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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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DTSTART:20250309T080000
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DTSTART:20251102T070000
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BEGIN:VEVENT
DTSTART:20250729T150000Z
DTEND:20250729T160000Z
DTSTAMP:20260417T215026
CREATED:20250715T151604Z
LAST-MODIFIED:20250715T151604Z
UID:36275-1753783200-1753786800@hdpusergroup.org
SUMMARY:Microvia Electrical Performance
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-performance/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T150000Z
DTEND:20250730T160000Z
DTSTAMP:20260417T215026
CREATED:20250627T200914Z
LAST-MODIFIED:20250627T200914Z
UID:36217-1753869600-1753873200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics\, and how much electrical skew can be mitigated by changing the orientation / alignment of traces with the glass weave bundles that reinforce most laminate materials. 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250730T230000Z
DTEND:20250731T000000Z
DTSTAMP:20260417T215026
CREATED:20250724T162924Z
LAST-MODIFIED:20250724T162924Z
UID:36345-1753898400-1753902000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Project progress 
URL:https://hdpusergroup.org/event/porosity-23/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T010000Z
DTEND:20250731T020000Z
DTSTAMP:20260417T215026
CREATED:20250717T010744Z
LAST-MODIFIED:20250717T010744Z
UID:36303-1753905600-1753909200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-22/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T130000Z
DTEND:20250731T140000Z
DTSTAMP:20260417T215026
CREATED:20250730T223025Z
LAST-MODIFIED:20250730T223025Z
UID:36259-1753948800-1753952400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project to measure and compare sensitivity of each test method to preconditioning/assembly reflow profile difference(s) that significantly impact long term reliability. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250731T160000Z
DTEND:20250731T170000Z
DTSTAMP:20260417T215026
CREATED:20250720T160847Z
LAST-MODIFIED:20250720T160847Z
UID:36318-1753959600-1753963200@hdpusergroup.org
SUMMARY:TCE Materials-TM validation
DESCRIPTION:Finalize test plan to validate TM for CTE measurements 
URL:https://hdpusergroup.org/event/tce-materials-tm-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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