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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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DTSTART:20251102T070000
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BEGIN:VEVENT
DTSTART:20250916T170000Z
DTEND:20250916T180000Z
DTSTAMP:20260417T232452
CREATED:20250905T130039Z
LAST-MODIFIED:20250905T130039Z
UID:37154-1758024000-1758027600@hdpusergroup.org
SUMMARY:Proposed HDP Cleaning Project
DESCRIPTION:Component sizes are climbing – 90 x 100\, 100 x 100\, even 165 x 165 mm2.  Current no-clean flux chemistries may not meet the requirements of all OEMs/customers. How is our industry going to deal with this?  In some instances\, cleaner raw materials for fluxes\, etc. will be sufficient\, but not in others. That inevitably leaves companies with the task of cleaning. What chemistries\, equipment and process parameters are required to clean under a 100 x 100 mm2 component with\, for example\, a 0.4 mm pitch and minimal standoff?  \nDo we have custom-made glass components (expensive) manufactured\, use traditional dummy components\, use FR4 “sandwiches”\, or transparent plastic held on with glue only? The latter begs the question; do we go for BGA/CSP or QFN/LGA standoffs? Traditional aqueous\, semi-aqueous\, solvent-based and/or something like super critical fluid cleaning?   The project will NOT compare chemistries or equipment types to determine which is “best”.  The team will strive to develop a focused plan that can be executed by team member companies in a reasonable time period. \nIf interested\, please join a Webex meeting where the possibility of an HDPUG-lead project will be discussed. All in the electronics industry are invited to participate for at least the planning portion of the project.   \n  
URL:https://hdpusergroup.org/event/proposed-hdp-cleaning-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250917T230000Z
DTEND:20250918T000000Z
DTSTAMP:20260417T232452
CREATED:20250827T233032Z
LAST-MODIFIED:20250827T233032Z
UID:37036-1758132000-1758135600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Combining GCE and JPC results 
URL:https://hdpusergroup.org/event/porosity-25/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T010000Z
DTEND:20250918T020000Z
DTSTAMP:20260417T232452
CREATED:20250904T012421Z
LAST-MODIFIED:20250904T012421Z
UID:37148-1758139200-1758142800@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-25/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T130000Z
DTEND:20250918T140000Z
DTSTAMP:20260417T232452
CREATED:20250909T162757Z
LAST-MODIFIED:20250909T162757Z
UID:37246-1758182400-1758186000@hdpusergroup.org
SUMMARY:Introductory Call with Circuit Foil
DESCRIPTION:Introductory Call with Circuitfoil  
URL:https://hdpusergroup.org/event/introductory-call-with-circuit-foil/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T150000Z
DTEND:20250918T160000Z
DTSTAMP:20260417T232452
CREATED:20250828T160223Z
LAST-MODIFIED:20250828T160223Z
UID:37064-1758189600-1758193200@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-2/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T160000Z
DTEND:20250918T170000Z
DTSTAMP:20260417T232452
CREATED:20250908T192332Z
LAST-MODIFIED:20250908T192332Z
UID:37180-1758193200-1758196800@hdpusergroup.org
SUMMARY:TCE Materials Test Method Validation x-y
DESCRIPTION:TCE x-y CTE method validation 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation-x-y/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250918T200000Z
DTEND:20250918T210000Z
DTSTAMP:20260417T232452
CREATED:20250901T124112Z
LAST-MODIFIED:20250901T124112Z
UID:37120-1758207600-1758211200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-17/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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