroup.org
SUMMARY:Final Confirmation from Dan
DESCRIPTION:Need confirmation from Dan that these settings work. 
URL:https://hdpusergroup.org/event/final-confirmation-from-dan/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T140000Z
DTEND:20251001T150000Z
DTSTAMP:20260417T202258
CREATED:20250909T143916Z
LAST-MODIFIED:20250909T143916Z
UID:37245-1759309200-1759312800@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop test vehicle and test method for effectively measuring simulated environmental corrosion on assembled boards during shipment. 
URL:https://hdpusergroup.org/event/ecm-4-12/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251001T150000Z
DTEND:20251001T160000Z
DTSTAMP:20260417T202258
CREATED:20250904T174357Z
LAST-MODIFIED:20250904T174357Z
UID:37151-1759312800-1759316400@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-16/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260417T202258
CREATED:20250910T153008Z
LAST-MODIFIED:20250910T153008Z
UID:37287-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing Project meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260417T202258
CREATED:20251002T150606Z
LAST-MODIFIED:20251002T150606Z
UID:37566-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing Project
DESCRIPTION:Evaluate how typical D-Coupon\, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T150000Z
DTEND:20251002T160000Z
DTSTAMP:20260417T202258
CREATED:20250918T160223Z
LAST-MODIFIED:20250918T160223Z
UID:37355-1759399200-1759402800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-3/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251002T160000Z
DTEND:20251002T170000Z
DTSTAMP:20260417T202258
CREATED:20250918T163932Z
LAST-MODIFIED:20250918T163932Z
UID:37356-1759402800-1759406400@hdpusergroup.org
SUMMARY:TCE Materials-CTE method validation
DESCRIPTION:Finalize test plan and shipment addresses 
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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