BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250902T070000Z
DTEND:20250902T080000Z
DTSTAMP:20260417T232122
CREATED:20250830T044719Z
LAST-MODIFIED:20250830T044719Z
UID:37115-1756778400-1756782000@hdpusergroup.org
SUMMARY:HDP Call with ASKPCB
DESCRIPTION:Call with ASKPCB 
URL:https://hdpusergroup.org/event/hdp-call-with-askpcb/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T150000Z
DTEND:20250902T160000Z
DTSTAMP:20260417T232122
CREATED:20250811T120717Z
LAST-MODIFIED:20250811T120717Z
UID:36553-1756807200-1756810800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250902T170000Z
DTEND:20250902T180000Z
DTSTAMP:20260417T232122
CREATED:20250806T170657Z
LAST-MODIFIED:20250806T170657Z
UID:36464-1756814400-1756818000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation Projects
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-projects/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T140000Z
DTEND:20250903T150000Z
DTSTAMP:20260417T232122
CREATED:20250813T150543Z
LAST-MODIFIED:20250813T150543Z
UID:36646-1756890000-1756893600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Thin Dielectric Skew Project Kickoff 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T150000Z
DTEND:20250903T160000Z
DTSTAMP:20260417T232122
CREATED:20250820T164134Z
LAST-MODIFIED:20250820T164134Z
UID:36836-1756893600-1756897200@hdpusergroup.org
SUMMARY:Pb Free Materials 7  Project Call
DESCRIPTION:Pb Free Materials 7  Project call 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250903T160000Z
DTEND:20250903T170000Z
DTSTAMP:20260417T232122
CREATED:20250820T164504Z
LAST-MODIFIED:20250820T164504Z
UID:36837-1756897200-1756900800@hdpusergroup.org
SUMMARY:Sequential Lamination Project Call
DESCRIPTION:Sequential Lamination Project Call 
URL:https://hdpusergroup.org/event/sequential-lamination-project-call/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T010000Z
DTEND:20250904T020000Z
DTSTAMP:20260417T232122
CREATED:20250821T011708Z
LAST-MODIFIED:20250821T011708Z
UID:36865-1756929600-1756933200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-24/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T140000Z
DTEND:20250904T150000Z
DTSTAMP:20260417T232122
CREATED:20250821T141943Z
LAST-MODIFIED:20250821T141943Z
UID:36876-1756976400-1756980000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-3/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T150000Z
DTEND:20250904T160000Z
DTSTAMP:20260417T232122
CREATED:20250821T161200Z
LAST-MODIFIED:20250821T161200Z
UID:36888-1756980000-1756983600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250904T160000Z
DTEND:20250904T170000Z
DTSTAMP:20260417T232122
CREATED:20250814T165214Z
LAST-MODIFIED:20250814T165214Z
UID:36696-1756983600-1756987200@hdpusergroup.org
SUMMARY:TCE Materials x-Y test method validation
DESCRIPTION:Review test parameters. \nfinalize particpants \nRequest implementation 
URL:https://hdpusergroup.org/event/tce-materials-x-y-test-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR