BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250908T150000Z
DTEND:20250908T160000Z
DTSTAMP:20260417T232327
CREATED:20250818T160513Z
LAST-MODIFIED:20250818T160513Z
UID:36739-1757325600-1757329200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-70/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250909T140000Z
DTEND:20250909T150000Z
DTSTAMP:20260417T232327
CREATED:20250904T144640Z
LAST-MODIFIED:20250904T144640Z
UID:36886-1757408400-1757412000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Develop a test method which can measure the propensity of poor soldermask coverage to corrosion. 
URL:https://hdpusergroup.org/event/ecm-4-11/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250909T150000Z
DTEND:20250909T160000Z
DTSTAMP:20260417T232327
CREATED:20250814T143604Z
LAST-MODIFIED:20250814T143604Z
UID:36684-1757412000-1757415600@hdpusergroup.org
SUMMARY:Stacked Vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-8/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T140000Z
DTEND:20250910T150000Z
DTSTAMP:20260417T232327
CREATED:20250821T134501Z
LAST-MODIFIED:20250821T134501Z
UID:36873-1757494800-1757498400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing - Standard test method vs Actual PCBA reflow profiles 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T150000Z
DTEND:20250910T160000Z
DTSTAMP:20260417T232327
CREATED:20250820T155309Z
LAST-MODIFIED:20250820T155309Z
UID:36834-1757498400-1757502000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Update in build 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-11/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250910T160000Z
DTEND:20250910T170000Z
DTSTAMP:20260417T232327
CREATED:20250826T171636Z
LAST-MODIFIED:20250826T171636Z
UID:36311-1757502000-1757505600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation\, surface topography variation\, and local areas of glass stop. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250911T140000Z
DTEND:20250911T150000Z
DTSTAMP:20260417T232327
CREATED:20250827T162132Z
LAST-MODIFIED:20250827T162132Z
UID:37026-1757581200-1757584800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-37/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR