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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20250812T150000Z
DTEND:20250812T160000Z
DTSTAMP:20260418T010133
CREATED:20250722T171025Z
LAST-MODIFIED:20250722T171025Z
UID:36327-1754992800-1754996400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250812T160000Z
DTEND:20250812T170000Z
DTSTAMP:20260418T010133
CREATED:20250805T192328Z
LAST-MODIFIED:20250805T192328Z
UID:36306-1754996400-1755000000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-35/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250813T140000Z
DTEND:20250813T150000Z
DTSTAMP:20260418T010133
CREATED:20250730T155831Z
LAST-MODIFIED:20250730T155831Z
UID:36359-1755075600-1755079200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:New HDP project investigating the impact of thin dielectrics on electric skew 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250813T200000Z
DTEND:20250813T210000Z
DTSTAMP:20260418T010133
CREATED:20250723T130351Z
LAST-MODIFIED:20250723T130351Z
UID:36329-1755097200-1755100800@hdpusergroup.org
SUMMARY:Cu Trace Adhesion
DESCRIPTION:Up date on build 
URL:https://hdpusergroup.org/event/cu-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T000000Z
DTEND:20250814T010000Z
DTSTAMP:20260418T010133
CREATED:20250724T003418Z
LAST-MODIFIED:20250724T003418Z
UID:36335-1755111600-1755115200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-6/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T160000Z
DTEND:20250814T170000Z
DTSTAMP:20260418T010133
CREATED:20250731T162634Z
LAST-MODIFIED:20250731T162634Z
UID:36372-1755169200-1755172800@hdpusergroup.org
SUMMARY:TCE Materials -test method validation
DESCRIPTION:Validating CTE measurements. Continued defining the test plan. 
URL:https://hdpusergroup.org/event/tce-materials-test-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250814T170000Z
DTEND:20250814T180000Z
DTSTAMP:20260418T010133
CREATED:20250804T215448Z
LAST-MODIFIED:20250804T215448Z
UID:36356-1755172800-1755176400@hdpusergroup.org
SUMMARY:Kick off Meeting for PCB Flatness at Large Package Attach Locations
DESCRIPTION:Kick off Meeting for PCB Flatness at Large Package Attach Locations 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-pcb-flatness-at-large-package-attach-locations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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