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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20250309T080000
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DTSTART:20251102T070000
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BEGIN:VEVENT
DTSTART:20250715T150000Z
DTEND:20250715T160000Z
DTSTAMP:20260418T043348
CREATED:20250701T121727Z
LAST-MODIFIED:20250701T121727Z
UID:36225-1752573600-1752577200@hdpusergroup.org
SUMMARY:Microvia Electrical Characterization
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/microvia-electrical-characterization/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250716T140000Z
DTEND:20250716T150000Z
DTSTAMP:20260418T043348
CREATED:20250626T143334Z
LAST-MODIFIED:20250626T143334Z
UID:36187-1752656400-1752660000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Electrochemical Migration Testing Phase 4 
URL:https://hdpusergroup.org/event/ecm-4-8/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250716T150000Z
DTEND:20250716T160000Z
DTSTAMP:20260418T043348
CREATED:20250609T203551Z
LAST-MODIFIED:20250609T203551Z
UID:34339-1752660000-1752663600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Build progress 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-9/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T010000Z
DTEND:20250717T020000Z
DTSTAMP:20260418T043348
CREATED:20250626T012530Z
LAST-MODIFIED:20250626T012530Z
UID:36184-1752696000-1752699600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-21/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T130000Z
DTEND:20250717T220000Z
DTSTAMP:20260418T043348
CREATED:20250717T154048Z
LAST-MODIFIED:20250717T154048Z
UID:36310-1752739200-1752771600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation\, surface topography variation\, and local areas of glass stop. 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T140000Z
DTEND:20250717T150000Z
DTSTAMP:20260418T043348
CREATED:20250619T190932Z
LAST-MODIFIED:20250619T190932Z
UID:36124-1752742800-1752746400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-34/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T150000Z
DTEND:20250717T160000Z
DTSTAMP:20260418T043348
CREATED:20250626T144726Z
LAST-MODIFIED:20250626T144726Z
UID:36188-1752746400-1752750000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Phase 2
DESCRIPTION:Inner Layer Copper Balancing Phase 2 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250717T210000Z
DTEND:20250717T220000Z
DTSTAMP:20260418T043348
CREATED:20250626T214353Z
LAST-MODIFIED:20250626T214353Z
UID:36196-1752768000-1752771600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-20/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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